JPH0281085U - - Google Patents

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Publication number
JPH0281085U
JPH0281085U JP15943188U JP15943188U JPH0281085U JP H0281085 U JPH0281085 U JP H0281085U JP 15943188 U JP15943188 U JP 15943188U JP 15943188 U JP15943188 U JP 15943188U JP H0281085 U JPH0281085 U JP H0281085U
Authority
JP
Japan
Prior art keywords
green sheet
ceramic multilayer
multilayer board
vias
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15943188U
Other languages
English (en)
Other versions
JPH0642373Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15943188U priority Critical patent/JPH0642373Y2/ja
Publication of JPH0281085U publication Critical patent/JPH0281085U/ja
Application granted granted Critical
Publication of JPH0642373Y2 publication Critical patent/JPH0642373Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【図面の簡単な説明】
第１図は本考案のセラミツク多層基板の実施例
を示す断面図、第２図は第１図の―断面図、
第３図ａは従来例の断面図、ｂは断線状態を示す
断面図である。 図において、１はグリーンシート、２は導体パ
ターン、３はＶｉａ、４は導体ペースト、５はラ
ンド、６はメタルピン、７ａ，７ｂ，７ｃはｖｉ
ａ接続部である。

Claims (1)

  1. 【実用新案登録請求の範囲】 グリーンシート１に導体パターン２を形成し、
    ｖｉａ３に導体ペースト４を充填して端部にラン
    ド５を設けたものを複数層積層するセラミツク多
    層基板において、 各層のグリーンシート１の各ｖｉａ接続部７ａ
    ，７ｂ，７ｃ毎に、その全長にわたつてメタルピ
    ン６を一直線上に挿入設置することを特徴とする
    セラミツク多層基板。
JP15943188U 1988-12-09 1988-12-09 セラミック多層基板 Expired - Lifetime JPH0642373Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15943188U JPH0642373Y2 (ja) 1988-12-09 1988-12-09 セラミック多層基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15943188U JPH0642373Y2 (ja) 1988-12-09 1988-12-09 セラミック多層基板

Publications (2)

Publication Number Publication Date
JPH0281085U true JPH0281085U (ja) 1990-06-22
JPH0642373Y2 JPH0642373Y2 (ja) 1994-11-02

Family

ID=31440641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15943188U Expired - Lifetime JPH0642373Y2 (ja) 1988-12-09 1988-12-09 セラミック多層基板

Country Status (1)

Country Link
JP (1) JPH0642373Y2 (ja)

Also Published As

Publication number Publication date
JPH0642373Y2 (ja) 1994-11-02

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