JPH028602Y2 - - Google Patents
Info
- Publication number
- JPH028602Y2 JPH028602Y2 JP18176584U JP18176584U JPH028602Y2 JP H028602 Y2 JPH028602 Y2 JP H028602Y2 JP 18176584 U JP18176584 U JP 18176584U JP 18176584 U JP18176584 U JP 18176584U JP H028602 Y2 JPH028602 Y2 JP H028602Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- solder
- wave
- shielding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 33
- 238000001514 detection method Methods 0.000 claims description 9
- 230000002265 prevention Effects 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案はジエツト噴流半田槽を使用してプリン
ト基板を半田デイツプする際に、半田槽から噴流
される半田がプリント基板にかぶるのを防止する
ための半田かぶり防止装置に関する。[Detailed description of the invention] [Industrial application field] This invention prevents the solder jetted from the solder tank from covering the printed circuit board when the jet solder tank is used to solder dip the printed circuit board. This invention relates to a solder fog prevention device.
第２図はジエツト噴流半田槽を使用してプリン
ト基板を半田デイツプするのを説明するための図
である。
FIG. 2 is a diagram for explaining solder dipping of a printed circuit board using a jet solder bath.
プリント基板２はプリント基板搬送用ツメ１に
設置され矢印方向に移動する。そして、ジエツト
噴流半田槽４から噴流される半田３によつてプリ
ント基板２が半田デイツプされる。 The printed circuit board 2 is placed on the printed circuit board conveyance claw 1 and moves in the direction of the arrow. Then, the printed circuit board 2 is soldered-dipped by the solder 3 jetted from the jet solder tank 4.
ここで、半田３はプリント基板２の表面より高
い位置まで噴流しているので、プリント基板２が
半田３に入るときプリント基板に半田３がかぶつ
てしまい、プリント基板２に実装されている部品
を破損させてしまう。 Here, since the solder 3 is jetted to a position higher than the surface of the printed circuit board 2, when the printed circuit board 2 enters the solder 3, the solder 3 covers the printed circuit board, and the parts mounted on the printed circuit board 2 are It will damage the.
従つて、従来においては次に述べる二種の対策
が行なわれていた。一つは、プリント基板２を図
示しないキヤリアに設置して該キヤリアをコンベ
アに乗せ搬送するキヤリア式の場合は、キヤリア
に波よけ板を設けプリント基板２に半田３がかぶ
るのを防止していた。他の１つは、プリント基板
２を直接搬送するキヤリアレス式の場合は、図示
しないチエーン等に波よけ板を設置して該チエー
ン等により波よけ板を回転させ、波よけ板に密着
させてプリント基板２を設置させることにより半
田かぶりを防止していた。 Therefore, conventionally, the following two types of countermeasures have been taken. First, in the case of a carrier type in which the printed circuit board 2 is placed on a carrier (not shown) and the carrier is conveyed on a conveyor, a wave shield plate is provided on the carrier to prevent the solder 3 from covering the printed circuit board 2. Ta. The other method is a carrier-less type in which the printed circuit board 2 is directly conveyed, in which a wave shield is installed on a chain (not shown), the wave shield is rotated by the chain, etc., and the wave shield is tightly attached to the wave shield. Solder fogging is prevented by installing the printed circuit board 2 in this manner.
従来の技術において、キヤリア式の場合は、キ
ヤリアごとに波よけ板を設ける必要があり、キヤ
リアのコストが高くなると共に大きな形状になつ
てしまい保管及び取り扱いが不便であるという問
題点を有している。
In the conventional technology, in the case of the carrier type, it is necessary to provide a wave shield for each carrier, which has the problem of increasing the cost of the carrier and making it large, making it inconvenient to store and handle. ing.
また、キヤリアレス式の場合は、波よけ板に密
着させてプリント基板を設置する必要があり、プ
リント基板を搬送するタイミングが制限されると
いう問題点を有している。 Furthermore, in the case of the carrierless type, it is necessary to install the printed circuit board in close contact with the wave shielding plate, which poses a problem in that the timing for transporting the printed circuit board is limited.
さらに、キヤリア式の場合もキヤリアレス式の
場合も、半田デイツプの自動化が極めて困難であ
る。 Further, in both the carrier type and carrierless type, it is extremely difficult to automate the solder dip.
従つて、本考案は前記従来技術の問題点を解決
し、プリント基板を搬送するタイミングに制限の
ない自動化が簡単な半田かぶり防止装置を提供す
ることを技術的課題としている。 Therefore, the technical object of the present invention is to solve the problems of the prior art and to provide a solder fog prevention device that is easy to automate and has no restrictions on the timing of conveying printed circuit boards.
