JPH0282630A - Device for forming semiconductor chip array - Google Patents

Abstract

PURPOSE:To reduce the number of manufacturing steps and to prevent rear chipping from scattering on the surface of a semiconductor chip by irradiating only a region adhering with the chip of a UV tape conveyed to a chip array with ultraviolet light, and then peeling the chip from the tape. CONSTITUTION:A chip array 14 is evacuated in vacuum, and a UV tape 12 placed on a cap 15 is secured to the chip array 14. UV light is emitted from a UV illuminator 20 as from a spotlight in this state, reflected by a mirror 21 to radiate to the tape 12 and a semiconductor chip 13 adhering thereto. Thus, since the adhering strength of the tape 12 of the part radiated with the light is reduced, the chip 13 adhering thereto is easily peeled. Then, a lifter 22 is lifted to peel the chip 13 from the tape 12 by many lifting styluses 23 implanted onto the lifter 22.

Description

[Detailed description of the invention] 〔overview〕 Regarding semiconductor chip arrangement and array equipment.

The purpose is to reduce the number of manufacturing steps by simultaneously performing UV irradiation and chip arrangement, and to prevent the occurrence of malfunctioning chips by preventing front chipping from jumping onto the chip surface.

Adhesive strength decreases when irradiated with ultraviolet light. After irradiating the semiconductor chips adhered to the surface of the UV tape with ultraviolet light to make them easier to peel off, a collet is used to peel the semiconductor chips from the UV tape and arrange them in a semiconductor chip array device. ,
The chip array section includes a chip array section having a push-up section equipped with a semiconductor chip push-up means, and a UV irradiation section into which ultraviolet light is introduced from a UV device that generates spot-like ultraviolet light in the area where the semiconductor chips are bonded. has been transported to. U is applied only to the area where the semiconductor chip of the UV tape is bonded.
After irradiating ultraviolet light from the V irradiation section.

By means of pushing up the semiconductor chip in the pushing up part.

The semiconductor chip 7 is configured to be peeled off from the UV tape.

[Industrial application field]

The present invention relates to a semiconductor chip array device, and particularly to a semiconductor chip array device that integrates a UV irradiation section and a chip array section and prevents the occurrence of back side chipping.

With the automation of semiconductor chip processing, it is becoming increasingly common to attach a semiconductor wafer to an adhesive tape and then dice it into individual IC chips.

For this reason, we provide a tape that has high adhesive strength so that the semiconductor chip does not peel off from the tape during dicing, and has low adhesive strength so that it can be easily peeled off when the semiconductor chip is peeled off from the tape after dicing. has been done.

This tape is called a UV tape because its adhesive strength is reduced each time it is irradiated with ultraviolet light (UV).

However, by using UV tape.

Since the number of UV irradiation steps increases, in order to improve productivity, UV irradiation and chip arrangement can be performed at the same time.

It needs to be done in a small space.

In addition, back side chipping (semiconductor chips) that occurs when peeling a semiconductor chip from the UV tape can damage the surface of the semiconductor chip and cause malfunctioning chips, so please be careful about the location and illuminance where UV irradiation is performed. It is necessary to prevent the occurrence of back side chipping by controlling.

[Conventional technology]

In conventional semiconductor chip array equipment, after dicing a semiconductor wafer pasted on UV tape, it is irradiated with UV light and placed in a chip array equipment.
Each chip was picked up and arranged.

[Problem to be solved by the invention]

In conventional semiconductor chip array devices, backside chipping that occurs along the scribe line on the backside of the semiconductor chip during dicing jumps onto the surface of the semiconductor chip when the semiconductor chip is picked up, causing malfunction. There was a problem.

Furthermore, since UV irradiation is performed all at once as an independent process, there is a problem in that the number of manufacturing processes increases by five.

The present invention solves these problems, reduces the number of manufacturing steps by simultaneously performing UV irradiation and chip arrangement, and prevents backside chipping from jumping onto the surface of the semiconductor chip. The object of the present invention is to provide a semiconductor chip array device.

[Failure to solve the problem]

In order to achieve the above object, the semiconductor chip array device according to the present invention has UV
In a semiconductor chip array device, in which semiconductor chips adhered to the surface of a tape are irradiated with ultraviolet light to make them easy to peel off, and then the semiconductor chips are arranged at a distance of 11 from the UV tape using a collet.

