JPH0286868A - Coated film device - Google Patents

Coated film device

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Publication number
JPH0286868A
JPH0286868A JP23781388A JP23781388A JPH0286868A JP H0286868 A JPH0286868 A JP H0286868A JP 23781388 A JP23781388 A JP 23781388A JP 23781388 A JP23781388 A JP 23781388A JP H0286868 A JPH0286868 A JP H0286868A
Authority
JP
Japan
Prior art keywords
jig
coated
coating
conveyor
jigs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23781388A
Other languages
Japanese (ja)
Inventor
Seiji Miyamoto
宮本 清司
Takashi Shimada
隆 島田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daiken Kagaku Kogyo KK
Original Assignee
Daiken Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiken Kagaku Kogyo KK filed Critical Daiken Kagaku Kogyo KK
Priority to JP23781388A priority Critical patent/JPH0286868A/en
Publication of JPH0286868A publication Critical patent/JPH0286868A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は被塗装体に粘稠な流動体を塗布する装置に関し
、特に電子部品に導電加工を行う塗膜装置に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an apparatus for applying a viscous fluid to an object to be coated, and more particularly to a coating apparatus for applying conductive processing to electronic parts.

従来の技術および課題 従来、導電塗料を用いて各種電子部品の導電加工を行う
°方法としては、被塗装体である電子部品を1つ1つ手
で導電塗料槽内に浸漬し、その表面に塗膜を形成する方
法がとられている。
Conventional Technologies and Issues Conventionally, the method of conducting conductive processing on various electronic components using conductive paint is to manually immerse each electronic component to be coated in a conductive paint bath, and then coat the surface with A method of forming a coating film is used.

例えば、第6図に示すごとく、銀ベーストなどの所定の
調製されたペーストlを用意した浸漬槽2に被塗装体(
電子部品)Pをピンセット4で挟んで浸漬する。このよ
うな方法では、被塗装体Pのピンセットと接触した部分
には充分なペーストが塗布されず、またピンセット4の
付近に液ダマリが生じたり、またピンセットの下部や被
塗装体の下部には液ダレ5が生じ、均一な塗膜を得るこ
とはできない。また、第7図に示すように被塗装体Pの
孔を治具6に引っ掛けて吊し液中に浸漬する方法も行わ
れている。かかる方法では、被塗装体Pと治具6との接
触面積が少なく、被塗装体と治具との接触による塗布む
らは減少する。しかしながら、塗装された電子部品下部
には依然液ブレが生じ均一な塗膜を得ることはできない
For example, as shown in FIG. 6, the object to be coated (
Electronic component) P is held between tweezers 4 and immersed. In such a method, sufficient paste is not applied to the part of the workpiece P that comes into contact with the tweezers, liquid clumps occur near the tweezers 4, and the bottom of the tweezers and the bottom of the workpiece are not coated with enough paste. Liquid dripping 5 occurs, making it impossible to obtain a uniform coating film. Furthermore, as shown in FIG. 7, there is also a method in which the hole of the object P to be coated is hooked on a jig 6 and the object is immersed in a suspension liquid. In this method, the contact area between the object to be painted P and the jig 6 is small, and uneven coating due to contact between the object to be painted and the jig is reduced. However, liquid blur still occurs at the bottom of the painted electronic component, making it impossible to obtain a uniform coating.

本発明は、被塗装体に粘稠な流動体を塗布するにあたり
、特に電子部品に金属粉末を含有した粘性の高いペース
トを塗布するにあたり、均一な塗膜を連続的に効率よく
形成する装置を提供することを目的とする。
The present invention provides an apparatus that continuously and efficiently forms a uniform coating film when applying a viscous fluid to an object to be coated, especially when applying a highly viscous paste containing metal powder to an electronic component. The purpose is to provide.

課題を解決するための手段 本発明は、(1)被塗装体を取り付ける複数の治具を備
えた搬送装置、 (ii)該治具の下方に設けられた塗布液槽、(iii
 )塗布の完了した被塗装体を取り付けた治具を振動さ
せる治具振動装置、 (iv)被塗装体の乾燥装置 からなることを特徴とする塗膜装置を提供するものであ
る。
Means for Solving the Problems The present invention provides (1) a conveying device equipped with a plurality of jigs for attaching objects to be coated, (ii) a coating liquid tank provided below the jigs, and (iii)
The present invention provides a coating film apparatus comprising:) a jig vibration device for vibrating a jig to which a coated object is attached; and (iv) a drying device for the object to be coated.

