JPH0282049U - - Google Patents
Info
- Publication number
- JPH0282049U JPH0282049U JP16129788U JP16129788U JPH0282049U JP H0282049 U JPH0282049 U JP H0282049U JP 16129788 U JP16129788 U JP 16129788U JP 16129788 U JP16129788 U JP 16129788U JP H0282049 U JPH0282049 U JP H0282049U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- wiring board
- printed wiring
- component package
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す電子部品パツケ
ージの断面図、第２図は本考案の実施例を示す電
子部品パツケージの底面図、第３図は本考案の実
施例における端子及びスタツドオフピンの製造方
法説明図、第４図は第１図に示される電子部品パ
ツケージをプリント配線板に装着した状態を示す
部分断面図、第５図は一般的な電子部品パツケー
ジの破断側面図、第６図は従来のスタンドオフ構
造の説明図である。
４……ベース部材、６……孔、８……ガラス材
、１０……端子、１２……スタンドオフピン。
Fig. 1 is a sectional view of an electronic component package showing an embodiment of the present invention, Fig. 2 is a bottom view of an electronic component package showing an embodiment of the invention, and Fig. 3 is a terminal and stud-off in an embodiment of the invention. 4 is a partial cross-sectional view showing the electronic component package shown in FIG. 1 mounted on a printed wiring board; FIG. 5 is a cutaway side view of a general electronic component package; FIG. 6 is an explanatory diagram of a conventional standoff structure. 4... Base member, 6... Hole, 8... Glass material, 10... Terminal, 12... Standoff pin.
Claims (1)
リント配線板から所定距離離間して実装するため
のスタンドオフ構造において、 電子部品パツケージの構成部材のうちプリント
配線板側に位置するベース部材４に孔６を形成し
、 該孔６に充填されるガラス材８にスタンドオフ
ピン１２を立設したことを特徴とする電子部品パ
ツケージのスタンドオフ構造。[Scope of Claim for Utility Model Registration] In a standoff structure for mounting an electronic component package on a printed wiring board at a predetermined distance from the printed wiring board, a component located on the printed wiring board side among the constituent members of the electronic component package. A standoff structure for an electronic component package, characterized in that a hole 6 is formed in a base member 4, and a standoff pin 12 is erected in a glass material 8 filled in the hole 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16129788U JPH0282049U (en) | 1988-12-14 | 1988-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16129788U JPH0282049U (en) | 1988-12-14 | 1988-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282049U true JPH0282049U (en) | 1990-06-25 |
Family
ID=31444103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16129788U Pending JPH0282049U (en) | 1988-12-14 | 1988-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282049U (en) |
-
1988
- 1988-12-14 JP JP16129788U patent/JPH0282049U/ja active Pending