JPH0281048U - - Google Patents
Info
- Publication number
- JPH0281048U JPH0281048U JP16056488U JP16056488U JPH0281048U JP H0281048 U JPH0281048 U JP H0281048U JP 16056488 U JP16056488 U JP 16056488U JP 16056488 U JP16056488 U JP 16056488U JP H0281048 U JPH0281048 U JP H0281048U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- capacity semiconductor
- semiconductor elements
- wiring board
- sink plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000010292 electrical insulation Methods 0.000 claims 1
- 230000020169 heat generation Effects 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
Description
第１図は、半導体素子を実装した、本考案の一
実施例を示す正面図である。第２図は、第１図の
実施例の右側面（断面）図である。第３図は従来
の半導体実装用基板の例を示す正面図である。第
４図は、第３図の従来例の右側面（断面）図であ
る。
１……大容量半導体素子、１ａ……大容量半導
体素子の端子、２……プリント配線基板、３……
ヒートシンク板、４，８……絶縁シート、５……
絶縁ベーク板、６，７……ねじ、９……カラー。
FIG. 1 is a front view showing an embodiment of the present invention in which a semiconductor element is mounted. FIG. 2 is a right side (cross-sectional) view of the embodiment of FIG. FIG. 3 is a front view showing an example of a conventional semiconductor mounting board. FIG. 4 is a right side (cross-sectional) view of the conventional example shown in FIG. 1... Large capacity semiconductor element, 1a... Terminal of large capacity semiconductor element, 2... Printed wiring board, 3...
Heat sink plate, 4, 8... Insulation sheet, 5...
Insulated bake plate, 6, 7...screw, 9...color.
Claims (1)
るプリント配線基板において、大容量半導体素子
の内部発熱を、放散するためのヒートシンク板と
、前記ヒートシンク板に取り付けられるべき複数
個の大容量半導体素子と前記ヒートシンク板の間
に挿入して、電気的に絶縁するための、前記複数
個の大容量半導体素子に対し共通の帯状の熱抵抗
の低い絶縁シートと、前記プリント配線基板と前
記ヒートシンク板の間に挿入してねじ止めし、ヒ
ートシンク板を配線基板に電気的に絶縁して固定
するための、前記複数個の大容量半導体素子の端
子を貫通させる孔を、前記端子の位置および形状
に合わせて孔明け加工した絶縁ベーク板を有する
ことを特徴とする大容量半導体素子実装用プリン
ト配線基板。 A printed wiring board having a structure for mounting a large-capacity semiconductor element, a heat sink plate for dissipating internal heat generation of the large-capacity semiconductor element, a plurality of large-capacity semiconductor elements to be attached to the heat sink plate, and a plurality of large-capacity semiconductor elements to be attached to the heat sink plate; A strip-shaped insulating sheet with low thermal resistance common to the plurality of large-capacity semiconductor elements, which is inserted between the heat sink plates for electrical insulation; and a screw, which is inserted between the printed wiring board and the heat sink plate. an insulator in which holes are drilled to match the positions and shapes of the terminals of the plurality of large-capacity semiconductor elements in order to electrically insulate and fix the heat sink board to the wiring board; A printed wiring board for mounting large-capacity semiconductor elements, characterized by having a baked board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16056488U JPH0281048U (en) | 1988-12-09 | 1988-12-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16056488U JPH0281048U (en) | 1988-12-09 | 1988-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281048U true JPH0281048U (en) | 1990-06-22 |
Family
ID=31442737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16056488U Pending JPH0281048U (en) | 1988-12-09 | 1988-12-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281048U (en) |
-
1988
- 1988-12-09 JP JP16056488U patent/JPH0281048U/ja active Pending
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