JPH0286464A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0286464A JPH0286464A JP23848888A JP23848888A JPH0286464A JP H0286464 A JPH0286464 A JP H0286464A JP 23848888 A JP23848888 A JP 23848888A JP 23848888 A JP23848888 A JP 23848888A JP H0286464 A JPH0286464 A JP H0286464A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- power supply
- heat generating
- thermal head
- heating resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 14
- 238000009826 distribution Methods 0.000 abstract description 5
- 239000012141 concentrate Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 66
- 239000011241 protective layer Substances 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、サーマルプリンタに搭載するサーマルヘッド
に係り、特に薄ｉ型のサーマルヘッドにＩＩＩする。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head mounted on a thermal printer, and particularly relates to a thin i-type thermal head.
す−マルプリンタに搭載するサーマルヘッドは、印字ド
ツトを構成する複数個の発熱抵抗体を同一基板上に直線
的に整列配列してなり、画像情報に従ってこれらの発熱
抵抗体を通電加熱させて、感熱記録紙に発色記録さぼる
か、あるいはインクリボンを溶融して普通紙に転写記録
するようになっている。The thermal head installed in a smart printer consists of a plurality of heat generating resistors that constitute printing dots arranged in a linear array on the same substrate, and these heat generating resistors are heated with electricity according to image information. Color recording is performed on thermal recording paper, or an ink ribbon is melted and transferred onto plain paper.
第３図および第４図は、それぞれこの種のυ−マルヘッ
ドにおいて、特に、隣位の１対の発熱抵抗体層に折返し
電極を接続してほぼコ字形に折返すようにした従来のも
のの平面図を示すものである。FIGS. 3 and 4 respectively show the plan view of a conventional υ-maru head of this type, in which folded electrodes are connected to a pair of adjacent heating resistor layers and folded back into a substantially U-shape. The figure is shown below.
第３図において、セラミック基板等の絶縁性基板１上に
は、蓄熱層として機能するガラスからなるグレーズ層２
が部分的に形成されている。このグレーズ層２の上には
例えばＴａ−８ｉ０２またはＣｒ−８ｉＯなどの比較的
抵抗値の大きな材料からなる複数個の発熱抵抗体をなす
発熱抵抗体層３が、蒸着、スパッタリングなどにより被
着された後、エツチングにより、直線状に列をなすよう
に形成されている。この発熱抵抗体層３の上には、この
発熱抵抗体層３に対して給電するための給電体をなす給
電体層４が形成されている。In FIG. 3, on an insulating substrate 1 such as a ceramic substrate, there is a glaze layer 2 made of glass that functions as a heat storage layer.
is partially formed. On this glaze layer 2, a heating resistor layer 3 comprising a plurality of heating resistors made of a material with a relatively high resistance value such as Ta-8i02 or Cr-8iO is deposited by vapor deposition, sputtering, etc. After that, they are etched to form linear rows. A power supply layer 4 serving as a power supply for supplying power to the heat generating resistor layer 3 is formed on the heat generating resistor layer 3 .
前記給電体層４は、例えばアルミニウム、銅、金などの
金属からなり、蒸着、スパッタリングによって所望形状
のパターンに形成され、各発熱抵抗体層３の整列方向の
一側において共通給電体層４Ａおよび信号給電体ＪｉＪ
４Ｂとしてそれぞれ導出されている。また、隣位に１対
の前記発熱抵抗体層３．３の列方向の他側の端部間は折
返し電極５によって互いに連結されており、これにより
、１対の発熱抵抗体層３．３および折返し電極５により
全体としてほぼ口字形に形成されている。なお、前記折
返し電極５は前記給電体層４と同様に例えばアルミニウ
ム、銅、金等の材料によって形成されている。そして、
１対の自給電体ｍ４Ａおよび信号給電体ｆ１４Ｂ間にお
いて、１ドツ！・相当分の発熱領域を形成された各個独
立した発熱抵抗体層３は、１対の両給電体層４Ａ、４８
間に電圧を印加することによって発熱されるようになっ
ている。The power supply layer 4 is made of a metal such as aluminum, copper, or gold, and is formed into a desired shape pattern by vapor deposition or sputtering. Signal feeder JiJ
4B. Further, the ends of the adjacent pair of heat generating resistor layers 3.3 on the other side in the column direction are connected to each other by folded electrodes 5, whereby the pair of heat generating resistor layers 3.3 The folded electrode 5 forms a substantially mouth-shaped structure as a whole. Note that the folded electrode 5 is made of a material such as aluminum, copper, or gold, similarly to the power supply layer 4. and,
1 dot between a pair of self-power feeder m4A and signal power feeder f14B! - Each independent heat generating resistor layer 3 formed with a corresponding heat generating area is connected to a pair of both power supply layers 4A, 48
Heat is generated by applying a voltage between them.
