JPH0281458A - Microwave module carrier structure - Google Patents

Abstract

PURPOSE:To maintain a required impedance and avoid defects caused by connection by a method wherein a carrier and a part protruding outward are formed into one piece and the protruding part is used as the I/O part of the carrier and, further, the inner conductors of RF terminals are made to pierce through the I/O part of the carrier. CONSTITUTION:An I/O part 61a protruding outward, MIC attaching parts 62-65, transistor attaching parts 66 and 67, holes 68-70 which are drilled in the I/O part 61a and through which the inner conductors of RF terminals are made to piece and screw holes 71-74 are formed on a carrier 61 and the carrier 61 and the I/O part 61a are formed into one piece. MIC boards 23-26 are formed on the MIC attaching parts 64 and 65 of the carrier 61 and the MIC board 26 is vertically connected to a printed board 32 through a connecting ribbon 35 and the inner conductor 36b of the RF terminal 36 and the carrier 61 is fixed to a stem 27. An input signal is inputted to the printed board 32 and transmitted to the MIC boards 23-26 through the 50OMEGA RF terminals 34 and 36. The impedance of the inner conductors 34b and 36b of the RF terminals 34 and 36 and the carrier 61 main part is 50OMEGA for a microwave and, as there is no gap, the discontinuity caused by the connection can be minimized.

Description

[Detailed Description of the Invention] [Table of Contents] Overview Industrial Application Fields Conventional Technology Problems to be Solved by the Invention Means for Solving the Problems Action Embodiment One Embodiment of the Present Invention Effects of the Invention (Nos. 3 to 9) (Fig. 1.2) [Summary] Regarding the carrier structure for microwave modules, reduce the increase in loss due to impedance discontinuity that occurs when connecting unit circuits or unit circuits and connectors vertically. The purpose of the present invention is to provide a carrier structure for a microwave module that can improve the difficulty of adjustment. In the carrier structure for a module, a protrusion projecting outward is integrally formed on the carrier, the protrusion constitutes an input section or an output section of the carrier, and an inner conductor of an RF terminal is provided at the input section or output section of the carrier. Configure it to pass.

[Industrial application field]

The present invention relates to a carrier structure for a microwave module,
For details, please refer to the microwave module carrier structure that improves the increase in loss due to impedance discontinuity and the difficulty in adjustment when vertically connecting between unit circuits or between a unit circuit and a connector in a microwave module. Regarding.

A film integrated circuit is a circuit in which multiple circuit elements are formed using thin or thick films on an insulating substrate, and the elements are connected by a film, and a hybrid IC is a circuit in which semiconductor elements are combined with this. It is. In general, it is difficult to achieve high frequencies with circuits that use semiconductors sealed in airtight containers, ordinary resistive elements, etc. due to lead inductance and stray capacitance of the container, but hybrid ICs that are composed of semiconductor chips and resistive films have small circuits. Since wiring can be done in the form of a strip line, which is a high-frequency line, it is easy to create a high-frequency circuit. For this reason, hybrid ICs are also used in microwave circuits, and are generally called microwave integrated circuits (MICs).
ted circuit).

Currently, modularization of microwave circuits in the microwave band is progressing, and modularization has made it possible to freely replace and use microwave circuits in any location. For modularization, each microwave circuit is made into a unit, and is used in combination as necessary to obtain predetermined characteristics. Here, unitization means fixing the alumina substrate on which the circuit pattern is constructed on a carrier using brazing material or 3m (Ag) paste to perform a predetermined function (
(amplification, oscillation, mixer, etc.) and combine them as necessary to obtain the desired characteristics of a microwave.

[Conventional technology]

As a conventional microwave circuit using this type of microwave module carrier, there is one shown in FIG. 3, which is commonly used in amplifiers, for example.

FIG. 3(a) shows a top view of the amplifier, and FIG. 3(b) shows a side sectional view thereof. In Figures 3(a) and (b), 1.2
is a carrier plate (carrier), the MIC board 3.4 is on the carrier plate l, and the MIC board 5 is on the carrier plate 2.
．． 6 is formed.

