JPH028149U - - Google Patents

Info

Publication number
JPH028149U
JPH028149U JP1988086408U JP8640888U JPH028149U JP H028149 U JPH028149 U JP H028149U JP 1988086408 U JP1988086408 U JP 1988086408U JP 8640888 U JP8640888 U JP 8640888U JP H028149 U JPH028149 U JP H028149U
Authority
JP
Japan
Prior art keywords
lead frame
holding plate
plated side
attracts
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988086408U
Other languages
English (en)
Other versions
JPH0710497Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988086408U priority Critical patent/JPH0710497Y2/ja
Publication of JPH028149U publication Critical patent/JPH028149U/ja
Application granted granted Critical
Publication of JPH0710497Y2 publication Critical patent/JPH0710497Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例を説明するための図であ
り、第２図は従来の問題点を説明するための図で
ある。 １：リードフレーム、２：押え板、３：マスク
板、２ａ，３ａ：弾性体、４：メツキ液、５：隙
間、６：磁性体。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームの非メツキ側表面に当接する押
    え板の内部に、前記非メツキ側表面を前記押え板
    に吸着させる磁力を発生させる磁性体を埋設した
    ことを特徴とするリードフレームの部分メツキ用
    治具。
JP1988086408U 1988-06-28 1988-06-28 リードフレームの部分メッキ用治具 Expired - Lifetime JPH0710497Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988086408U JPH0710497Y2 (ja) 1988-06-28 1988-06-28 リードフレームの部分メッキ用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988086408U JPH0710497Y2 (ja) 1988-06-28 1988-06-28 リードフレームの部分メッキ用治具

Publications (2)

Publication Number Publication Date
JPH028149U true JPH028149U (ja) 1990-01-19
JPH0710497Y2 JPH0710497Y2 (ja) 1995-03-08

Family

ID=31311046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988086408U Expired - Lifetime JPH0710497Y2 (ja) 1988-06-28 1988-06-28 リードフレームの部分メッキ用治具

Country Status (1)

Country Link
JP (1) JPH0710497Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04329011A (ja) * 1991-04-30 1992-11-17 Murata Mfg Co Ltd リードフレームの保持具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5569290A (en) * 1978-11-13 1980-05-24 Mitsubishi Electric Corp Method and apparatus for production of partially plated metal material
JPS62135446U (ja) * 1986-02-19 1987-08-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5569290A (en) * 1978-11-13 1980-05-24 Mitsubishi Electric Corp Method and apparatus for production of partially plated metal material
JPS62135446U (ja) * 1986-02-19 1987-08-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04329011A (ja) * 1991-04-30 1992-11-17 Murata Mfg Co Ltd リードフレームの保持具

Also Published As

Publication number Publication date
JPH0710497Y2 (ja) 1995-03-08

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