前述した発熱抵抗体層３および給電体層４上には、これ
らの発熱抵抗体層３および給電体層４を保護する保護層
６が形成されている。この保護層６は、発熱抵抗体層３
を酸化による劣化から保護するＳｉＯ２等からなる耐酸
化層と、この酸化層上に積層され、インクリボンなどと
の接触による摩耗から発熱抵抗体層３および給電体層４
を保護するＴ、２０５等からなる耐摩耗層とから形成さ
れており、この保護層６は端子部以外のヘッド面のすべ
てを覆うようになっている。この保諧層６の耐酸化層お
よび耐摩耗層は、スパッタリング等の手段によって順次
積層され、その後、最終工程において絶Ｒ竹基板１を分
割して所望のサーマルヘッドチップを得るようになって
いる。A protective layer 6 is formed on the heat generating resistor layer 3 and the power supply layer 4 described above to protect the heat generating resistor layer 3 and the power supply layer 4. This protective layer 6 is the heating resistor layer 3
An oxidation-resistant layer made of SiO2 or the like that protects the ink from deterioration caused by oxidation, and a heat-generating resistor layer 3 and a power supply layer 4 that are laminated on this oxidized layer and protect from wear due to contact with ink ribbons, etc.
This protective layer 6 covers the entire head surface other than the terminal portion. The oxidation-resistant layer and wear-resistant layer of the protection layer 6 are sequentially laminated by means such as sputtering, and then, in the final step, the zero-R bamboo substrate 1 is divided to obtain desired thermal head chips. .
第４図は第３図と異なる従来のり一マルヘッドを示すも
のであり、第３図に示すものと異なる点は、第３図に示
すサーマルヘッドにおいては、折返し電極５の材質が給
電体層４の材質と同様どされていたが、第４図に示すサ
ーマルヘッドにおいては、折返し電１〜５の材質が、例
えばＴａ−８ｉＯ２、王、２Ｎなどの発熱抵抗体層３の
材質と同様とされている点である。FIG. 4 shows a conventional thermal head different from that shown in FIG. 3. The difference from that shown in FIG. 3 is that in the thermal head shown in FIG. However, in the thermal head shown in FIG. 4, the material of the folded cables 1 to 5 is the same as that of the heating resistor layer 3, such as Ta-8iO2, King, 2N, etc. The point is that
しかしながら、前述した第３図に示す従来のサーマルヘ
ッド４においては、折返し電極５がアルミニウム等の軟
い材料で形成されているため、特に、Ｊ１〒返し電極５
の隅部が変形し易く、このため、変形した折返し′ｉｆ
ｉ極５上に位置する保護層６が崩れて破損しやすい欠点
を有している。However, in the conventional thermal head 4 shown in FIG. 3 described above, since the folded electrode 5 is formed of a soft material such as aluminum, in particular
The corner of ′if is easily deformed, and therefore
It has a disadvantage that the protective layer 6 located on the i-pole 5 collapses and is easily damaged.
また、前述した第４図に示す従来のサーマルヘッドにお
いては、折返し電極５が発熱抵抗体層３と同様の材料に
より形成されているため、待に折返し電極５の隅部に発
熱集中が生じ易く、折返し電極５の劣化が加速される欠
点を有している。Furthermore, in the conventional thermal head shown in FIG. 4 described above, since the folded electrode 5 is formed of the same material as the heating resistor layer 3, heat generation tends to be concentrated at the corners of the folded electrode 5. , it has the disadvantage that the deterioration of the folded electrode 5 is accelerated.