また、本発明は、治具に懸下された被塗装体表面の液滴
を吸収する液ダレ除去装置を付加した前記塗膜装置も提
供するものでもある。
Furthermore, the present invention also provides the above-mentioned coating apparatus, which is equipped with a drip removing device that absorbs droplets on the surface of an object to be coated suspended from a jig.

さらに本発明は、乾燥装置に対し、搬送装置下流に治具
洗浄装置を付加した前記の塗膜装置も提供する。
Furthermore, the present invention also provides the above-mentioned coating apparatus in which a jig cleaning device is added downstream of the conveying device to the drying device.

作用 本発明の装置は、振動により被塗装体の液ダマリ、液ブ
レをふるい落とし、余分な液を被塗装体表面から除去す
る。
Operation The apparatus of the present invention uses vibration to shake off liquid clumps and liquid blur from the object to be coated, and removes excess liquid from the surface of the object to be coated.

X良性 つぎに本発明を添付の図面によりさらに具体的に説明す
る。第1図は本発明装置の一具体例を示す概略説明図で
ある。
Next, the present invention will be explained in more detail with reference to the accompanying drawings. FIG. 1 is a schematic explanatory diagram showing a specific example of the apparatus of the present invention.

塗布装置100は、被塗装体を取り付けることのできる
治具を備え、矢印a方向に移動するコンベアからなる搬
送装置10と、該搬送装置の下方に配置された塗布液槽
20、該搬送装置の上方に配置された治具振動装置30
、液ダレ除去装置40、被塗装体の乾燥装置50および
治具洗浄装置60からなる。
The coating device 100 is equipped with a jig that can attach objects to be coated, and includes a conveyor 10 that moves in the direction of arrow a, a coating liquid tank 20 disposed below the conveyor, and a conveyor that moves in the direction of arrow a. Jig vibration device 30 placed above
, a drip removing device 40, a drying device 50 for the object to be coated, and a jig cleaning device 60.

搬送装置IOは、第2図に示すごとく治具コンベア12
からなり、該治具コンベア12は被塗装体(電子部品)
Pを取り付けるJ型の多数の治具1■を装備する。コン
ベア12は搬送方向a(第2図では紙面と垂直方向)に
向かってほぼ水平に長円形を描いて移動することができ
る。なお、コンベアの回転移動は、制御装置によりシン
トロールされた駆動装置(図示せず)により行われろ。
The conveyance device IO includes a jig conveyor 12 as shown in FIG.
The jig conveyor 12 carries objects to be painted (electronic parts).
Equipped with a large number of J-shaped jigs 1■ for attaching P. The conveyor 12 can move approximately horizontally in an oval shape in the conveying direction a (in FIG. 2, perpendicular to the paper surface). Note that the rotational movement of the conveyor is performed by a drive device (not shown) controlled by a control device.

治具の形状は、本具体例で示した3字型のほか、テーバ
状の孔を設けたものなど被塗装品を出し、あるいは載置
できるよう被塗装品の形状に応じて適宜設計されたもの
を用いることができる。
In addition to the 3-shaped jig shown in this example, the shape of the jig was appropriately designed according to the shape of the object to be coated so that the object to be coated could be taken out or placed, such as one with a tapered hole. can be used.

塗布液!’!20は、前記治具11の水平移動レベル下
方の所定の位置に設けられ、槽内に電子部品表面の導電
加工を行う貴金属ペーストを満たす。
Coating liquid! '! 20 is provided at a predetermined position below the level of horizontal movement of the jig 11, and fills the tank with noble metal paste for conductive processing of the surface of the electronic component.

該塗布液槽20は昇降装置(図示せず)にて上下動し、
治具11に吊された被塗装体Pの塗装を行つ。
The coating liquid tank 20 is moved up and down by a lifting device (not shown).
The object to be painted P suspended on the jig 11 is painted.

振動装置30は、塗布液槽20の上方からその若干下流
に至るコンベア12の上部に至る範囲に配置された複数
の六角形の回転カム31からなり、その回転によりスプ
リング32を介して治具コンベア12および治具Ill
こ振動幅すの振動を与える(第3図参照)。治具11に
振動を与えるには、他の適宜の形状のカムを回転させて
もよく、また公知の他の適当な振動発生装置を用いても
よい。
The vibration device 30 is composed of a plurality of hexagonal rotary cams 31 arranged in an area extending from above the coating liquid tank 20 to the top of the conveyor 12 slightly downstream of the coating liquid tank 20. 12 and jig Ill
This gives a vibration of the same amplitude (see Figure 3). In order to apply vibration to the jig 11, a cam having another suitable shape may be rotated, or another suitable known vibration generating device may be used.

