JPH0280565A - Magnet for magnetron sputtering - Google Patents

Abstract

PURPOSE:To reduce ununiformity in consumption of a target and to increase the efficiency of utilization of the target by fitting a magnet composed of two or more pairs of N and S poles arranged concentrically in a multiple state to the target in a magnetron sputtering device. CONSTITUTION:A magnet M composed of at least two pairs of N and S poles, e.g., N, S, N and S poles 1, 2, 1, 2 having diameters increased concentrically and gradually from the central part is fitted to the rear side of a target 4 in a magnetron sputtering device. Since a multiple ring of plasma can be formed on the front side of the target 4, ununiformity in consumption of the target 4 by sputtering is reduced, the efficiency of utilization of the target is increased and the target can be used for a long time.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in magnets for magnetron sputtering.

(Prior art and its problems) A conventional magnet for magnetron sputtering is provided with a pair of N-pole ring 1 and S-pole ring 2 as shown in FIG. As shown, there was a single area where the magnetic field and the electric field were perpendicular to each other, and plasma 3 was generated only in that area. For this reason, as shown in FIG. 9, the target 4 attached to the magnet M is unevenly worn out due to sputtering, resulting in low usage efficiency and short life of the target 4.

(Objective of the Invention) The present invention has been made to solve the above-mentioned problems, and it is possible to increase the number and area of plasma rings that contribute to sputtering, reduce uneven consumption of the target, and improve target usage efficiency. The purpose of this invention is to provide a magnet for magnetron sputtering that can be used.

(Means for Solving the Problems) A magnet for magnetron sputtering according to the present invention for solving the above problems is characterized by having two or more pairs of north poles and south poles concentrically multiplexed.

(Function) According to the magnetron sputtering magnet configured as described above, multiple rings of plasma can be generated on the surface of the target, and therefore uneven wear of the target due to sputtering is reduced.

(Example) An example of the magnet for magnetron sputtering of the present invention will be described with reference to FIGS. 70mm, outer diameter 80mm S-pole ring 2, inner diameter 100mm, outer diameter 110mm N-pole ring 1, inner diameter 13
S pole rings 2 having a diameter of 0 mm and an outer diameter of 140 mm are arranged concentrically.

A target 4 made of Cu (with a diameter of 6 inches and a thickness of 5 mm) was attached to this magnet M for magnetron sputtering as shown in Fig. 2, and when magnetron sputtering was performed, a double ring of plasma was generated on the surface of the target 4. However, the surface of the target 4 was worn out as shown in FIG. 3, and the uneven wear was reduced.

Next, another embodiment will be explained with reference to FIGS. 4a and 4b. A magnet M' with a thickness of 20 mm has a cylindrical N pole 1/with a diameter of 5 mm, an S pole ring 2 with an inner diameter of 15 mm, and an outer diameter of 20 mm.
, N-pole ring 1 with an inner diameter of 25ffllB and an outer diameter of 30 mm,
S-pole rings 2 having an inner diameter of 35 mm and an outer diameter of 40 mm are arranged concentrically.

This magnetron pack magnet M' has a fifth
As shown in the figure, when a target 4 made of Au with a diameter of 2 inches and a thickness of 1 mm was attached and magnetron sputtering was performed, double rings of plasma were generated on the surface of the target 4, and the surface of the target 4 was as shown in Figure 6. As shown in the figure, the wear was reduced and the uneven wear was reduced.

Note that each of the above embodiments uses a magnet with two pairs of N and S poles.
In the case of M, three or more pairs of N and S poles may be provided to generate three or more plasma rings on the surface of the target during sputtering. In this way, uneven wear on the surface of the target is further reduced, and the target is worn out almost evenly.

Further, in the above embodiment, a gap is provided between the north pole and the south pole, but a non-magnetic material may be sandwiched between the north pole and the south pole.

(Effects of the Invention) As can be seen from the above explanation, the magnet for magnetron sputtering of the present invention is equipped with two or more concentrically multiple pairs of N and S poles, so multiple rings of plasma are generated on the surface of the target during sputtering. Therefore, it is possible to reduce the uneven wear of the target due to sputtering, improve the usage efficiency of the target, and extend the life of the target.

[Brief explanation of the drawing]

Figures 1a and b are a plan view and a vertical sectional view of an embodiment of the magnetron sputtering magnet of the present invention, Figure 2 is a vertical sectional view showing a state in which a target is attached to the magnet, and Figure 3 is a sputtering method. FIG. 2 is a longitudinal cross-sectional view showing the state of wear of the target, FIGS. FIG. 6 is a vertical cross-sectional view showing the state of the target in FIG. 5 being worn out by sputtering;
Figure 7 aSb is a plan view and a vertical cross-sectional view of a conventional magnetron sputtering magnet, Figure 8 is a diagram showing the state of plasma generation during sputtering, and Figure 9 is a sputtering diagram of a target attached to the magnet shown in Figure 7. FIG. Applicant: Tanaka Kikinzoku Kogyo Co., Ltd. Figure (a) Figure (a) Figure 6 Prefectural Map ((1) Figure (b)

Claims (1)

[Claims] 1. In magnetron sputtering magnets, N
A magnet for magnetron sputtering, characterized by having two or more concentrically multiple pairs of poles and south poles.