本発明は、前述した従来のものにおける問題点を解決し
、折返しｒ８極の隅部において保ＭＦ＋が崩れて破損す
るおそれがなく、また折返し電極の隅角部に発熱集中が
生じるおそれがなく、耐久性、熱分布特性を向上するこ
とができるサーマルヘッドを提供することを目的とする
。The present invention solves the above-mentioned problems with the conventional ones, and eliminates the risk of the maintenance MF+ collapsing and being damaged at the corner of the folded r8 pole, and eliminates the risk of heat generation concentrating at the corner of the folded electrode. The purpose of the present invention is to provide a thermal head that can improve durability and heat distribution characteristics.
前述した目的を達成づるため本発明は、印字ドツトを構
成する複数個の発熱抵抗体を絶縁性基板上に整列状に配
設し、これらの発熱抵抗体に給電する共通給電体および
信号給電体を前記発熱抵抗体の整列方向の一側において
それぞれ接続し、隣位の１対の前記発熱抵抗体の前記整
列方向の他側の端部間を折返し電極によって相互に連結
してなるサーマルヘッドにおいて、前記折返し電極を、
前記給電体の材料と比較して硬度が高くかつ、前記発熱
抵抗体より抵抗値の低い材料により形成したことを特徴
としている。In order to achieve the above-mentioned object, the present invention arranges a plurality of heat generating resistors constituting a printed dot in an array on an insulating substrate, and provides a common power supply body and a signal power supply body for supplying power to these heat generating resistors. are connected to each other on one side in the alignment direction of the heat generating resistors, and the ends of a pair of adjacent heat generating resistors on the other side in the alignment direction are interconnected by a folded electrode. , the folded electrode,
It is characterized in that it is made of a material that has higher hardness than the material of the power supply body and has a lower resistance value than the heat generating resistor.
前述した構成の本発明によれば、折返し電極が発熱抵抗
体材料に比較して抵抗値が低い材料により形成されてい
るため、特に折返し電極の隅部にも発熱集中が生じるお
それがなく、また折返し電極が比較的硬度の高い材料に
より形成されているため、折返し電極の隅部において保
ｉｏが崩れた破損するおそれがなく、したがって、耐久
性および熱分布特性を向上することができる。According to the present invention having the above-described configuration, since the folded electrode is formed of a material having a lower resistance value than the material of the heating resistor, there is no fear that heat generation will be concentrated especially at the corners of the folded electrode. Since the folded electrode is formed of a material with relatively high hardness, there is no fear that the io-retention will collapse or be damaged at the corners of the folded electrode, and therefore durability and heat distribution characteristics can be improved.
以下、本発明を図面に示す実施例により説明する。 The present invention will be explained below with reference to embodiments shown in the drawings.
第１図および第２図は本発明に係るサーマルヘッドの実
施例を示すものであり、これらの図において符号１１は
絶縁性基板を示しており、この絶縁性基板１１はアルミ
ナなどの絶縁性材料により形成されている。この絶縁性
基板１１上には約５０μ雇厚のグレーズ層１２が焼成に
より形成されている。印字ドツトを構成する発熱抵抗体
をなす発熱抵抗体層１３の形成領域たる前記絶縁性基板
１１の一喘部のグレーズｆｆ１２の上面は、絶縁性基板
１１の一端部側が低位となるように傾斜した傾斜面１４
とされている。この傾斜面１４は、絶縁性基板１１の上
面に対して１０°〜１５°の傾斜角をなすように形成さ
れている。なお、前記傾斜面１４の傾斜角が１５°を越
えて大きくなるに従って発熱抵抗体層１３の用紙Ｐへの
圧接力が弱くなり、また、傾斜角が１０°以下に小さく
なるに従って、前記圧接力が分散され、用紙Ｐが、表面
粒子の粗いいわゆるラフペーパーの場合、印字性が悪化
してくる。1 and 2 show examples of the thermal head according to the present invention, and in these figures, reference numeral 11 indicates an insulating substrate, and this insulating substrate 11 is made of an insulating material such as alumina. It is formed by A glaze layer 12 having a thickness of approximately 50 μm is formed on this insulating substrate 11 by firing. The upper surface of the glaze ff12 of the pane of the insulating substrate 11, which is the formation region of the heating resistor layer 13 forming the heating resistor constituting the printed dots, is inclined so that one end side of the insulating substrate 11 is at a lower level. Inclined surface 14
It is said that The inclined surface 14 is formed at an inclined angle of 10° to 15° with respect to the upper surface of the insulating substrate 11. It should be noted that as the inclination angle of the inclined surface 14 increases beyond 15°, the pressing force of the heating resistor layer 13 to the paper P becomes weaker, and as the inclination angle decreases to 10° or less, the pressing force decreases. If the paper P is so-called rough paper with coarse surface particles, the printing performance will deteriorate.