The chip array section includes a chip array section having a push-up section equipped with a semiconductor chip push-up means, and a UV irradiation section into which ultraviolet light is introduced from a UV device that generates spot-like ultraviolet light in the area where the semiconductor chips are bonded. has been transported to. U is applied only to the area where the semiconductor chip of the UV tape is bonded.
After irradiating ultraviolet light from the V irradiation section, the semiconductor chip is peeled off from the UV tape by the semiconductor chip push-up means of the push-up section.

FIG. 1 is a diagram explaining the principle of the present invention.

In Figure 1, 1 is a UV tape, 2 is a semiconductor chip,
3 is a chip arrangement part, 4 is a push-up part, 5 is a push-up needle,
6 is a collet, 7 is a substrate IV device, 8 is an optical fiber, and 9 is a UV irradiation unit.

A semiconductor chip 2 is attached to the UV tape 1.

The semiconductor chip 2 is an LSI or IC that has been diced.
These are semiconductor chips such as

The inside of the chip array section 3 is evacuated.

He was transported on top of that. This is the part where the semiconductor chip 2 attached to the UV tape 1 is peeled off by being irradiated with UV light by the UV irradiation unit 9.

A plurality of push-up needles 5 are planted on the push-up portion 4.

The push-up needle 5 is made of U whose adhesive strength has decreased due to UV light irradiation.
This is for breaking through the V-tape 1 and peeling off the semiconductor chip 2.

The collet 6 is for attracting and moving the semiconductor chips 2 peeled off by the push-up needles 5, and arranging them on a tray.

The UV device 7 is a device for generating spot-like UV light.

The optical fiber 8 receives the UV generated by the spot UV device 7.
This is for introducing light into the UV irradiation section 9.

The UV irradiation unit 9 is for irradiating UV light onto the adhesive portion between the UV tape 1 and the semiconductor chip 2.

[Effect]

The semiconductor chip array device of the present invention has a chip array section 3 and a U
The V irradiation section 9 is integrated.

The semiconductor wafer diced into individual semiconductor chips 2 is placed on the chip array section 3 while being adhered to the UV tape 1. The size of the chip array section 3 is the size of one semiconductor chip 2.

Since the chip array section 3 is evacuated, the UV tape 1 placed on the chip array section 3 is fixed to the chip array section 3. In this state, the UV irradiation section 9 irradiates spot-shaped UV light onto the UV tape 1 and the semiconductor chip 2 bonded thereon. Then, the adhesive strength of the UV tape 1 in the portion irradiated with UV light decreases, and the semiconductor chip 2 bonded thereon becomes easily peeled off.

Next, the push-up portion 4 is raised, and the semiconductor chip 2 is peeled off from the UV tape 1 using the push-up needles 5 set on the push-up portion 4 in large numbers.

The semiconductor chip 2 is peeled off from the UV tape 1.

They are attracted and moved by the collet 6 and arranged on a tray.

In this way, in the semiconductor chip array device of the present invention, U
Since V irradiation and chip arrangement are performed simultaneously, the number of manufacturing steps can be reduced. Also, UV irradiation is 1
Since it is performed on the area of one semiconductor chip per time,
It is possible to prevent backside chipping from jumping onto the surface of the semiconductor chip, and malfunction of the semiconductor chip can be prevented.

〔Example〕

FIG. 2 is a block diagram of one embodiment of the present invention.

In Fig. 2, 11 is a frame, 12 is a UV tape,
13 is a semiconductor chip, 14 is a chip array section, 15 is a cap, 16 is a recognition camera, 17 is a spot UV device, 1
8 is a UV light source, 19 is an optical fiber, 20 is a UV irradiation section, 21 is a mirror, 22 is a push-up section, and 23 is a push-up needle.

The frame 11 is for supporting the UV tape 12.

A semiconductor chip 13 is attached to the UV tape 12.

The semiconductor chip 13 is an LSI, an I
It is a semiconductor chip such as C.

The inside of the chip array section 14 was evacuated, and the chip arrangement section 14 was transported onto the vacuum. This is the part where the semiconductor chip 13 attached to the UV tape 12 is irradiated with UV light and peeled off.

The camp 15 is a portion that absorbs the UV tape 12 to which the semiconductor chip 13 is attached.

