JPH0281085U - - Google Patents
Info
- Publication number
- JPH0281085U JPH0281085U JP15943188U JP15943188U JPH0281085U JP H0281085 U JPH0281085 U JP H0281085U JP 15943188 U JP15943188 U JP 15943188U JP 15943188 U JP15943188 U JP 15943188U JP H0281085 U JPH0281085 U JP H0281085U
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- ceramic multilayer
- multilayer board
- vias
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案のセラミツク多層基板の実施例
を示す断面図、第２図は第１図の―断面図、
第３図ａは従来例の断面図、ｂは断線状態を示す
断面図である。
図において、１はグリーンシート、２は導体パ
ターン、３はＶｉａ、４は導体ペースト、５はラ
ンド、６はメタルピン、７ａ，７ｂ，７ｃはｖｉ
ａ接続部である。
FIG. 1 is a cross-sectional view showing an embodiment of the ceramic multilayer substrate of the present invention, and FIG. 2 is a cross-sectional view of FIG. 1.
FIG. 3a is a sectional view of a conventional example, and FIG. 3b is a sectional view showing a disconnected state. In the figure, 1 is a green sheet, 2 is a conductor pattern, 3 is a via, 4 is a conductor paste, 5 is a land, 6 is a metal pin, 7a, 7b, 7c are vias
This is the a connection part.
Claims (1)
ｖｉａ３に導体ペースト４を充填して端部にラン
ド５を設けたものを複数層積層するセラミツク多
層基板において、 各層のグリーンシート１の各ｖｉａ接続部７ａ
，７ｂ，７ｃ毎に、その全長にわたつてメタルピ
ン６を一直線上に挿入設置することを特徴とする
セラミツク多層基板。[Claims for Utility Model Registration] A conductor pattern 2 is formed on a green sheet 1,
In a ceramic multilayer board in which multiple layers of vias 3 are filled with conductive paste 4 and lands 5 are provided at the ends are laminated, each via connection portion 7a of the green sheet 1 of each layer is
, 7b, 7c, metal pins 6 are inserted and installed in a straight line over the entire length of the ceramic multilayer board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15943188U JPH0642373Y2 (en) | 1988-12-09 | 1988-12-09 | Ceramic multilayer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15943188U JPH0642373Y2 (en) | 1988-12-09 | 1988-12-09 | Ceramic multilayer board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0281085U true JPH0281085U (en) | 1990-06-22 |
| JPH0642373Y2 JPH0642373Y2 (en) | 1994-11-02 |
Family
ID=31440641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15943188U Expired - Lifetime JPH0642373Y2 (en) | 1988-12-09 | 1988-12-09 | Ceramic multilayer board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642373Y2 (en) |
-
1988
- 1988-12-09 JP JP15943188U patent/JPH0642373Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642373Y2 (en) | 1994-11-02 |