JPH0286640A - Styrenic resin composition - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a styrenic resin composition that exhibits good mold release properties during molding.

(Prior art and problems to be solved by the invention) When molding styrene resin by injection molding, extrusion molding, or other molding methods, when the mold releasability between the resin and the metal surface is insufficient, the molding Problems such as a decrease in productivity, deformation of the molded product, or surface defects occur due to the product adhering to the mold or staining on the surface.

For this reason, as a means to prevent troubles caused by such insufficient mold release properties, the following methods are generally used: 1) Applying a mold release agent to the mold surface, 2) Adding a mold release agent to the resin (hereinafter referred to as internal A method called "addition" is adopted. Solvent-diluted or emulsion-based silicone oil is often used as a mold release agent in method 1), but it has disadvantages such as environmental pollution due to the solvent and adverse effects on subsequent processes of residual silicone oil, such as poor coloring. are doing. As the internally added mold release agent in 2), for example, in JP-A-54-132650, a combination of higher fatty acids and/or their metal salts and glycerin monostearate is used, and in JP-A-59-68357, higher fatty acids and A combination of the same metal salt and an N-alkyl fatty acid amide is shown. Also, depending on the use,
If you dislike metallic compounds, for example, P[^5TIC3E
ngineering / September '8
7.33-34 show that cetyl stearate and cetyl palmitate are effective as nolenone metallic fatty chemical mold release agents for ABS. However, in general, these materials have the disadvantage that they must be added in large amounts in order to obtain the practically necessary mold release properties, and the effect of this is a decrease in the heat distortion temperature of the molded article. Therefore, in the internal addition method, it is desired that the compound be effective in a small amount and be non-metallic.

An object of the present invention is to find a mold release agent for internal addition that solves the above-mentioned problems, and to provide a styrene resin composition with excellent mold release properties.

[Means to solve the problem]

The present inventors have conducted intensive studies on an internally added mold release agent that is a non-metallic compound and exhibits mold release properties at a low additive amount that does not affect the reduction of the heat distortion temperature of the molded product. −
We have discovered that olefin epoxide (hereinafter abbreviated as AOE) is an internally added mold agent that meets the purpose of the present invention,
The present invention has now been completed.

The long-chain AOE used in the present invention is a compound obtained by oxidizing the terminal double bond of a long-chain α-olefin (by low polymerization of ethylene) to form an epoxide.

The long-chain AOE used in the present invention has 12 or more carbon atoms, preferably 20 or more carbon atoms. If the number of carbon atoms is less than 12, although it has a mold release effect, it is not preferable because it volatilizes during processing due to its low boiling point or lowers the heat distortion temperature. Furthermore, long-chain AOE can also be used in combination with known internally added mold release agents, such as fatty acid metal salts, ethylene bis fatty acid amide, glycerin monostearate, etc., to meet the objectives of the present invention.

In the present invention, the styrenic resin is a polymer having styrene and methylstyrene as polymer constituents,
Examples include polystyrene, ABS, As, etc.
It is not limited to these.

〔Example〕

Next, the effectiveness of the present invention will be specifically demonstrated with examples.

1. Method for evaluating mold release properties ■ A specified amount of resin (ABS, polystyrene, or As) and mold release agent were kneaded using a plastomill at 190°C for 8 minutes, and then kneaded at 170°C using a Teflon-coated press plate. 'C - Make a 1# thick sheet under the conditions of 100Kg/cttt -3 minutes.

■Collect a circular sample with a diameter of 12 pieces from the IM thick sheet using a cork polar (N (17)).

■Chrome-plated standard test plate 2. OX25x1
00 m/m A circular sample was sandwiched in the center of two crossed sheets, and 180'C-1ON! 9/ct/
was pressed for 18 minutes to crimp the test plate.

(2) Set the two crimped standard chrome plated test plates in a Schopper type tensile tester, pull at a speed of 200 #/min, and measure the force (peel force) required to separate the two standard chrome plated test plates.

One evaluation result - EBS = Ethylene bis bisthroamide GMS = Glycerin monosdaleate AOE16B = α-olefin epoxide A having 16 to 18 carbon atoms OE 208 – α-olefin epoxide A having 20 to 28 carbon atoms OE 300 – 30 carbon atoms Above α-olefin epoxide Table 2 PS*7. In the case of As*8*7 PS=Mitsui Toatsu Chemical 1-1 Polex GP55
5.8AS = Mitsui Toatsu Chemical Light Tack A120PC [
[Effect of the invention] Comparison of the numerical values of peeling force of Comparative Examples 1 to 10 and Inventive Products 1 to 10 in Table 11 and Table 2 shows that the inventive product is equivalent to or greater than the existing product even when the amount added is 172 or less. It is clear that the material exhibits a peeling force, that is, a function of promoting mold release.

Claims (1)

[Claims] (1) A styrenic resin composition characterized by containing an α-olefin epoxide as an essential component.