JPH0281044U - - Google Patents
Info
- Publication number
- JPH0281044U JPH0281044U JP16158988U JP16158988U JPH0281044U JP H0281044 U JPH0281044 U JP H0281044U JP 16158988 U JP16158988 U JP 16158988U JP 16158988 U JP16158988 U JP 16158988U JP H0281044 U JPH0281044 U JP H0281044U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor element
- hybrid integrated
- circuit device
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図ａ，ｂはこの考案の一実施例を示す混成
集積回路装置の要部の断面図およびＡ―Ａ線によ
る断面図、第２図は従来の混成集積回路装置の要
部の斜視図である。
図において、１は半導体素子、２は金属細線、
３は銅プレート、４はブリツジ、５は厚膜回路基
板、６はセラミツク板である。なお、各図中の同
一符号は同一または相当部分を示す。
Figures 1a and b are a cross-sectional view of the main parts of a hybrid integrated circuit device showing an embodiment of this invention, and a cross-sectional view taken along line A-A, and Figure 2 is a perspective view of the main parts of a conventional hybrid integrated circuit device. It is. In the figure, 1 is a semiconductor element, 2 is a thin metal wire,
3 is a copper plate, 4 is a bridge, 5 is a thick film circuit board, and 6 is a ceramic board. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
放熱用の銅プレートと、前記半導体素子のアース
電極を電気的に接続するための金属製のブリツジ
とをセラミツク板を介在して接合したことを特徴
とする混成集積回路装置。 A feature is that a copper plate for heat dissipation of a semiconductor element mounted on a hybrid integrated circuit board and a metal bridge for electrically connecting a ground electrode of the semiconductor element are joined with a ceramic plate interposed therebetween. Hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16158988U JPH0281044U (en) | 1988-12-12 | 1988-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16158988U JPH0281044U (en) | 1988-12-12 | 1988-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281044U true JPH0281044U (en) | 1990-06-22 |
Family
ID=31444662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16158988U Pending JPH0281044U (en) | 1988-12-12 | 1988-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281044U (en) |
-
1988
- 1988-12-12 JP JP16158988U patent/JPH0281044U/ja active Pending