JPH0282067U - - Google Patents
Info
- Publication number
- JPH0282067U JPH0282067U JP16258488U JP16258488U JPH0282067U JP H0282067 U JPH0282067 U JP H0282067U JP 16258488 U JP16258488 U JP 16258488U JP 16258488 U JP16258488 U JP 16258488U JP H0282067 U JPH0282067 U JP H0282067U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible circuit
- copper pattern
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図及び第２図は本考案の実施例であり、第
１図Ａは要部の一部切欠縦断面図、同図Ｂは同Ｐ
Ｃ板の一部切欠平面図、第２図Ａは他の実施例の
一部切欠縦断側面図、同図Ｂは同ＰＣ板の一部切
欠平面図である。第３図及び第４図は従来型を示
し、夫々一部切欠縦断面図である。
１……ＰＣ板、２，４……銅パターン、３……
ＦＰＣ、５……ハンダ、６……補材。
Figures 1 and 2 show an embodiment of the present invention, with Figure 1A being a partially cutaway vertical sectional view of the main part, and Figure 1B being the same P.
FIG. 2A is a partially cutaway plan view of the C board, FIG. 2A is a partially cutaway vertical side view of another embodiment, and FIG. 2B is a partially cutaway plan view of the same PC board. FIGS. 3 and 4 show a conventional type, and each is a partially cut away longitudinal sectional view. 1...PC board, 2, 4...Copper pattern, 3...
FPC, 5...Solder, 6...Supplementary material.
Claims (1)
置であつて、該装置はプリント基板の銅パターン
にフレキシブル基板の銅パターンを向い合せて重
ねられ、該重ね部位をハンダ付けすると共に、前
記フレキシブル基板は折返されてプリント基板の
外側に取出され、更に、該折返しにて形成される
間隙に、前記プリント基板の一部を切取つて形成
した補材を介装したことを特徴とするフレキシブ
ル基板とプリント基板との接続装置。 A device for connecting a flexible circuit board to a printed circuit board, wherein the copper pattern of the flexible circuit board is overlapped with the copper pattern of the printed circuit board facing each other, the overlapping portion is soldered, and the flexible circuit board is folded back. A connection between a flexible circuit board and a printed circuit board, characterized in that an auxiliary material is taken out to the outside of the printed circuit board and further formed by cutting out a part of the printed circuit board in the gap formed by the folding. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16258488U JPH0282067U (en) | 1988-12-15 | 1988-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16258488U JPH0282067U (en) | 1988-12-15 | 1988-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282067U true JPH0282067U (en) | 1990-06-25 |
Family
ID=31446542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16258488U Pending JPH0282067U (en) | 1988-12-15 | 1988-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282067U (en) |
-
1988
- 1988-12-15 JP JP16258488U patent/JPH0282067U/ja active Pending