つぎに液ダレ除去装置40は、前記塗布液槽20に対し
、治具コンベア12の搬送方向下流の下部に設けられる
。該装置は第4図に示すごとく吸収性のある柔軟な材質
を上面に張り付けた液ダレ除去板41およびエアーシリ
ンダ42により作動する昇降アーム43からなる。被塗
装体P下部の液ブレを拭う除去板41の表面は、布、紙
その他の吸収性の素材で覆われているのがよく、使用後
、焼却して貴金属を回収するのが好ましい。また、液ダ
レ除去板41の昇降はエヤシリンダーのほか、公知のい
かなる昇降装置が用いられてもよい。また、液ダレ除去
装置は、第4図に示した布などを直接被塗装体に近付け
て液滴を拭うもののほか、被塗装体の近傍に吸引口を設
けたエヤーサッカーなど、被塗装体表面の液滴を吸収す
る適宜の装置であってよい。
Next, the liquid drip removal device 40 is provided at a lower part of the coating liquid tank 20 downstream of the jig conveyor 12 in the conveying direction. As shown in FIG. 4, this device consists of a drip removal plate 41 whose upper surface is covered with an absorbent and flexible material, and a lifting arm 43 operated by an air cylinder 42. The surface of the removal plate 41 for wiping liquid blur at the bottom of the object to be painted P is preferably covered with cloth, paper, or other absorbent material, and after use, it is preferable to incinerate it to recover the precious metal. In addition to an air cylinder, any known lifting device may be used to lift and lower the drip removal plate 41. In addition to the liquid drip removal device shown in Figure 4, which wipes the droplets by bringing a cloth directly close to the object to be painted, there are also devices such as an air sucker that has a suction port near the object to be painted. may be any suitable device that absorbs the droplets.

被塗装体の乾燥装置50は、前記液ダレ除去装置40に
対し、コンベアの搬送方向aのさらに下流に設けられる
。該乾燥装置としては従来公知の熱風乾燥機、遠赤外乾
燥機などをいずれら用いることができる。なお、乾燥装
置50のさらに下流には被塗装体の冷却装置51が配置
される。
The drying device 50 for the object to be coated is provided further downstream of the drip removing device 40 in the transport direction a of the conveyor. As the drying device, any conventionally known hot air dryer, far-infrared dryer, etc. can be used. Note that a cooling device 51 for the object to be coated is arranged further downstream of the drying device 50.

治具洗浄装置60は、冷却装置51につづく製品取出し
部Bのさらに下流に設けられる。該洗浄装置は第5図に
示すごとく昇降可能な洗浄槽61および該洗浄槽内に回
転可能に設けられた洗浄ブラシ62からなる。該洗浄槽
6目こは治具11に付着した貴金属ペーストを溶解除去
するa機溶剤が満たされる。該洗浄槽61の後方にはさ
らに治具乾燥装置を設けてもよい。
The jig cleaning device 60 is provided further downstream of the product take-out section B following the cooling device 51. As shown in FIG. 5, the cleaning device includes a cleaning tank 61 that can be moved up and down and a cleaning brush 62 that is rotatably provided within the cleaning tank. The sixth cleaning tank is filled with a solvent for dissolving and removing the noble metal paste attached to the jig 11. A jig drying device may be further provided behind the cleaning tank 61.

なお、前記搬送コンベアの回転移動と、塗布液槽20あ
るいは治具洗浄槽61の昇降、液ダレ除去装置40の作
′動などとの動作のタイミングは、適宜の制御機構によ
り制御することができる。
Incidentally, the timing of the rotational movement of the transport conveyor, the raising and lowering of the coating liquid tank 20 or the jig cleaning tank 61, the operation of the liquid drip removal device 40, etc. can be controlled by an appropriate control mechanism. .

また、本実施例の搬送コンベア12はほぼ水平に移動し
、これに対し所定の位置で塗布液槽、液ダレ除去装置、
あるいは洗浄槽が上昇して塗布、液ダレ除去、治具の洗
浄を行うが、逆に搬送コンベアを所定の位置で下方へ斜
行させ、塗布液、液ダレ除去板、あるいは洗浄ブラシと
接触させてもよい。
Further, the conveyor 12 of this embodiment moves almost horizontally, and the coating liquid tank, drip removal device, etc.
Alternatively, the cleaning tank rises to perform coating, remove drips, and clean the jig, but conversely, the conveyor is moved diagonally downward at a predetermined position and brought into contact with the coating liquid, drip removal plate, or cleaning brush. It's okay.