The carrier plate 1.2 is placed in the housing 7, and the microwave signals are guided to the internal MIC boards 3-6 via connectors 8.9 attached to the housing 7. The housing 7 is sealed with a lid 10. In addition, the housing 7 has a DC terminal 11.
~18 are provided, and DC terminals 11-18 are MIC
It is used as a bias terminal that supplies bias for driving the transistors mounted on the substrates 3 to 6. Therefore, the circuits of each unit consisting of the MIC boards 3 to 6 are arranged on the same plane as shown in FIG. 3(b). The circuit shown in Figure 3 uses microwaves at 10 GIIz.
It is often used in the above amplifier modules,
1 to l0C) fz shown in FIG. 4.5. FIG. 4(a) shows a top view of the amplifier, FIG. 4(b) shows a side sectional view thereof,
Figure 5(a) is a partially enlarged view of Figure 4(a), Figure 5(b)
) shows a partially enlarged view of FIG. 4(b). Figure 4 (
In a) and (b), 21.22 is a carrier plate (carrier), MIC board (microwave circuit board) 23.24 is placed on the carrier plate 21, and MIC board 25.26 is placed on the carrier plate 22. is formed. carrier plate 2
I, 22 are attached to the surface of the stem attachment part 29a of the housing 29 via stems (heso goo) 27, 28 (however, the carrier plate attached to the stem 28 is not shown), and are attached to the back surface of the stem attachment part 29a. Printed circuit boards 30 to 32 are attached. The stem mounting portion 29a has communication ports 29b and 29c for connecting the MIC boards 23 to 26 and the printed circuit boards 31 and 32 with predetermined conductors.
A hole is formed perpendicularly to the IC board, and the MIC board 23 is connected to a connecting ribbon 33 and an RF (radio frequency)
The MIC board 26 is connected to the printed circuit board 32 via the connecting ribbon 35 and the RF terminal 36, and the MIC board 24 and 25 are connected to the printed circuit board 31 via the connecting ribbon 37. (See partially enlarged views shown in FIGS. 5(a) and 5(b)). Similarly, the MI attached to the stem 28
A C board (not shown) is connected to a printed circuit board 30.31 via an RF terminal 38.39. For example, FIG. 6 shows an enlarged view of the vicinity of the RF terminal 36, FIG. 7 shows a cross-sectional view taken along line A-A'' of the RF terminal 36 in FIG. Assuming that the B-3' arrow side view is shown, 36a is the RF connector soldered to the stem 27.
The metal part of the terminal 36, 36b, is the inner conductor of the RF terminal 36, 3
6c represents an insulator that insulates the metal portion 36a and the inner conductor 36b. Therefore, the metal part 36
a is soldered to the stem 27, the metal part 36a and the inner conductor 36b are separated by the insulator 36C, so the impedance of the stem 27 is 50Ω, and the inner conductor 36b
is 50Ω while it is in the stem 27. and,
The inner conductor 36b is connected to M by the connecting ribbon (gold ribbon) 35.
It is connected to a 50Ω stripline on the IC board 26.

Further, gold ribbons 40 to 43 are attached to the MIC substrates 24 and 26, and the gold ribbons 40 to 43 are used as bias lead wires that supply bias for driving transistors etc. mounted on the MIC substrate. This corresponds to the DC terminals 11 to 18 of the circuit shown in FIG. The microwave signal is transmitted through connectors 44 and 45 attached to the housing 29.
are led to the printed circuit boards 30, 32 through the. stem 2
The inside of 8 is protected by a cap 46, and the housing 29 is sealed by lids 47 and 48. In addition, 49 is a ground terminal, and 50 is a feed-through capacitor. Therefore, in the amplifier shown in FIG. 4, the circuits of each unit are connected perpendicularly to the substrate.

