JPH0367461U - - Google Patents

Info

Publication number
JPH0367461U
JPH0367461U JP1989128382U JP12838289U JPH0367461U JP H0367461 U JPH0367461 U JP H0367461U JP 1989128382 U JP1989128382 U JP 1989128382U JP 12838289 U JP12838289 U JP 12838289U JP H0367461 U JPH0367461 U JP H0367461U
Authority
JP
Japan
Prior art keywords
light emitting
lead frame
bonded
emitting chip
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989128382U
Other languages
Japanese (ja)
Other versions
JP2519504Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989128382U priority Critical patent/JP2519504Y2/en
Publication of JPH0367461U publication Critical patent/JPH0367461U/ja
Application granted granted Critical
Publication of JP2519504Y2 publication Critical patent/JP2519504Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の具体的な一実施例に係るＬＥ
Ｄ及びその光路を示した縦断面図。第２図は第１
図のＬＥＤで基台が成形され、発光チツプが接合
されたリードフレームを示した縦断面図。第３図
は従来のＬＥＤのリードフレームを示した斜視図
。第４図は第３図のリードフレームに発光チツプ
が接合された状態を示した部分縦断面図。第５図
は従来の他のＬＥＤを示した縦断面図である。 １０……発光ダイオード（ＬＥＤ）、１１，１
６……リード部材、１３，１８……平坦部、１９
……レンズ部材、２０……リードフレーム、２１
……基台、２８……発光チツプ。 FIG. 1 shows an LE according to a specific embodiment of the present invention.
A vertical cross-sectional view showing D and its optical path. Figure 2 is the first
FIG. 2 is a longitudinal cross-sectional view showing a lead frame in which a base is formed from the LED shown in the figure and a light emitting chip is bonded thereto. FIG. 3 is a perspective view showing a conventional LED lead frame. FIG. 4 is a partial vertical sectional view showing a state in which a light emitting chip is bonded to the lead frame of FIG. 3. FIG. 5 is a longitudinal sectional view showing another conventional LED. 10... Light emitting diode (LED), 11,1
6... Lead member, 13, 18... Flat part, 19
... Lens member, 20 ... Lead frame, 21
...Base, 28...Light-emitting chip.

Claims (1)

【実用新案登録請求の範囲】 光を放射する発光チツプがリードフレームに接
合され樹脂成形された発光ダイオードにおいて、 前記リードフレームに形成され、前記発光チツ
プが接合される平面である平坦部と、 前記平坦部に接合される前記発光チツプの端面
の周囲で該平坦部から外側に前記発光ダイオード
の外形寸法まで傾斜し、前記発光チツプから放射
された光を前面に反射させるように前記リードフ
レームに樹脂成形された基台と、 前記基台が形成され、前記発光チツプが前記リ
ードフレームに接合された後、前記基台上でその
外形寸法と同じに樹脂成形されたレンズ部材と を備えたことを特徴とする発光ダイオード。[Claims for Utility Model Registration] A light emitting diode in which a light emitting chip that emits light is bonded to a lead frame and molded with resin, comprising: a flat portion that is a plane formed on the lead frame and to which the light emitting chip is bonded; A resin is attached to the lead frame so as to be inclined outward from the flat part to the outer dimensions of the light emitting diode around the end face of the light emitting chip to be bonded to the flat part, and to reflect light emitted from the light emitting chip to the front surface. A molded base; and a lens member resin-molded on the base to have the same external dimensions as the base after the base is formed and the light emitting chip is bonded to the lead frame. Features a light emitting diode.
JP1989128382U 1989-10-31 1989-10-31 Light emitting diode Expired - Fee Related JP2519504Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989128382U JP2519504Y2 (en) 1989-10-31 1989-10-31 Light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989128382U JP2519504Y2 (en) 1989-10-31 1989-10-31 Light emitting diode

Publications (2)

Publication Number Publication Date
JPH0367461U true JPH0367461U (en) 1991-07-01
JP2519504Y2 JP2519504Y2 (en) 1996-12-04

Family

ID=31676090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989128382U Expired - Fee Related JP2519504Y2 (en) 1989-10-31 1989-10-31 Light emitting diode

Country Status (1)

Country Link
JP (1) JP2519504Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790347B1 (en) * 2006-10-27 2008-01-02 주식회사 대목환경건설 Vegetation Blocks for Aquatic Plants
JP2010125647A (en) * 2008-11-26 2010-06-10 Towa Corp Compression molding method of optical molded article and mold
CN105340090A (en) * 2013-06-28 2016-02-17 皇家飞利浦有限公司 Light emitting diode device
JP2016528722A (en) * 2013-06-28 2016-09-15 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． Light emitting diode device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59713024D1 (en) 1996-06-26 2010-01-28 Osram Opto Semiconductors Gmbh Light-emitting semiconductor chip and light-emitting semiconductor component and method for its production

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508884U (en) * 1973-05-18 1975-01-29
JPS587364U (en) * 1981-07-07 1983-01-18 スタンレー電気株式会社 light emitting diode lamp
JPS6315483A (en) * 1986-07-07 1988-01-22 Toyoda Gosei Co Ltd Lead frame for light-emitting diode

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508884U (en) * 1973-05-18 1975-01-29
JPS587364U (en) * 1981-07-07 1983-01-18 スタンレー電気株式会社 light emitting diode lamp
JPS6315483A (en) * 1986-07-07 1988-01-22 Toyoda Gosei Co Ltd Lead frame for light-emitting diode

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790347B1 (en) * 2006-10-27 2008-01-02 주식회사 대목환경건설 Vegetation Blocks for Aquatic Plants
JP2010125647A (en) * 2008-11-26 2010-06-10 Towa Corp Compression molding method of optical molded article and mold
CN105340090A (en) * 2013-06-28 2016-02-17 皇家飞利浦有限公司 Light emitting diode device
JP2016528722A (en) * 2013-06-28 2016-09-15 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． Light emitting diode device
US10038122B2 (en) 2013-06-28 2018-07-31 Lumileds Llc Light emitting diode device

Also Published As

Publication number Publication date
JP2519504Y2 (en) 1996-12-04

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Legal Events

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LAPS Cancellation because of no payment of annual fees