〔問題点を解決するための手段〕
本考案は前記技術的課題を達成するために、ジ
エツト噴流半田槽４から噴流される半田３がプリ
ント基板２にかぶるのを防止するための波よけ板
５と、プリント基板２が波よけ板５の位置まで搬
送されてきたことを検知するための検知部８と、
検知部８の動作に基づき波よけ板５を引き上げ、
一定時間経過後に波よけ板５を下動させる駆動部
１０とから成ることを特徴としている。[Means for Solving the Problems] In order to achieve the above-mentioned technical problem, the present invention provides a wave break plate for preventing the solder 3 jetted from the jet solder tank 4 from covering the printed circuit board 2. 5, a detection unit 8 for detecting that the printed circuit board 2 has been conveyed to the position of the wave shielding plate 5;
The wave shielding plate 5 is pulled up based on the operation of the detection unit 8,
It is characterized by comprising a drive unit 10 that moves the wave shield plate 5 downward after a certain period of time has elapsed.
プリント基板２が搬送されると波よけ板５に当
たり、波よけ板５が支持軸１５を中心に反時計方
向に傾むき検知部８を構成するスイツチ７がON
する。そして、スイツチ７がONすると、駆動部
１０は波よけ板５を一定時間Ｔだけ引き上げ、Ｔ
時間経過後波よけ板５を下動させる。以後は、同
じ動作を繰り返す。
When the printed circuit board 2 is transported, it hits the wave-shielding plate 5, and the wave-shielding plate 5 tilts counterclockwise around the support shaft 15, turning on the switch 7 constituting the detection unit 8.
do. Then, when the switch 7 is turned on, the drive section 10 pulls up the wave shielding plate 5 for a certain period of time T, and
After a period of time has elapsed, the wave shield plate 5 is moved down. After that, repeat the same operation.
第１図は本考案の半田かぶり防止装置の１実施
例を示す図であり、同図Ａはプリント基板が波よ
け板に当つた時の状態を示す図で、同図Ｂはプリ
ント基板が波よけ板を反時計方向に傾け、スイツ
チがONした時の状態を示す図、同図Ｃはスイツ
チがONした後、一定時間波よけ板が引き上げら
れた時の状態を示す図である。
FIG. 1 is a diagram showing an embodiment of the solder fog prevention device of the present invention, and FIG. Figure C shows the state when the wave shield is tilted counterclockwise and the switch is turned on. Figure C shows the state when the wave shield is pulled up for a certain period of time after the switch is turned on. .
なお、第２図で説明した部分、部材と同一箇所
は同一符号を付し詳細な説明は省略する。検知部
８はスイツチ７とスイツチ開閉部１１を有してお
り、スイツチ開閉部１１の側面下部に略長方形の
波よけ板５が取付けられている。そして、スイツ
チ開閉部１１は、スイツチ７の一部であるレバー
１３を押してスイツチ７をONさせるためのツメ
部１２を有すると共に、支持軸１５を中心に自由
に回動できるように構成されている。また、駆動
部１０は、シリンダー６と取付板９を有してお
り、シリンダー６が取付板９に固定されると共に
シリンダー６と検知部８とは軸１４を介して連結
されている。 Note that the same parts and members as those explained in FIG. 2 are given the same reference numerals, and detailed explanations are omitted. The detection section 8 has a switch 7 and a switch opening/closing section 11, and a substantially rectangular wave shielding plate 5 is attached to the lower side of the switch opening/closing section 11. The switch opening/closing part 11 has a claw part 12 for turning on the switch 7 by pushing a lever 13 that is a part of the switch 7, and is configured to be able to freely rotate around a support shaft 15. . Further, the drive unit 10 has a cylinder 6 and a mounting plate 9, and the cylinder 6 is fixed to the mounting plate 9, and the cylinder 6 and the detection unit 8 are connected via a shaft 14.
そして、シリンダー６が軸１４を引き上げ、あ
るいは、下動させることにより波よけ板５が上下
に移動する。ここで、第１図Ａに示すように、波
よけ板５が下動した状態の時に、プリント基板２
が矢印方向に搬送されてくるとジエツト噴流半田
槽から噴流される半田３の噴流口においてプリン
ト基板２が波よけ板５に当たり、プリント基板２
に半田３がかぶるのを防止する。 When the cylinder 6 raises or lowers the shaft 14, the wave-shielding plate 5 moves up and down. Here, as shown in FIG. 1A, when the wave shielding plate 5 is in a lowered state,
When the solder 3 is conveyed in the direction of the arrow, the printed circuit board 2 hits the wave shield plate 5 at the jet port of the solder 3 jetted from the jet solder tank, and the printed circuit board 2
Prevent the solder 3 from covering the surface.