However, in the circuit shown in Fig. 4, the 50Ω RF terminals 34 and 36 are connected at the part where the circuit is connected, as shown in Fig. 6.
Since there is a point where the impedance matching is not 50Ω between the 50Ω line on the unit circuit and the 50Ω line on the unit circuit, the direction of the generated electromagnetic field is not converted smoothly, and therefore the specified characteristics that should be obtained by the combination are not obtained. I can't. Especially when the frequency is high <(IOC; Hz or higher)
This problem becomes more noticeable. That is, when a microwave module having a predetermined function is created by combining unit circuits, a loss occurs in that part and adjustment is difficult. To solve this problem, for example, there is a method described in Japanese Utility Model Application Publication No. 58-22321 (see FIG. 9). In this description, the same components as those in the conventional example shown in FIG. 5 are given the same numbers, and the description thereof will be omitted. In FIG. 9, the carrier plate 21 of the stem 27
．． 22 mounting part RF terminal 34.36 and MIC board 23.
A protrusion 51.52 of the stem is provided at the connection part with the 50Ω stripline on the MIC board 23.26, and the ground part is connected to the MIC board 23.
By approaching the 26 50Ω stripline,
The 50Ω portion of the 50Ω RF terminal 34.36 is brought closer to the MIC board 23.25 to eliminate discontinuity and improve transmission characteristics.

[Problem to be solved by the invention]

However, in such conventional carriers for microwave modules, there is a gap (non-contact part) between the protruding part 51.52 of the stem and the carrier 21.22 (because of the mechanical design, it is difficult to physically complete the carrier). (It is not possible to eliminate the gap), it is not possible to completely reduce the resistance to 50Ω, and as the frequency increases, the above-mentioned connection problems may occur.

For example, when making a broadband (4 to 8 GHz) amplifier module using the method shown in FIG. 9, the impedance is inevitably disturbed by the influence of the gap, making it difficult to adjust it to a predetermined specification. When the band is narrow, predetermined characteristics can be satisfied by adjusting the matching circuit, but as the frequency becomes higher and the band becomes wider, adjustment by the matching circuit becomes more difficult.

Therefore, the present invention can reduce the increase in loss due to impedance discontinuity that occurs when vertically connecting unit circuits or unit circuits and connectors, and can improve the difficulty in adjustment. The purpose is to provide carriers for microwave modules.

[Means to solve the problem]

In order to achieve the above object, the carrier structure for a microwave module according to the present invention is a carrier for a microwave module comprising a microwave circuit board and a carrier to which the microwave circuit board is attached, wherein the carrier structure projects outward from the carrier. The protruding part is integrally formed, the protruding part constitutes the input part or the output part of the carrier, and the inner conductor of the RF terminal is configured to pass through the input part or the output part of the carrier.

[Effect]

In the present invention, the protruding part that protrudes outward is integrally formed on the carrier, and the protruding part constitutes the input part or the output part of the carrier, and the inner conductor of the RF terminal is connected to the input part or the output part of the carrier. Passed.

Therefore, the non-contact portion between the carrier and the stem is eliminated, a predetermined impedance can be maintained completely, and connection problems are prevented.

〔Example〕

Hereinafter, the present invention will be explained based on the drawings.

FIG. 12 is a diagram showing an embodiment of a carrier structure for a microwave module according to the present invention. First, the configuration will be explained. FIG. 1(a) shows a configuration diagram of the carrier, and FIG.
b) shows a configuration diagram in which a carrier is actually mounted on a microwave module. In FIGS. 1(a) and (b), 61 is a carrier, and the carrier 61 is an input/output part (protruding part) 61a that protrudes outward so as to maintain a predetermined impedance when the inner conductor of the RF terminal is passed through. The carrier 61 has MIC mounting parts 62 to 65 for mounting a MIC board (alumina board), transistor mounting parts 66 and 67 for mounting a transistor, and input/output ports for passing the inner conductor of the RF terminal. Hole 6 drilled in part 61a
8 to 70 and screw holes 71 to 74 are formed. That is, unlike the conventional example in which a stem protrusion is provided on an extension of the MIC board, the input/output section 61a of the carrier 61 itself is configured to extend in the horizontal direction, and the inner conductor passes through the input/output section 61a. Holes 68-70 are drilled. Therefore, since the carrier 61 and its input/output section 61a are integrally formed, no gaps are created. FIG. 2 shows an example in which the carrier 61 is applied to the circuit shown in FIG. Components that are the same as those of the conventional example shown in FIG. 6 are given the same numbers and their explanations will be omitted. In FIGS. 2(a) and 2(b), 61 is a carrier, and a MIC board (
Alumina substrates) 23 to 26 are formed, and the MIC substrate 26 is vertically connected to the printed circuit board 32 via the connecting ribbon 35 and the inner conductor 36b of the RF terminal 36.

