JPH0282037U - - Google Patents
Info
- Publication number
- JPH0282037U JPH0282037U JP1988161926U JP16192688U JPH0282037U JP H0282037 U JPH0282037 U JP H0282037U JP 1988161926 U JP1988161926 U JP 1988161926U JP 16192688 U JP16192688 U JP 16192688U JP H0282037 U JPH0282037 U JP H0282037U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- suspender
- device hole
- hole
- carrier tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988161926U JPH0282037U (bs) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988161926U JPH0282037U (bs) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282037U true JPH0282037U (bs) | 1990-06-25 |
Family
ID=31445291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988161926U Pending JPH0282037U (bs) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282037U (bs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330354A (ja) * | 1995-06-05 | 1996-12-13 | Nec Corp | 半導体装置 |
-
1988
- 1988-12-13 JP JP1988161926U patent/JPH0282037U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330354A (ja) * | 1995-06-05 | 1996-12-13 | Nec Corp | 半導体装置 |
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