前記傾斜面１４は、グレーズ層１２の表面にエツチング
レートの高い層を形成してエツチングする写真製版技術
により形成される。一方、前記傾斜面１４に連らなるグ
レーズ層１２の上面は、前記絶縁性基板１１の上面に対
してほぼ平行とされた平行面１５とされている。The inclined surface 14 is formed by a photolithography technique in which a layer with a high etching rate is formed on the surface of the glaze layer 12 and then etched. On the other hand, the upper surface of the glaze layer 12 connected to the inclined surface 14 is a parallel surface 15 that is substantially parallel to the upper surface of the insulating substrate 11.
前記グレーズ層１２の上面の前記発熱抵抗体層１３の形
成予定領域たる傾斜面１４から平行面１５にかけては、
Ｔ ａ −Ｓ ｉ Ｏ２、Ｃｒ −Ｓ ｉ Ｏなどから
なる発熱抵抗体をなす複数個の前記発熱抵抗体層１３が
形成されている。各発熱抵抗体層１３は、同形の長方形
をしたものがグレーズ層１２に形成されている凸部２１
上から内傾ｒ：１面１４．２０にかけて整列状に形成さ
れており、−端から４個ずつの発熱抵抗体層１３ａ、１
３ｂ。From the inclined surface 14, which is the area where the heating resistor layer 13 is to be formed, on the upper surface of the glaze layer 12 to the parallel surface 15,
A plurality of heat generating resistor layers 13 are formed, each of which is a heat generating resistor made of Ta-S i O2, Cr-S i O, or the like. Each heating resistor layer 13 has a rectangular convex portion 21 formed on the glaze layer 12.
The heating resistor layers 13a, 1 are formed in an aligned manner from the top to the inward slope r:1 surface 14.20, and four heating resistor layers 13a, 1 are formed from the - end.
3b.
１３ｃ、１３ｄがそれぞれ１組とされている。13c and 13d are each set as one set.
このうち１組の発熱紙、抗体層１３における両端の発熱
抵抗体層１３ａ、１３ｄの前述した整列方向の一側には
、それぞれ平行面１５側に延在する信号給電体層１６Ｂ
、１６Ｂが接続されており、また、中央の発熱抵抗体層
１３ｂ、１３ｃの同じく一側には、端部の幅を広くされ
た１本の共通給電体層１６Ａが接続されている。さらに
、これらの信号給電体層１６Ｂ、１６Ｂおよび共通給電
体層１６Ａにより給電体をなす給電体層１６が形成され
ており、この給電体層１６は抵抗率の小さいアルミニウ
ム（Ａ４１）、銅（ＣＵ）、または金（Ａｕ）などの金
屈材料により形成されている。Among these, on one side of the heating resistor layers 13a and 13d at both ends of the heating paper and the antibody layer 13 in the alignment direction described above, a signal power feeder layer 16B extending toward the parallel surface 15 side is provided.
, 16B are connected to each other, and one common power supply layer 16A having a wide end portion is connected to one side of the central heating resistor layers 13b and 13c. Furthermore, the signal power supply layers 16B, 16B and the common power supply layer 16A form a power supply layer 16 that serves as a power supply, and this power supply layer 16 is made of aluminum (A41) and copper (CU) with low resistivity. ), or a metal material such as gold (Au).