つぎに前記具体例に示した本発明装置を用いて塗装を行
う方法について説明する。
Next, a method of painting using the apparatus of the present invention shown in the above specific example will be explained.

まず、製品投入部Aにて所定の個数の被塗装体(電子部
品)Pを吊す。かかる電子部品としては、周波数フィル
タなど、導電性の粘稠な(約30cps以上)青金−属
ペースト(導電塗料)類を外面に塗布する必要のある種
々の各種電子部品が挙げられる。該電子部品はコンベア
12の移動により塗布液槽20の上方まで移動し停止す
る。つぎに、昇降装置の作動により塗布液槽20が上昇
して被塗装体をペースト中に埋没させ浸漬が行われる。
First, a predetermined number of objects to be coated (electronic components) P are hung in the product loading section A. Such electronic components include a variety of electronic components, such as frequency filters, that require a conductive viscous (approximately 30 cps or higher) blue metal paste (conductive paint) to be coated on the outer surface. The electronic component is moved above the coating liquid tank 20 by the movement of the conveyor 12 and then stopped. Next, the coating liquid tank 20 is raised by the operation of the elevating device to immerse the object to be coated in the paste, thereby performing immersion.

ペーストとしては、銀粉末、バインダー樹脂およびガラ
スフリットなどからなる銀ペースト、あるいは銀粉末の
変わりに銅粉末、または銀−ニソケルブレンド粉末を用
いたペーストなど従来公知の貴金属ペーストがいずれも
好適に用いられる。
As the paste, any conventionally known noble metal paste can be suitably used, such as a silver paste consisting of silver powder, binder resin, glass frit, etc., or a paste using copper powder or silver-nisokel blend powder instead of silver powder. It will be done.

浸漬完了後、塗布液槽20は下降し、ついで振動装置3
0が作動して治具11を振動させろ。この振動により被
塗装品表面、あるいは被塗装品と治具との間の液ダマリ
、液ブレが除去され、余分な貴金属ペーストが塗布液槽
20に滴下する。また、振動により治具11と被塗装体
Pとの接触前が移動してより均一な塗膜が得られる。こ
のような振動装置を設けたことにより、金属ペーストの
ごとき比較的粘度の高い導電塗料を均一に精度よく塗布
することが可能となる。
After the immersion is completed, the coating liquid tank 20 is lowered, and then the vibrating device 3
0 operates and vibrates the jig 11. This vibration removes liquid clumps and liquid blur on the surface of the object to be coated or between the object to be coated and the jig, and excess noble metal paste drips into the coating liquid tank 20. In addition, the vibration moves the area before contact between the jig 11 and the object to be coated P, resulting in a more uniform coating film. By providing such a vibrating device, it becomes possible to uniformly and accurately apply a relatively high viscosity conductive paint such as metal paste.

さらに、コンベア12は矢印a方向に移動し、液ダレ除
去装置40の上方にて停止する。つぎに昇降アーム43
の作動により液ダレ除去板41が上昇し、被塗装体P下
部の液ブレを拭い、貴金属の回収を行う。
Further, the conveyor 12 moves in the direction of arrow a and stops above the drip removal device 40. Next, lift arm 43
As a result of the operation, the liquid drip removal plate 41 rises, wipes the liquid dripping from the lower part of the object to be coated P, and collects the precious metal.

このようにして均一な塗膜の形成された被塗装体Pはコ
ンベア12の移動に従って乾燥装置50に導入され、塗
膜に応じ100〜150℃にて5〜lO分間°乾燥が行
われる。乾燥の完了した塗装電子部品は、冷却器51の
ファンにて冷却された後、製品取出部Bにて治具11よ
り取り外される。
The object P to be coated on which a uniform coating film has been formed is introduced into the drying device 50 as the conveyor 12 moves, and is dried for 5 to 10 minutes at 100 to 150° C. depending on the coating film. The painted electronic components that have been completely dried are cooled by the fan of the cooler 51, and then removed from the jig 11 at the product removal section B.

電子部品の取り外された治具11は、コンベア12の移
動によりさらに移動し治具洗浄装置60の上方に位置す
る。つぎに洗浄槽61が上昇し洗浄ブラシ62の回転に
より治具の表面に付着したペーストが洗い落とされる。
The jig 11 from which the electronic components have been removed is further moved by the movement of the conveyor 12 and positioned above the jig cleaning device 60 . Next, the cleaning tank 61 is raised and the paste adhering to the surface of the jig is washed off by rotation of the cleaning brush 62.

