JPH0180930U - - Google Patents
Info
- Publication number
- JPH0180930U JPH0180930U JP1987176774U JP17677487U JPH0180930U JP H0180930 U JPH0180930 U JP H0180930U JP 1987176774 U JP1987176774 U JP 1987176774U JP 17677487 U JP17677487 U JP 17677487U JP H0180930 U JPH0180930 U JP H0180930U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- recess
- injection port
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す断面図、第２図
及び第３図は一般的な半導体装置を示す断面図、
第４図は従来例を示す断面図である。
１，２……上下金型、３……基板支持体、４…
…半導体素子、５……凹部、６……樹脂注入口、
７……スペア部材、８……樹脂。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIGS. 2 and 3 are sectional views showing a general semiconductor device,
FIG. 4 is a sectional view showing a conventional example. 1, 2... Upper and lower molds, 3... Substrate support, 4...
...Semiconductor element, 5...Recess, 6...Resin injection port,
7... Spare parts, 8... Resin.
Claims (1)
、夫々の凹部が対向してキヤビテイを形成してお
り、前記第２の金型の凹部上に半導体素子が固着
された基板支持体が配置され、前記第１及び第２
の金型より形成された樹脂注入口から前記キヤビ
テイ内に樹脂が注入される半導体装置用樹脂封止
金型において、前記樹脂注入口近傍の前記第２の
金型の凹部底面に取りはずし可能なスペア部材を
埋設したことを特徴とする半導体装置用樹脂封止
金型。 The first mold and the second mold each have a recess, and the recesses face each other to form a cavity, and a semiconductor element is fixed to the substrate on the recess of the second mold. A support is disposed and the first and second
In a resin sealing mold for a semiconductor device in which a resin is injected into the cavity from a resin injection port formed by a mold, a removable spare is provided on the bottom surface of a recess of the second mold near the resin injection port. A resin-sealing mold for a semiconductor device characterized by having a component embedded therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176774U JPH087632Y2 (en) | 1987-11-19 | 1987-11-19 | Resin encapsulation mold for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176774U JPH087632Y2 (en) | 1987-11-19 | 1987-11-19 | Resin encapsulation mold for semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0180930U true JPH0180930U (en) | 1989-05-30 |
| JPH087632Y2 JPH087632Y2 (en) | 1996-03-04 |
Family
ID=31468477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176774U Expired - Lifetime JPH087632Y2 (en) | 1987-11-19 | 1987-11-19 | Resin encapsulation mold for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087632Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831538A (en) * | 1981-08-19 | 1983-02-24 | Toshiba Corp | Mold assembly for resin sealing |
-
1987
- 1987-11-19 JP JP1987176774U patent/JPH087632Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831538A (en) * | 1981-08-19 | 1983-02-24 | Toshiba Corp | Mold assembly for resin sealing |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH087632Y2 (en) | 1996-03-04 |
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