また、隣位の１対の発熱抵抗体ｌｉ１３ａと１３ｂおよ
び発熱抵抗体層１３ｃと１３ｄは、前記給電体層１６が
接続された整列方向の一側に対峙する他側の端部間にお
いてそれぞれ折返し電極２３゜２３により連結されてい
る。さらに、この折返し電極２３．２３は、例えばアル
ミニウム＜ＡＪ ）、銅（Ｃｕ）、金（Ａｕ＞などから
なる前記給電体層１６の材料と比較して硬度が比較的高
く、かつ、前記発熱抵抗体に比べて抵抗値が低い材料、
例えばタンタル（Ｔａ）、タングステン（Ｗ）、クロム
（Ｃｒ）、ニッケル（Ｎｉ）などの材料により形成され
ている。Further, the adjacent pair of heat generating resistors li13a and 13b and the heat generating resistor layers 13c and 13d are folded back between the ends of the other side facing one side of the alignment direction to which the power supply layer 16 is connected. They are connected by electrodes 23°23. Furthermore, this folded electrode 23.23 has relatively high hardness compared to the material of the power supply layer 16 made of, for example, aluminum (AJ), copper (Cu), gold (Au), etc., and A material with a lower resistance value than the body,
For example, it is formed from a material such as tantalum (Ta), tungsten (W), chromium (Cr), or nickel (Ni).
前記発熱抵抗体Ｗ！Ａ１３および前記給電体層１６の表
面には、耐酸化および耐摩耗性を有する保護層１７がほ
ぼ全面を覆うように積層されている。The heating resistor W! A protective layer 17 having oxidation resistance and wear resistance is laminated on the surfaces of A13 and the power supply layer 16 so as to cover almost the entire surface.
また、プリンタのプラテン１９の表面に対し傾斜面１４
がほぼ平行となるようにサーマルヘッドはその向きを規
シリされており、インクリボンＲおよび用紙Ｐを介して
前記傾斜面１４をプラテン１９に抑圧できるようになっ
ている。Also, the inclined surface 14 is connected to the surface of the platen 19 of the printer.
The thermal head is oriented in such a manner that the ink ribbons R and paper P are parallel to each other, and the inclined surface 14 can be pressed against the platen 19 via the ink ribbon R and paper P.
前述した構成によれば、一方の信号給電体層１６Ｂを導
通状態にすると、共通給電体層１６Ａからの電流が発熱
抵抗体層１３ｂ（１３Ｃ）から折返し電極２３および発
熱抵抗体層１３ａ（１３ｄ）を介して一方の信号給電体
！１ｆｆ１６Ｂに流れ、発熱抵抗体層１３ａ、１３ｂま
たは発熱抵抗体）Ｎ１３ｃ、１３ｄが加熱される。した
がって、両信号給電体層１６Ｂを導通状態にすることに
より４個のすべての発熱抵抗体Ｔｆ４１３ａ〜１３ｄが
加熱される。According to the above-described configuration, when one signal power supply layer 16B is brought into conduction, the current from the common power supply layer 16A is transferred from the heating resistor layer 13b (13C) to the folded electrode 23 and the heat generating resistor layer 13a (13d). One signal feeder through! 1ff16B, and the heating resistor layers 13a, 13b or heating resistors) N13c, 13d are heated. Therefore, all four heating resistors Tf413a to Tf413d are heated by bringing both the signal power supply layers 16B into a conductive state.
ところで、本実施例によれば、折返し電極２３の材料と
して、発熱抵抗体１３の材料と比較して抵抗値の低いも
のが用いられているため、特に折返し電極２３の隅部に
おいても発熱集中が生じるおそれがない。また、折返し
電極２３の材料が比較的硬度の高いものとされているた
め、特に折返し電極２３の隅部においても保ｙＬ層１７
が崩れて破損するおそれがなく、したがって、耐久性お
よび熱分布特性の向上をはかることができる。By the way, according to this embodiment, since a material having a lower resistance value than the material of the heating resistor 13 is used as the material for the folded electrode 23, heat generation is not concentrated particularly at the corners of the folded electrode 23. There is no risk of this happening. In addition, since the material of the folded electrode 23 is relatively hard, the retention layer 17 is
There is no risk of collapse and damage, and therefore durability and heat distribution characteristics can be improved.
