JPH02743U - - Google Patents
Info
- Publication number
- JPH02743U JPH02743U JP7795088U JP7795088U JPH02743U JP H02743 U JPH02743 U JP H02743U JP 7795088 U JP7795088 U JP 7795088U JP 7795088 U JP7795088 U JP 7795088U JP H02743 U JPH02743 U JP H02743U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- lead
- internal
- support bar
- insulating tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案実施例の半導体装置用リード
フレームを示す図、第２図は、同半導体装置用リ
ードフレームの変形例を示す図、第３図は従来の
半導体装置を示す図、第４図ａおよび第４図ｂは
同半導体装置のリードフレームを示す図、第５図
は、他のリードフレームの例を示す図である。
１……リードフレーム、２……ダイパツド、３
……半導体素子、４……内部リード、４ａ……第
１のリード、４ｂ……第２のリード、５……ボン
デイングワイヤ、６……樹脂、７……絶縁性テー
プ、ｆ……幅広部、１０……ポリイミドテープ、
１１……タイバー、１２……外部リード、１３…
…サポートバー。
1 is a diagram showing a lead frame for a semiconductor device according to an embodiment of the present invention, FIG. 2 is a diagram showing a modification of the lead frame for the semiconductor device, and FIG. 3 is a diagram showing a conventional semiconductor device. 4a and 4b are diagrams showing a lead frame of the same semiconductor device, and FIG. 5 is a diagram showing an example of another lead frame. 1... Lead frame, 2... Die pad, 3
... Semiconductor element, 4 ... Internal lead, 4a ... First lead, 4b ... Second lead, 5 ... Bonding wire, 6 ... Resin, 7 ... Insulating tape, f ... Wide part , 10...polyimide tape,
11...Tie bar, 12...External lead, 13...
...Support bar.
Claims (1)
ダイパツドを支持するサポートバーと、先端が該
ダイパツドをとり囲むように延在せしめられた複
数の内部リードと、各内部リードから伸長する外
部リードとを具備したリードフレームにおいて、 これら内部リードの先端を絶縁性のテープによ
つて連結固定すると共にこの絶縁性のテープの両
端がサポートバーに貼着されるようにしたことを
特徴とする半導体装置用リードフレーム。[Claims for Utility Model Registration] A die pad for mounting a semiconductor element, a support bar that supports the die pad, a plurality of internal leads whose tips extend so as to surround the die pad, and each internal lead. In a lead frame equipped with external leads extending from the inside, the tips of these internal leads are connected and fixed with insulating tape, and both ends of this insulating tape are attached to the support bar. Characteristic lead frames for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7795088U JPH02743U (en) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7795088U JPH02743U (en) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02743U true JPH02743U (en) | 1990-01-05 |
Family
ID=31302906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7795088U Pending JPH02743U (en) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02743U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04170059A (en) * | 1990-11-02 | 1992-06-17 | Nec Kyushu Ltd | Lead frame |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236547B2 (en) * | 1980-01-31 | 1987-08-07 | Matsushita Electric Works Ltd | |
| JPS6373547A (en) * | 1986-09-16 | 1988-04-04 | Nec Corp | Lead frame of semiconductor device |
| JPH01106461A (en) * | 1987-10-20 | 1989-04-24 | Fujitsu Ltd | Lead frame |
-
1988
- 1988-06-13 JP JP7795088U patent/JPH02743U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6236547B2 (en) * | 1980-01-31 | 1987-08-07 | Matsushita Electric Works Ltd | |
| JPS6373547A (en) * | 1986-09-16 | 1988-04-04 | Nec Corp | Lead frame of semiconductor device |
| JPH01106461A (en) * | 1987-10-20 | 1989-04-24 | Fujitsu Ltd | Lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04170059A (en) * | 1990-11-02 | 1992-06-17 | Nec Kyushu Ltd | Lead frame |
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