JPH0282053U - - Google Patents
Info
- Publication number
- JPH0282053U JPH0282053U JP16167788U JP16167788U JPH0282053U JP H0282053 U JPH0282053 U JP H0282053U JP 16167788 U JP16167788 U JP 16167788U JP 16167788 U JP16167788 U JP 16167788U JP H0282053 U JPH0282053 U JP H0282053U
- Authority
- JP
- Japan
- Prior art keywords
- board
- component
- lead terminal
- mounting
- dimension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Description
第１図乃至第４図は本考案の一実施例を示した
ものであり、第１図は電子部品の平面図、第２図
は同側面図、第３図は電子部品が取付けられた基
板の要部平面図、第４図は第３図のＡ−Ａ線断面
図である。第５図乃至第７図は従来例を示したも
のであり、第５図は部品が取付けられた基板の要
部平面図、第６図は第５図のＢ−Ｂ線断面図、第
７図は他の取付状態を示す基板の要部縦断面図で
ある。
１０……電子部品、１１……本体、１２……リ
ード端子、１２ａ……折曲部、１３……基板、１
５……取付孔、１６……ハンダ付、ｌ２……電子
部品の中心線と基板裏面との寸法、ｌ４……折曲
部から本体先端までの寸法、θ……折曲部の角度
。
Figures 1 to 4 show an embodiment of the present invention, in which Figure 1 is a plan view of an electronic component, Figure 2 is a side view of the same, and Figure 3 is a board on which the electronic component is attached. FIG. 4 is a sectional view taken along the line A--A in FIG. 3. 5 to 7 show a conventional example, in which FIG. 5 is a plan view of the main part of the board on which components are attached, FIG. 6 is a sectional view taken along line B-B in FIG. The figure is a vertical sectional view of the main part of the board showing another mounting state. DESCRIPTION OF SYMBOLS 10... Electronic component, 11... Main body, 12... Lead terminal, 12a... Bend part, 13... Board, 1
5...Mounting hole, 16...Soldering, l2...Dimension between the center line of the electronic component and the back surface of the board, l4...Dimension from the bent part to the tip of the main body, θ...Angle of the bent part.
Claims (1)
て取付けられたリード端子を有した部品の取付装
置に於て、前記部品のリード端子を所定寸法及び
所定角度に折曲し、基板に開穿した取付孔へ該リ
ード端子を挿通して取付孔の表面側をハンダ付し
、前記部品の基板からの取付寸法を規制したこと
を特徴とするリード端子を有した部品の取付装置
。 In a mounting device for a component having a lead terminal attached parallel to a board surface and protruding to the side of the board, the lead terminal of the component is bent to a predetermined dimension and at a predetermined angle, and then opened to the board. 1. A mounting device for a component having a lead terminal, characterized in that the lead terminal is inserted into a drilled mounting hole, the surface side of the mounting hole is soldered, and the mounting dimension of the component from a board is regulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16167788U JPH0282053U (en) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16167788U JPH0282053U (en) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282053U true JPH0282053U (en) | 1990-06-25 |
Family
ID=31444830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16167788U Pending JPH0282053U (en) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282053U (en) |
-
1988
- 1988-12-13 JP JP16167788U patent/JPH0282053U/ja active Pending
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