なお、本発明は、前述した実施例に限定されるものでは
なく、必要に応じて種々の変更が可能である。Note that the present invention is not limited to the embodiments described above, and various changes can be made as necessary.
以上説明したように本発明によれば、折返し電極の隅部
において保護層が崩れて破損するおそれがないし、また
、折返し電極の隅部において発熱集中が生じるおそれが
なく、耐久性、熱分布特性を向上することができるとい
う効果を奏する。As explained above, according to the present invention, there is no risk of the protective layer collapsing and being damaged at the corners of the folded electrode, there is no risk of heat concentration occurring at the corners of the folded electrode, and the durability and heat distribution characteristics are improved. This has the effect of improving the
第１図および第２図は本発明に係るサーマルヘッドの実
施例を示すものであり、第１図は本実施例に適用される
給電体層の実施例を示す平面図、第２図は本実施例の縦
断面図、第３図および第４図は従来のサーマルヘッドに
適用される給電体層のそれぞれ異なる実施例を示す平面
図である。
１１・・・絶縁性基板、１２・・・グレーズ層、１３・
・・発熱抵抗体層、１６・・・給電体層、１７・・・保
護層、２３・・・折返しＴ１極。1 and 2 show an embodiment of the thermal head according to the present invention, FIG. 1 is a plan view showing an embodiment of the power supply layer applied to this embodiment, and FIG. 2 is a plan view of the present invention. The vertical cross-sectional view of the embodiment, and FIGS. 3 and 4 are plan views showing different embodiments of the power supply layer applied to the conventional thermal head. 11... Insulating substrate, 12... Glaze layer, 13.
...Heating resistor layer, 16... Power supply layer, 17... Protective layer, 23... Folded T1 pole.
Claims (1)
上に整列状に配設し、これらの発熱抵抗体に給電する共
通給電体および信号給電体を前記発熱抵抗体の整列方向
の一側においてそれぞれ接続し、隣位の１対の前記発熱
抵抗体の前記整列方向の他側の端部間を折返し電極によ
つて相互に連結してなるサーマルヘッドにおいて、前記
折返し電極を、前記給電体の材料と比較して硬度が高く
かつ、前記発熱抵抗体より抵抗値の低い材料により形成
したことを特徴とするサーマルヘッド。A plurality of heat generating resistors constituting a printed dot are arranged in an array on an insulating substrate, and a common power supply and a signal power supply for supplying power to these heat generating resistors are placed on one side in the alignment direction of the heat generating resistors. In the thermal head, the ends of a pair of adjacent heating resistors on the other side in the alignment direction are interconnected by a folded electrode, and the folded electrode is connected to the power supply body. 1. A thermal head characterized in that it is made of a material that has a higher hardness than the material of the heating resistor and has a resistance value lower than that of the heating resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63238488A JPH0825288B2 (en) | 1988-09-22 | 1988-09-22 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63238488A JPH0825288B2 (en) | 1988-09-22 | 1988-09-22 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286464A true JPH0286464A (en) | 1990-03-27 |
| JPH0825288B2 JPH0825288B2 (en) | 1996-03-13 |
Family
ID=17030991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63238488A Expired - Lifetime JPH0825288B2 (en) | 1988-09-22 | 1988-09-22 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0825288B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS574781A (en) * | 1980-06-12 | 1982-01-11 | Matsushita Electric Ind Co Ltd | Thin film type thermal head |
| JPS58120047U (en) * | 1982-02-12 | 1983-08-16 | 沖電気工業株式会社 | thermal head |
| JPS62238767A (en) * | 1986-04-10 | 1987-10-19 | Ngk Insulators Ltd | Recorder |
-
1988
- 1988-09-22 JP JP63238488A patent/JPH0825288B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS574781A (en) * | 1980-06-12 | 1982-01-11 | Matsushita Electric Ind Co Ltd | Thin film type thermal head |
| JPS58120047U (en) * | 1982-02-12 | 1983-08-16 | 沖電気工業株式会社 | thermal head |
| JPS62238767A (en) * | 1986-04-10 | 1987-10-19 | Ngk Insulators Ltd | Recorder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0825288B2 (en) | 1996-03-13 |
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