JPH0284319U - - Google Patents

Info

Publication number
JPH0284319U
JPH0284319U JP16401188U JP16401188U JPH0284319U JP H0284319 U JPH0284319 U JP H0284319U JP 16401188 U JP16401188 U JP 16401188U JP 16401188 U JP16401188 U JP 16401188U JP H0284319 U JPH0284319 U JP H0284319U
Authority
JP
Japan
Prior art keywords
heat
plate
semiconductor wafer
nameplate
wafer carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16401188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16401188U priority Critical patent/JPH0284319U/ja
Publication of JPH0284319U publication Critical patent/JPH0284319U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面はこの考案に係る半導体ウエーハーキヤリ
アー用銘板の一実施例を示すものであり、第１図
はその斜視図、第２図は第１図におけるＡ―Ａ線
断面図、第３図は各種構成要素を分解して描いた
斜視図、第４図は取付け状態を示す斜視図である
。 １…耐熱性プレート、２…バーコード、３…板
状体、４…半導体ウエーハーキヤリアー、５…ポ
ケツト。 The drawings show an embodiment of the semiconductor wafer carrier nameplate according to this invention, and FIG. 1 is a perspective view thereof, FIG. 2 is a cross-sectional view taken along line A--A in FIG. 1, and FIG. FIG. 4 is an exploded perspective view of various components, and FIG. 4 is a perspective view showing an attached state. DESCRIPTION OF SYMBOLS 1...Heat-resistant plate, 2...Barcode, 3...Plate-shaped body, 4...Semiconductor wafer carrier, 5...Pocket.

Claims (1)

【実用新案登録請求の範囲】 (1) 耐熱顔料により所定のバーコードが印刷さ
れた耐熱性プレートの表裏を、該プレートより面
積の大きい一対の弗素樹脂系合成樹脂製板状体で
はさみこみ、該板状体どうしを熱融着させ、該板
状体間に前記耐熱性プレートを封入したことを特
徴とする半導体ウエーハーキヤリアー用銘板。 (2) 耐熱性プレートがセラミツクス製であるこ
とを特徴とする請求項(1)記載の半導体ウエーハ
ーキヤリアー用銘板。 (3) 耐熱性プレートが金属製であることを特徴
とする請求項(1)記載の半導体ウエーハーキヤリ
アー用銘板。[Scope of Claim for Utility Model Registration] (1) The front and back sides of a heat-resistant plate on which a predetermined barcode is printed with heat-resistant pigment are sandwiched between a pair of fluororesin-based synthetic resin plates having a larger area than the plate; A nameplate for a semiconductor wafer carrier, characterized in that plate-like bodies are heat-sealed together and the heat-resistant plate is enclosed between the plate-like bodies. (2) The nameplate for a semiconductor wafer carrier according to claim (1), wherein the heat-resistant plate is made of ceramics. (3) The nameplate for a semiconductor wafer carrier according to claim (1), wherein the heat-resistant plate is made of metal.
JP16401188U 1988-12-20 1988-12-20 Pending JPH0284319U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16401188U JPH0284319U (en) 1988-12-20 1988-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16401188U JPH0284319U (en) 1988-12-20 1988-12-20

Publications (1)

Publication Number Publication Date
JPH0284319U true JPH0284319U (en) 1990-06-29

Family

ID=31449246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16401188U Pending JPH0284319U (en) 1988-12-20 1988-12-20

Country Status (1)

Country Link
JP (1) JPH0284319U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116041U (en) * 1990-03-14 1991-12-02
JPH088332A (en) * 1994-06-17 1996-01-12 Shin Etsu Polymer Co Ltd Wafer basket in wafer container
KR100521314B1 (en) * 1997-10-13 2005-12-30 삼성전자주식회사 Wafer transfer mechanism for semiconductor device manufacturing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624147B2 (en) * 1976-08-10 1981-06-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624147B2 (en) * 1976-08-10 1981-06-04

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03116041U (en) * 1990-03-14 1991-12-02
JPH088332A (en) * 1994-06-17 1996-01-12 Shin Etsu Polymer Co Ltd Wafer basket in wafer container
KR100521314B1 (en) * 1997-10-13 2005-12-30 삼성전자주식회사 Wafer transfer mechanism for semiconductor device manufacturing

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