The carrier 61 is also fixed onto the stem 27 by screws (paths shown) passed through the holes 73, 74.

Next, the effect will be explained.

First, a signal entering from the input section (SMA 50Ω connector 44, 45 or waveguide) enters the unit circuit (printed circuit boards 30 to 32). And 50ΩR
Connect the circuit (M
It is connected onto the IC boards 23-26). In this case, the R
The inner conductor of the F terminals 34 and 36 and the carrier 61 body 36b (the inner conductor of the RF terminal 34 is not shown) have a microwave resistance of 50Ω, and since there is no gap (non-contact part), it is difficult to connect. The resulting discontinuities can be minimized. Furthermore, impedance disturbances are similarly suppressed to a minimum in the output section 61a where the signal passing through the uni-node circuit is output, and the signal is connected to the output connectors 44, 45 or the waveguide extremely smoothly. therefore,
RF terminals 34, 35 .
The inner conductor of 38.39 is passed through, and its impedance is 50Ω.By adopting this configuration method, the impedance discontinuity that occurs when connecting the unit circuit is minimized. This has the effect of suppressing the loss, reducing the occurrence of loss, and improving the difficulty of adjustment.

As described above, in this embodiment, the increase in loss due to impedance discontinuity that occurs when connecting unit circuits, or when vertically connecting a unit circuit and a connector, or a unit circuit and a waveguide, and difficulty during adjustment can be avoided. can improve sex.

〔Effect of the invention〕

According to the present invention, it is possible to reduce the increase in loss due to impedance discontinuity that occurs when vertically connecting unit circuits or between a unit circuit and a connector, and it is possible to improve difficulty in adjustment. can.

[Brief explanation of the drawing]

Fig. 1.2 is a diagram showing a carrier structure for a microwave module according to the present invention, Fig. 1 is a diagram showing the carrier structure, Fig. 2 is a partially enlarged view thereof, and Figs. 3 to 6 are diagrams showing a conventional carrier structure. FIG. 3 is a diagram showing the overall configuration of the microwave module carrier; FIG. 4 is a diagram of the entire configuration; FIG. 5 is a partially enlarged diagram of the carrier; and FIG. 6 is an enlarged diagram of the vicinity of the RF terminal 36. , Figure 7 is the 6th
8 is a BB plane view of the RF terminal 36 in FIG. 6, and FIG. 9 is a partially enlarged view thereof. 23-26...MIC board 27.28...Stem, 29...Housing, 29a...Stem mounting part, 2gb, 3oc... ...Communication port, 30.31.32...Printed circuit board, 33.3
5.37... Connection ribbon, 34.36.38
．． 39...RF terminal, 36a...Metal part, 36b...Inner conductor, 36c...Insulator, 40-43...Gold Ribbon, 44.45... Connector, (Microwave circuit board) Arrow cross section 61... Carrier, 61a... Input/output part (protruding part), 62 ~65・
...MIC mounting part, 66.67...Transistor mounting part, 68-70...hole, 71-74...hole. 5. An enlarged view of the conventional RF terminal 36. FIG. 6. A cross-sectional view of the conventional RF terminal 36 in FIG. 6 taken along the line A-A'.
Figure: A sectional view of the conventional RF terminal 36 shown in Figure 6 taken along the line B-B'.

Claims (1)

[Scope of Claim] A carrier structure for a microwave module comprising a microwave circuit board and a carrier to which the microwave circuit board is attached, wherein a protrusion protruding outward is integrally formed on the carrier. The protruding part constitutes an input part or an output part of the carrier,
A carrier structure for a microwave module, characterized in that an inner conductor of an RF terminal is passed through an input section or an output section of the carrier.