JPH028139U - - Google Patents
Info
- Publication number
- JPH028139U JPH028139U JP1988086932U JP8693288U JPH028139U JP H028139 U JPH028139 U JP H028139U JP 1988086932 U JP1988086932 U JP 1988086932U JP 8693288 U JP8693288 U JP 8693288U JP H028139 U JPH028139 U JP H028139U
- Authority
- JP
- Japan
- Prior art keywords
- post
- elastic
- manufacturing apparatus
- bases
- semiconductor manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
第１図は本考案に係る半導体製造装置を示す断
面図、第２図は従来の半導体製造装置を示す断面
図である。
１，２……定盤、３，４……ベース、５，６…
…弾性ポスト、７，８……キヤビテイブロツク、
２１，２２……補強ポスト。
FIG. 1 is a sectional view showing a semiconductor manufacturing apparatus according to the present invention, and FIG. 2 is a sectional view showing a conventional semiconductor manufacturing apparatus. 1, 2... Surface plate, 3, 4... Base, 5, 6...
...elastic post, 7,8...cavity block,
21, 22...Reinforcement post.
Claims (1)
れた定盤と、これら両定盤に各々設けられ半導体
素子封止用の樹脂を成形するキヤビテイブロツク
とを備えた半導体製造装置において、前記弾性ポ
ストの周囲に筒状の補強ポストを設け、この補強
ポストの軸線方向寸法を前記弾性ポストの軸線方
向寸法より小さい寸法に設定したことを特徴とす
る半導体製造装置。 In a semiconductor manufacturing apparatus comprising two bases each supported by an elastic post, and a cavity block provided on each of these two bases for molding a resin for encapsulating a semiconductor element, the elastic post A semiconductor manufacturing apparatus characterized in that a cylindrical reinforcing post is provided around the elastic post, and the axial dimension of the reinforcing post is set to be smaller than the axial dimension of the elastic post.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086932U JPH028139U (en) | 1988-06-29 | 1988-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086932U JPH028139U (en) | 1988-06-29 | 1988-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028139U true JPH028139U (en) | 1990-01-19 |
Family
ID=31311572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988086932U Pending JPH028139U (en) | 1988-06-29 | 1988-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028139U (en) |
-
1988
- 1988-06-29 JP JP1988086932U patent/JPH028139U/ja active Pending