そして、同図Ｂに示すように、プリント基板２
が波よけ板５を支持軸１５を中心に反時計方向に
傾けることによりスイツチ開閉部１１が反時計方
向に傾き、スイツチ開閉部１１に設けられたツメ
部１２がスイツチ７のレバー部１３を押してプリ
ント基板２の先端部が半田３の噴流口を充分通過
した時点でスイツチ７をONさせる。スイツチが
ONすると、同図Ｃに示すように、シリンダー６
が軸１４を引き上げ、軸１４を介して波よけ板５
があらかじめ定められた一定時間Ｔだけ引き上げ
られる。このとき、スイツチ開閉部１１及び波よ
け板５は支持軸１５を中心に時計方向に回動して
初期の状態に戻り、スイツチ７はOFF状態にな
る。 Then, as shown in Figure B, the printed circuit board 2
By tilting the wave shield plate 5 counterclockwise around the support shaft 15, the switch opening/closing part 11 tilts counterclockwise, and the claw part 12 provided on the switch opening/closing part 11 pushes the lever part 13 of the switch 7. When the tip of the printed circuit board 2 has sufficiently passed through the solder jet opening, the switch 7 is turned on. The switch is
When turned ON, the cylinder 6
pulls up the shaft 14 and pulls up the wave shield plate 5 via the shaft 14.
is raised for a predetermined period of time T. At this time, the switch opening/closing part 11 and the wave shield plate 5 rotate clockwise about the support shaft 15 and return to the initial state, and the switch 7 becomes OFF.
そして、一定時間Ｔ経過後シリンダー６は軸１
４を下動させ、第１図Ａに示す状態に戻る。 Then, after a certain period of time T has elapsed, the cylinder 6 is moved to the shaft 1.
4 to return to the state shown in FIG. 1A.
なお、上述の一定時間Ｔは、例えばプリント基
板２の先端部が半田３の噴流口にさしかかつた時
点からプリント基板２の後端部が半田３の噴流口
を通過するまでの時間に設定しておく。 Note that the above-mentioned fixed time T is set, for example, to the time from when the leading end of the printed circuit board 2 approaches the jet opening of the solder 3 until the rear end of the printed circuit board 2 passes through the jet opening of the solder 3. I'll keep it.
上述のように本考案によれば、プリント基板が
波よけ板を支持軸１５を中心に反時計方向に傾け
ることにより検知部を達成するスイツチをONさ
せ、スイツチがONすることによりシリンダーが
軸を介して波よけ板を引き上げ、あらかじめ定め
た一定時間経過後波よけ板を下動させる構成をと
つている。従つて、プリント基板を搬送するタイ
ミングに制限のない、自動化が簡単な半田かぶり
防止を提供することができる。
As described above, according to the present invention, the printed circuit board turns on the switch that achieves the detection part by tilting the wave shielding plate counterclockwise around the support shaft 15, and when the switch is turned on, the cylinder moves to the axis. The wave shielding plate is pulled up through the turret, and the wave shielding plate is moved down after a predetermined period of time has elapsed. Therefore, it is possible to provide prevention of solder fogging that is easy to automate and has no restrictions on the timing of conveying the printed circuit board.
第１図は本考案の半田かぶり防止装置の１実施
例を示す図であり、同図Ａはプリント基板が波よ
け板に当つた時の状態を示す図、同図Ｂはプリン
ト基板が波よけ板を反時計方向に傾け、スイツチ
がONした時の状態を示す図、同図Ｃはスイツチ
がONした後、一定時間波よけ板が引き上げられ
た時の状態を示す図である。第２図は従来例の説
明図である。
１……プリント基板搬送用ツメ、２……プリン
ト基板、３……半田、４……ジエツト噴流半田
槽、５……波よけ板、８……検知部、１０……駆
動部。
Figure 1 is a diagram showing an embodiment of the solder fog prevention device of the present invention, in which Figure A shows the state when the printed circuit board hits the wave shield plate, and Figure B shows the state in which the printed circuit board hits the wave shield plate. A diagram showing the state when the wave shield is tilted counterclockwise and the switch is turned on. Figure C is a diagram showing the state when the wave shield is pulled up for a certain period of time after the switch is turned on. FIG. 2 is an explanatory diagram of a conventional example. DESCRIPTION OF SYMBOLS 1... Printed circuit board conveyance claw, 2... Printed circuit board, 3... Solder, 4... Jet jet solder bath, 5... Wave shielding plate, 8... Detection section, 10... Drive section.
Claims (1)
ント基板にかぶるのを防止するための波よけ板
と、プリント基板が波よけ板の位置まで搬送され
てきたことを検知するための検知部と、該検知部
の動作に基づき波よけ板を引き上げ、一定時間経
過後に波よけ板を下動させる駆動部とから成るこ
とを特徴とする半田かぶり防止装置。 a wave-shielding plate for preventing solder jetted from the jet solder tank from covering the printed circuit board; a detection unit for detecting that the printed circuit board has been conveyed to the position of the wave-shielding plate; 1. A solder fog prevention device comprising a drive section that pulls up a wave shielding plate based on the operation of the detection unit and moves the wave shielding plate down after a certain period of time has elapsed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18176584U JPH028602Y2 (en) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18176584U JPH028602Y2 (en) | 1984-11-30 | 1984-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6197358U JPS6197358U (en) | 1986-06-23 |
| JPH028602Y2 true JPH028602Y2 (en) | 1990-03-01 |
Family
ID=30739306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18176584U Expired JPH028602Y2 (en) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028602Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63248566A (en) * | 1987-04-03 | 1988-10-14 | Kenji Kondo | Method and device for soldering printed circuit board |
-
1984
- 1984-11-30 JP JP18176584U patent/JPH028602Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6197358U (en) | 1986-06-23 |
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