JPH028150U - - Google Patents
Info
- Publication number
- JPH028150U JPH028150U JP8653488U JP8653488U JPH028150U JP H028150 U JPH028150 U JP H028150U JP 8653488 U JP8653488 U JP 8653488U JP 8653488 U JP8653488 U JP 8653488U JP H028150 U JPH028150 U JP H028150U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- leads
- lead
- internal
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案実施例の半導体装置用リード
フレームを示す図、第２図は、同半導体装置用リ
ードフレームの変形例を示す図、第３図および第
４図はそれぞれ従来の半導体装置用リードフレー
ムを示す図である。
１……ダイパツド、２……内部リード、３……
タイバー（ダムバー）、４……外部リード、５…
…サポートバー、６……サイドバー、７……タイ
バー樹脂、８，１８，２８……切欠（マーキング
）。
FIG. 1 is a diagram showing a lead frame for a semiconductor device according to an embodiment of the present invention, FIG. 2 is a diagram showing a modification of the lead frame for a semiconductor device, and FIGS. 3 and 4 are diagrams showing conventional semiconductor device lead frames. It is a figure showing a lead frame for. 1... Die pad, 2... Internal lead, 3...
Tie bar (dam bar), 4...External lead, 5...
...Support bar, 6...Side bar, 7...Tie bar resin, 8, 18, 28...Notch (marking).
Claims (1)
枠に支承させるタイバーとを具備したリードフレ
ームにおいて、 タイバー内に、リードフレームの品種毎に少な
くともその形状または位置が異なるように打ち抜
き加工によつて形成したマーキングを付したこと
を特徴とする半導体装置用リードフレーム。[Scope of Claim for Utility Model Registration] A lead frame comprising a plurality of internal leads, external leads extending from each internal lead, and a tie bar that integrally connects each of these leads and supports the external frame, 1. A lead frame for a semiconductor device, comprising a marking formed by punching so that at least the shape or position of the lead frame differs depending on the type of lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8653488U JPH073645Y2 (en) | 1988-06-29 | 1988-06-29 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8653488U JPH073645Y2 (en) | 1988-06-29 | 1988-06-29 | Lead frame for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH028150U true JPH028150U (en) | 1990-01-19 |
| JPH073645Y2 JPH073645Y2 (en) | 1995-01-30 |
Family
ID=31311172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8653488U Expired - Lifetime JPH073645Y2 (en) | 1988-06-29 | 1988-06-29 | Lead frame for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073645Y2 (en) |
-
1988
- 1988-06-29 JP JP8653488U patent/JPH073645Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073645Y2 (en) | 1995-01-30 |
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