The recognition camera 16 is for determining whether the semiconductor chip 13 conveyed onto the chip array section 14 is a good product or a defective product.

A UV light source 18 is provided inside the spot UV device 17 .

The U-light a18 is a light source for generating spot-like UV light.

The optical fiber 19 is for introducing the UV light generated by the UV device 17 into the UV irradiation section 20 .

The UV irradiation unit 20 is for irradiating UV light onto the adhesive portion between the UV tape 12 and the semiconductor chip 13.

The mirror 21 is for directing the UV light from the UV irradiation unit 20 toward the bonded portion between the UV tape 12 and the semiconductor chip 13.

A plurality of push-up needles 23 are installed in the push-up portion 22.

The push-up needle 23 is made of U whose adhesive strength has decreased due to UV irradiation.
This is for breaking through the V-tape 12 and peeling off the semiconductor chip 13.

An embodiment of the present invention will be described below with reference to FIG.

In the semiconductor chip array device of the present invention, the chip array section 14 and the UV irradiation section 20 are integrated.

The semiconductor wafer, which has been glued into individual semiconductor chips 13, is placed on the cap 15 on the chip arrangement section 14 while being adhered to the UV tape 12. The size of the cap 15 is the size of one semiconductor chip 13.

Since the chip array section 14 is evacuated, camp 1
The UV tape 12 placed on the chip arrangement section 14
is fixed to. In this state, the UV irradiation section 20 emits a spot of UV light.

The light is reflected by a mirror 21 and irradiated onto the UV tape 12 and the semiconductor chip 13 bonded thereon. Then, the UV tape 12 in the area irradiated with UV light
Since the adhesive strength of the semiconductor chip 13 bonded thereon decreases, the semiconductor chip 13 bonded thereon becomes easily peeled off. Next, the push-up portion 22
is raised, and the semiconductor chip 13 is attached to the UV tape 12 by the push-up needles 23 planted on the push-up portion 22.
Peel it off.

The semiconductor chips 13 peeled off from the UV tape 12 are attracted and moved by a collet (not shown) and arranged on a tray or the like.

In this way, in the semiconductor chip array device of the present invention, UV
Since irradiation and chip arrangement are performed simultaneously, the number of manufacturing steps can be reduced. Further, since UV irradiation is applied to an area corresponding to one semiconductor chip at a time, it is possible to prevent backside chipping from jumping onto the surface of the semiconductor chip, and malfunction of the semiconductor chip can be prevented.

The UV light irradiation by the UV irradiation unit 20 may be performed in a spot-like manner using a shutter as shown in FIG. 2, or may be performed in a spot-like manner by blinking the UV light source 18.

In addition, in FIG. 2, the UV irradiation section 20 is connected to the chip array section 14.
Although it is provided on the side surface of the raised portion 22, it may be provided in an annular shape around the raised portion 22.

〔Effect of the invention〕

According to the present invention, it is possible to reduce the number of manufacturing steps by simultaneously performing UV irradiation and chip arrangement, and to prevent malfunctioning chips from occurring by preventing backside chipping from jumping onto the chip surface. Can be done.

Due to these effects, the present invention greatly contributes to improving the reliability of semiconductor devices such as LSI and 1C.

[Brief explanation of the drawing]

FIG. 1 is a diagram explaining the principle of the present invention. Figure 2 is a configuration diagram of one embodiment of the present invention. It is. In Figure 1 1: UV tape 2: Semiconductor chip 3: Chip array section 4: Push-up part 5; Push-up needle 6: Colette 7: Spot UV device 8: Optical fiber :U■irradiation part

Claims (1)

[Claims] UV tape (1) whose adhesive strength decreases when irradiated with ultraviolet light
In a semiconductor chip array device in which the semiconductor chips (2) bonded to the surface of the UV tape (1) are irradiated with ultraviolet light to make them easier to peel off, and then the semiconductor chips (2) are peeled off from the UV tape (1) by a collet (6) and arranged. , a push-up section (with a semiconductor chip push-up means (5))
A UV device (
A UV irradiation section (9) is provided, into which ultraviolet light is introduced from 7).
) After irradiating ultraviolet light from the UV irradiation part (9) only to the area where the semiconductor chip (2) of
A semiconductor chip array device characterized in that the semiconductor chip (2) is peeled off from the UV tape (1) by the semiconductor chip pushing means (5).