JPH0282542U - - Google Patents

Info

Publication number
JPH0282542U
JPH0282542U JP1988162539U JP16253988U JPH0282542U JP H0282542 U JPH0282542 U JP H0282542U JP 1988162539 U JP1988162539 U JP 1988162539U JP 16253988 U JP16253988 U JP 16253988U JP H0282542 U JPH0282542 U JP H0282542U
Authority
JP
Japan
Prior art keywords
led chip
bonding wire
led
printer head
connects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988162539U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988162539U priority Critical patent/JPH0282542U/ja
Publication of JPH0282542U publication Critical patent/JPH0282542U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係るプリンタヘツドのＬＥＤ
チツプ近傍の発光状況を示す説明図、第２図は本
考案に係るボンデイングワイヤの説明図、第３図
は従来のプリンタヘツドのＬＥＤチツプ近傍の発
光状況を示す説明図、第４図はＬＥＤプリンタヘ
ツドとドラムの具体的配置関係を示す説明図であ
る。 １……ＬＥＤチツプ、１ａ……発光領域、３，
３′……ボンデイングワイヤ、３ａ……コーテイ
ング、４……セラミツク基板、５……セルフオツ
クレンズ、１０……感光体ドラム、２０……出力
光、２１……拡散光、２１ａ……反射散乱光。 Figure 1 shows the LED of the printer head according to the present invention.
An explanatory diagram showing the light emitting situation near the chip, FIG. 2 is an explanatory diagram of the bonding wire according to the present invention, FIG. 3 is an explanatory diagram showing the light emitting situation near the LED chip of a conventional printer head, and FIG. 4 is an explanatory diagram of the LED printer. FIG. 3 is an explanatory diagram showing a specific arrangement relationship between a head and a drum. 1... LED chip, 1a... Light emitting area, 3,
3'... bonding wire, 3a... coating, 4... ceramic substrate, 5... self-cleaning lens, 10... photosensitive drum, 20... output light, 21... diffused light, 21a... reflected scattered light .

Claims (1)

【実用新案登録請求の範囲】 (1) ＬＥＤチツプと他の半導体素子とを連結す
るボンデイングワイヤの表面をＬＥＤチツプより
発した光を吸収し得る色に染色してなるＬＥＤプ
リンタヘツド。 (2) ＬＥＤチツプと他の半導体素子とを連結す
るボンデイングワイヤにＬＥＤチツプより発した
光を吸収し得る樹脂等をコーテイングしてなるＬ
ＥＤプリンタヘツド。[Claims for Utility Model Registration] (1) An LED printer head made by dyeing the surface of a bonding wire that connects an LED chip and another semiconductor element with a color capable of absorbing light emitted from the LED chip. (2) An L formed by coating a bonding wire that connects an LED chip with another semiconductor element with a resin that can absorb the light emitted from the LED chip.
ED printer head.
JP1988162539U 1988-12-15 1988-12-15 Pending JPH0282542U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988162539U JPH0282542U (en) 1988-12-15 1988-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988162539U JPH0282542U (en) 1988-12-15 1988-12-15

Publications (1)

Publication Number Publication Date
JPH0282542U true JPH0282542U (en) 1990-06-26

Family

ID=31446457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988162539U Pending JPH0282542U (en) 1988-12-15 1988-12-15

Country Status (1)

Country Link
JP (1) JPH0282542U (en)

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