JPH028131U - - Google Patents
Info
- Publication number
- JPH028131U JPH028131U JP8563488U JP8563488U JPH028131U JP H028131 U JPH028131 U JP H028131U JP 8563488 U JP8563488 U JP 8563488U JP 8563488 U JP8563488 U JP 8563488U JP H028131 U JPH028131 U JP H028131U
- Authority
- JP
- Japan
- Prior art keywords
- chemical solution
- tank
- filter
- discharge port
- heat exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000126 substance Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
第１図は本考案の構成を示す要部断面図、第２
図は従来の半導体製造装置の熱交換器の系統図を
示す。
第１図において、２は熱交換器、３はコイル状
パイプ、４はタンク、６はフイルタ、８は吐出口
、１０はウエハ、１１は薬液保温機構をそれぞれ
示す。
Figure 1 is a sectional view of the main parts showing the configuration of the present invention, Figure 2
The figure shows a system diagram of a heat exchanger in a conventional semiconductor manufacturing device. In FIG. 1, 2 is a heat exchanger, 3 is a coiled pipe, 4 is a tank, 6 is a filter, 8 is a discharge port, 10 is a wafer, and 11 is a chemical solution heat retention mechanism.
Claims (1)
ウエハ１０上に供給する半導体製造装置において
、 前記薬液を送液、かつ熱交換を行うコイル状パ
イプ３を恒温水が循環するタンク４内に装着して
なる熱交換器２と、 前記コイル状パイプ３の終端に連結され、かつ
前記タンク４内に併設されてなるフイルタ６と、 該フイルタ６の出口と前記薬液の吐出口８とを
連結する薬液保温機構１１を備えた配管とから構
成されてなることを特徴とする半導体製造装置の
熱交換器。[Scope of Claim for Utility Model Registration] In a semiconductor manufacturing apparatus that supplies a chemical solution maintained at a constant temperature onto a wafer 10 from a discharge port 8 for the chemical solution, a coiled pipe 3 that delivers the chemical solution and performs heat exchange is kept at a constant temperature. A heat exchanger 2 installed in a tank 4 in which water circulates; a filter 6 connected to the terminal end of the coiled pipe 3 and installed inside the tank 4; an outlet of the filter 6 and the 1. A heat exchanger for semiconductor manufacturing equipment, comprising a pipe provided with a chemical liquid heat retention mechanism 11 that connects a chemical liquid discharge port 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8563488U JPH028131U (en) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8563488U JPH028131U (en) | 1988-06-27 | 1988-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028131U true JPH028131U (en) | 1990-01-19 |
Family
ID=31310287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8563488U Pending JPH028131U (en) | 1988-06-27 | 1988-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028131U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61125017A (en) * | 1984-11-22 | 1986-06-12 | Hitachi Tokyo Electronics Co Ltd | Coating apparatus |
| JPS61214520A (en) * | 1985-03-20 | 1986-09-24 | Hitachi Ltd | Coating device |
| JPS62279632A (en) * | 1986-05-28 | 1987-12-04 | Nec Corp | Semiconductor manufacturing apparatus |
-
1988
- 1988-06-27 JP JP8563488U patent/JPH028131U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61125017A (en) * | 1984-11-22 | 1986-06-12 | Hitachi Tokyo Electronics Co Ltd | Coating apparatus |
| JPS61214520A (en) * | 1985-03-20 | 1986-09-24 | Hitachi Ltd | Coating device |
| JPS62279632A (en) * | 1986-05-28 | 1987-12-04 | Nec Corp | Semiconductor manufacturing apparatus |
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