JPH028368A - Automatic film-forming equipment - Google Patents

Automatic film-forming equipment

Info

Publication number
JPH028368A
JPH028368A JP15967088A JP15967088A JPH028368A JP H028368 A JPH028368 A JP H028368A JP 15967088 A JP15967088 A JP 15967088A JP 15967088 A JP15967088 A JP 15967088A JP H028368 A JPH028368 A JP H028368A
Authority
JP
Japan
Prior art keywords
film
laser light
sputtering
photodetector
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15967088A
Other languages
Japanese (ja)
Inventor
Masami Senda
千田 雅美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP15967088A priority Critical patent/JPH028368A/en
Publication of JPH028368A publication Critical patent/JPH028368A/en
Pending legal-status Critical Current

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  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To shorten the length of time required for the feedback of film-forming conditions by making laser light incident upon the film surface of a substrate on which a film is formed in a chamber and then making the reflected laser light incident upon a photodetector. CONSTITUTION:The inside of a chamber 10 in a sputtering device is constituted so that it is provided with a laser light emitting device 1 and a photodetector 2, and a film formed on a substrate 3 is irradiated with laser light from the laser light emitting device 1. Subsequently, the laser light reflected from the film is made incident upon the photodetector 2 and measured, and the measured signals are sent to a sputtering condition-control part 7. The conditions for the subsequent sputtering are determined from the measured reflectivity in the sputtering condition-control part 7 and a sputtering controller 6 is controlled to make preparations for the subsequent sputtering. By this method, stable film formation in large quantities can be continuously carried out.

Description

【発明の詳細な説明】 C産業上の利用分野〕 本発明は、自動成膜装置、特にスパッタおよび蒸着等に
より薄膜を作成する自動成膜装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Use] The present invention relates to an automatic film forming apparatus, particularly an automatic film forming apparatus for forming thin films by sputtering, vapor deposition, or the like.

〔従来の技術〕[Conventional technology]

従来の自動成膜装置は、真空なチェンバーから取り出し
て成膜された薄膜の反射率を測定していた。
Conventional automatic film deposition equipment measures the reflectance of a thin film that has been deposited by taking it out of a vacuum chamber.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、このような上述した従来の自動成膜装置
は、チェンバーから成膜した基板を取り出して薄膜の反
射率を測定しているため、次の成膜条件へのフィードバ
ックに時間がかかってしまうという欠点があった。
However, in the above-mentioned conventional automatic film deposition equipment, the substrate on which the film has been deposited is removed from the chamber and the reflectance of the thin film is measured, which takes time to provide feedback to the next deposition conditions. There were drawbacks.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の自動成膜装置は、チェンバー内に成膜した膜面
上にレーザ光が入射するように設置したレーザ光発生器
と、膜面より反射したレーザ光を入射するように設置し
たフォトディテクタと、ディテクタ出力信号を処理し成
膜条件を制御する成膜条件制御部を有して構成される。
The automatic film forming apparatus of the present invention includes a laser light generator installed in a chamber so that laser light is incident on the film surface formed on the film, and a photodetector installed so that the laser light reflected from the film surface is incident. , a film-forming condition control unit that processes the detector output signal and controls film-forming conditions.

〔実施例〕〔Example〕

次に、本発明の実施例について、図面を参照して説明す
る。
Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例を示す概略図である。FIG. 1 is a schematic diagram showing an embodiment of the present invention.

第1図に示す自動成膜装置は、スパッタ装置のチェンバ
ー代理人に基板3上に成膜された膜ヘレーザ光が入射す
るようにレーザ光発生器1が設置され、膜より反射した
レーザ光が入射するようにフォトディテクタ2が設置さ
れている。
In the automatic film forming apparatus shown in FIG. 1, a laser light generator 1 is installed so that laser light is incident on a film formed on a substrate 3 in a chamber of a sputtering apparatus, and the laser light reflected from the film is A photodetector 2 is installed so that the light is incident.

