JPH028149U - - Google Patents
Info
- Publication number
- JPH028149U JPH028149U JP1988086408U JP8640888U JPH028149U JP H028149 U JPH028149 U JP H028149U JP 1988086408 U JP1988086408 U JP 1988086408U JP 8640888 U JP8640888 U JP 8640888U JP H028149 U JPH028149 U JP H028149U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- holding plate
- plated side
- attracts
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案実施例を説明するための図であ
り、第2図は従来の問題点を説明するための図で
ある。
1:リードフレーム、2:押え板、3:マスク
板、2a,3a:弾性体、4:メツキ液、5:隙
間、6:磁性体。
FIG. 1 is a diagram for explaining the embodiment of the present invention, and FIG. 2 is a diagram for explaining the problems of the prior art. 1: Lead frame, 2: Holding plate, 3: Mask plate, 2a, 3a: Elastic body, 4: Plating liquid, 5: Gap, 6: Magnetic body.
Claims (1)
え板の内部に、前記非メツキ側表面を前記押え板
に吸着させる磁力を発生させる磁性体を埋設した
ことを特徴とするリードフレームの部分メツキ用
治具。 A jig for partially plating a lead frame, characterized in that a magnetic material that generates a magnetic force that attracts the non-plated side surface to the holding plate is embedded inside a holding plate that comes into contact with the non-plated side surface of the lead frame. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086408U JPH0710497Y2 (en) | 1988-06-28 | 1988-06-28 | Jig for partial plating of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086408U JPH0710497Y2 (en) | 1988-06-28 | 1988-06-28 | Jig for partial plating of lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH028149U true JPH028149U (en) | 1990-01-19 |
| JPH0710497Y2 JPH0710497Y2 (en) | 1995-03-08 |
Family
ID=31311046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988086408U Expired - Lifetime JPH0710497Y2 (en) | 1988-06-28 | 1988-06-28 | Jig for partial plating of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710497Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04329011A (en) * | 1991-04-30 | 1992-11-17 | Murata Mfg Co Ltd | Support jig for lead frame |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5569290A (en) * | 1978-11-13 | 1980-05-24 | Mitsubishi Electric Corp | Method and apparatus for production of partially plated metal material |
| JPS62135446U (en) * | 1986-02-19 | 1987-08-26 |
-
1988
- 1988-06-28 JP JP1988086408U patent/JPH0710497Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5569290A (en) * | 1978-11-13 | 1980-05-24 | Mitsubishi Electric Corp | Method and apparatus for production of partially plated metal material |
| JPS62135446U (en) * | 1986-02-19 | 1987-08-26 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04329011A (en) * | 1991-04-30 | 1992-11-17 | Murata Mfg Co Ltd | Support jig for lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710497Y2 (en) | 1995-03-08 |
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