JPH0323966U - - Google Patents
Info
- Publication number
- JPH0323966U JPH0323966U JP8470389U JP8470389U JPH0323966U JP H0323966 U JPH0323966 U JP H0323966U JP 8470389 U JP8470389 U JP 8470389U JP 8470389 U JP8470389 U JP 8470389U JP H0323966 U JPH0323966 U JP H0323966U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- wiring board
- printed wiring
- surface mount
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案にかかる表面実装用プリント配
線板１を示す図であり、同図ａは平面図、同図ｂ
は側面図、同図ｃ，ｄは同図ａに示すＡ−Ａ線上
要部側断面図、第２図は本考案の他の実施例を示
す図であり、同図ａは平面図、同図ｂは側面図、
同図ｃは同図ａのＢ−Ｂ線上要部側断面図、第３
図は他の形状のクリアランス８を示す図であり、
同図ａは平面図、同図ｂは側面図、第４図ａ，ｂ
は従来の表面実装用プリント配線板１の一例を示
す図である。
図中、１……表面実装用プリント配線板、２ａ
，２ｂ……パツト、３……表面実装部品、４ａ，
４ｂ……導体パターン、５……貫通穴、６……凹
部、７……半田フイレツト、８……クリアランス
、である。
FIG. 1 is a diagram showing a printed wiring board 1 for surface mounting according to the present invention, in which figure a is a plan view and figure b is a plan view.
1 is a side view, FIG. Figure b is a side view;
Figure c is a side cross-sectional view of the main part on the line B-B of Figure a;
The figure shows a clearance 8 of another shape,
Figure a is a plan view, figure b is a side view, figure 4 a, b
1 is a diagram showing an example of a conventional printed wiring board 1 for surface mounting. In the figure, 1... printed wiring board for surface mounting, 2a
, 2b...Putt, 3...Surface mount component, 4a,
4b... conductor pattern, 5... through hole, 6... recess, 7... solder fillet, 8... clearance.
Claims (1)
する表面実装用プリント配線板において、 前記パツトの所定部分に微小の貫通穴または微
小の凹部を形成したことを特徴とする表面実装用
プリント配線板。 (2) 表面実装部品の端子を接続するパツトと該
パツトに接続される導体パターンを有する表面実
装用プリント配線板において、 前記パツトには該パツトの導体パターンが接続
された部分近傍への熱の伝導を阻害するようにパ
ツドの一部を削除したクリアランスまたは貫通穴
または凹部を形成したことを特徴とする表面実装
用プリント配線板。[Claims for Utility Model Registration] (1) A surface mount printed wiring board having a patch for connecting a terminal of a surface mount component, characterized in that a minute through hole or a minute recess is formed in a predetermined portion of the pad. Printed wiring board for surface mounting. (2) In a surface mount printed wiring board having a pad for connecting a terminal of a surface mount component and a conductor pattern connected to the pad, the pad has a structure in which heat is not transmitted to the vicinity of the part of the pad to which the conductor pattern is connected. A printed wiring board for surface mounting, characterized in that a part of a pad is removed to form a clearance, a through hole, or a recess so as to inhibit conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8470389U JPH0323966U (en) | 1989-07-18 | 1989-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8470389U JPH0323966U (en) | 1989-07-18 | 1989-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323966U true JPH0323966U (en) | 1991-03-12 |
Family
ID=31633350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8470389U Pending JPH0323966U (en) | 1989-07-18 | 1989-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323966U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091144A (en) * | 2009-10-21 | 2011-05-06 | Fujitsu Telecom Networks Ltd | Printed board |
-
1989
- 1989-07-18 JP JP8470389U patent/JPH0323966U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091144A (en) * | 2009-10-21 | 2011-05-06 | Fujitsu Telecom Networks Ltd | Printed board |