基板3に成膜された膜の反射率はフォトディテクタ2へ
のレーザ光入射光量により測定され測定値信号はスパッ
タ条件制御用コントローラ7に送られる。スパッタ条件
制御用コントローラ7は測定された反射率により次のス
パッタ条件を決定しスパッタ制御部6を制御して次の成
膜にそなえる。
The reflectance of the film formed on the substrate 3 is measured by the amount of laser light incident on the photodetector 2, and a measured value signal is sent to the controller 7 for controlling sputtering conditions. The sputtering condition control controller 7 determines the next sputtering condition based on the measured reflectance and controls the sputtering control section 6 to prepare for the next film formation.

上述の実施例では成膜条件制御部としてスパッタ条件制
御用コントローラおよびスパッタ制御部からなる例を示
したが、これらは一体として構成されていてもよく、ま
た蒸着によるものであってもよい。
In the above-mentioned embodiment, an example was shown in which the film-forming condition control section consisted of a sputtering condition control controller and a sputtering control section, but these may be configured as one body or may be formed by vapor deposition.

〔発明の効果〕〔Effect of the invention〕

本発明の自動成膜装置は、チェンバー内にレーザ光発生
器とフォトディテクタを追加し成膜直後の膜の反射率を
測定できるため、次の成膜条件の決定が迅速に行なえる
ので、成膜条件のフィードバックに要する時間が短縮で
きるから安定に大量の成膜を連続して行なうことができ
るという効果がある。
The automatic film deposition apparatus of the present invention adds a laser light generator and a photodetector to the chamber and can measure the reflectance of the film immediately after deposition, so the next deposition conditions can be quickly determined. Since the time required for feedback of conditions can be shortened, a large amount of film can be deposited continuously and stably.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す概略図である。 1・・・・・・レーザ光発生器、2・・・・・・フォト
ディテクタ、3・・・・・・基板、4・・・・・・ター
ゲット、5・・・・・・シャッタ、6・・・・・・スパ
ッタコントローラ、7・・・・・・スパッタ条件制御部
、10・・・・・・チェンバー代理人 弁理士  内 
原   晋
FIG. 1 is a schematic diagram showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Laser beam generator, 2...Photodetector, 3...Substrate, 4...Target, 5...Shutter, 6... ... Sputter controller, 7 ... Sputter condition control unit, 10 ... Chamber agent, patent attorney
Susumu Hara

Claims (1)

【特許請求の範囲】[Claims] チェンバーと、前記チェンバー内に成膜した基板の膜面
上にレーザ光が入射するように配置されたレーザ光発生
器と、膜面より反射したレーザ光を入射するように設置
したフォトディテクタと、ディテクタ出力信号を処理し
成膜条件を制御する成膜条件制御部を含むことを特徴と
する自動成膜装置。
a chamber, a laser light generator arranged so that a laser beam is incident on the film surface of a substrate formed in the chamber, a photodetector arranged so that the laser light reflected from the film surface is incident, and a detector. An automatic film deposition apparatus characterized by including a deposition condition control section that processes output signals and controls deposition conditions.
JP15967088A 1988-06-27 1988-06-27 Automatic film-forming equipment Pending JPH028368A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15967088A JPH028368A (en) 1988-06-27 1988-06-27 Automatic film-forming equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15967088A JPH028368A (en) 1988-06-27 1988-06-27 Automatic film-forming equipment

Publications (1)

Publication Number Publication Date
JPH028368A true JPH028368A (en) 1990-01-11

Family

ID=15698768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15967088A Pending JPH028368A (en) 1988-06-27 1988-06-27 Automatic film-forming equipment

Country Status (1)

Country Link
JP (1) JPH028368A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110236569A1 (en) * 2010-03-29 2011-09-29 Weiller Bruce H Systems and methods for preventing or reducing contamination enhanced laser induced damage (c-lid) to optical components using gas phase additives

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110236569A1 (en) * 2010-03-29 2011-09-29 Weiller Bruce H Systems and methods for preventing or reducing contamination enhanced laser induced damage (c-lid) to optical components using gas phase additives
US9498846B2 (en) * 2010-03-29 2016-11-22 The Aerospace Corporation Systems and methods for preventing or reducing contamination enhanced laser induced damage (C-LID) to optical components using gas phase additives
US10155284B2 (en) 2010-03-29 2018-12-18 The Aerospace Corporation Systems and methods for preventing or reducing contamination enhanced laser induced damage (C-LID) to optical components using gas phase additives

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