JPH02825U - - Google Patents
Info
- Publication number
- JPH02825U JPH02825U JP7741588U JP7741588U JPH02825U JP H02825 U JPH02825 U JP H02825U JP 7741588 U JP7741588 U JP 7741588U JP 7741588 U JP7741588 U JP 7741588U JP H02825 U JPH02825 U JP H02825U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- substrate
- acoustic wave
- surface acoustic
- wave element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 238000010897 surface acoustic wave method Methods 0.000 claims 2
- 239000010408 film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図ａ，ｂは本考案の一実施例を説明するた
めのチツプの平面図及びＡ―Ａ′線断面拡大図、
第２図及び第３図は従来のパターンの形状を示す
平面図、第４図は従来のチツプが正常にダイボン
デイングされた場合のパターンの反射光と受光器
の関係を示す模式図、第５図は従来のチツプが傾
いてダイボンデイングされた場合のパターンの反
射光と受光器の関係を示す模式図である。
１…基板、２…パターン、３…薄膜、４…入射
光、５…反射光、６…透過光、７…チツプ、８…
パツケージ、９…受光器。
Figures 1a and 1b are a plan view and an enlarged cross-sectional view taken along the line A-A' of the chip for explaining one embodiment of the present invention;
2 and 3 are plan views showing the shape of a conventional pattern, FIG. 4 is a schematic diagram showing the relationship between the reflected light of the pattern and the light receiver when a conventional chip is normally die-bonded, and FIG. The figure is a schematic diagram showing the relationship between reflected light from a pattern and a light receiver when die bonding is performed with a conventional chip tilted. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Pattern, 3... Thin film, 4... Incident light, 5... Reflected light, 6... Transmitted light, 7... Chip, 8...
Package cage, 9... Light receiver.
Claims (1)
を検出するためのパターンを有する弾性表面波素
子において、前記パターンが膜厚の１／２乃至２
倍の幅を有する短冊状の薄膜を複数配列して形成
されることを特徴とする弾性表面波素子。 In a surface acoustic wave element having a pattern formed on a substrate for detecting bonding coordinates of the substrate, the pattern has a thickness of 1/2 to 2 of the film thickness.
A surface acoustic wave element characterized in that it is formed by arranging a plurality of strip-shaped thin films each having double the width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7741588U JPH02825U (en) | 1988-06-10 | 1988-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7741588U JPH02825U (en) | 1988-06-10 | 1988-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02825U true JPH02825U (en) | 1990-01-05 |
Family
ID=31302401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7741588U Pending JPH02825U (en) | 1988-06-10 | 1988-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02825U (en) |
-
1988
- 1988-06-10 JP JP7741588U patent/JPH02825U/ja active Pending