このようにして洗浄された治具11はさらにコンベア1
2.の移動に伴いもとの製品投入部Aにもどり、以後同
様の動作を繰り返す。
The jig 11 cleaned in this way is further conveyed to the conveyor 1.
2. As it moves, it returns to the original product input section A, and the same operation is repeated thereafter.

なお、被塗装体である電子部品の取り付け、および塗装
完了部品の取り外しは手動、自動のいずれで行ってもよ
−い。
Incidentally, the attachment of the electronic parts to be painted and the removal of the painted parts may be carried out either manually or automatically.

また、本発明装置にて行われる塗装は、電子部品への貴
金属ペーストの塗装に限定されるものではなく、多数の
被塗装体に比較的粘稠な流動体をを用いて均一な塗膜を
設ける場合にいずれも好適に採用されうる。
Furthermore, the coating performed by the device of the present invention is not limited to coating electronic components with precious metal paste, but also applies a relatively viscous fluid to a large number of objects to be coated with a uniform coating. Any of these can be suitably employed when provided.

発明の効果 本発明の装置によれば、被塗装体への塗膜の形成、特に
電子部品への貴金属ペーストの塗布が連続的にかつ均一
に行なわれ、電子部品の性能および生産性の向上が可能
となる。
Effects of the Invention According to the apparatus of the present invention, the formation of a coating film on an object to be coated, especially the application of noble metal paste to electronic components, is carried out continuously and uniformly, thereby improving the performance and productivity of electronic components. It becomes possible.

また、液ダレ除去装置を設けることにより、塗膜はより
均一となる。
Furthermore, by providing a drip removal device, the coating film becomes more uniform.

さらに、治具洗浄装置を設けることにより、治具への塗
料の蓄積がなくなる。
Furthermore, by providing a jig cleaning device, there is no accumulation of paint on the jig.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明装置の一具体例を示す概略平面図、第2
図はその振動装置の部分を示す立面図、第3図は第2図
の正面図、第4図は液ダレ除去装置の立面図、第5図は
治具洗浄装置を示す説明図、第6図および第7図は従来
の塗布方法を示す説明図である。図中の主な符号はっぎ
のとおりである。 10:搬送装置、11:治具、12:コンベア、20:
塗布液槽、30:振動装置、40:液ダレ除去装置、5
0:乾燥装置、60:治具洗浄装置、P 被塗装体。 特許出願人  大研化学工業株式会社 代理人弁理士  森  岡   博 第4図 第5図 bz EtE+ 7−ラ!/ 第6図 第 7図
FIG. 1 is a schematic plan view showing a specific example of the device of the present invention, and FIG.
The figure is an elevation view showing the vibrating device, FIG. 3 is a front view of FIG. 2, FIG. 4 is an elevation view of the liquid drip removal device, and FIG. FIGS. 6 and 7 are explanatory diagrams showing a conventional coating method. The main symbols in the figure are as shown. 10: Conveyance device, 11: Jig, 12: Conveyor, 20:
Coating liquid tank, 30: Vibration device, 40: Liquid drip removal device, 5
0: drying device, 60: jig cleaning device, P object to be coated. Patent Applicant Daiken Chemical Industry Co., Ltd. Representative Patent Attorney Hiroshi Morioka Figure 4 Figure 5 bz EtE+ 7-ra! / Figure 6 Figure 7

Claims (3)

【特許請求の範囲】[Claims] (1)(i)被塗装体を取り付ける複数の治具を備えた
搬送装置、 (ii)該治具の下方に設けられた塗布液槽、 (iii)塗布の完了した被塗装体を取り付けた治具を
振動させる治具振動装置、 (iv)被塗装体の乾燥装置 からなることを特徴とする塗膜装置。
(1) (i) A conveying device equipped with multiple jigs for attaching objects to be coated, (ii) A coating liquid tank provided below the jigs, (iii) A conveyor device equipped with a plurality of jigs for attaching objects to be coated, (iii) A transfer device equipped with a plurality of jigs for attaching objects to be coated; A coating film apparatus comprising: a jig vibration device for vibrating a jig; and (iv) a drying device for an object to be coated.
(2)治具に懸下された被塗装体表面の液滴を吸収する
液ダレ除去装置を設けた前記請求項1記載の塗膜装置。
(2) The coating apparatus according to claim 1, further comprising a drip removing device for absorbing droplets on the surface of the object to be coated suspended from the jig.
(3)前記乾燥装置に対し搬送装置のさらに下流に治具
洗浄装置を設けた前記請求項1または2記載の塗膜装置
(3) The coating device according to claim 1 or 2, further comprising a jig cleaning device provided downstream of the conveying device with respect to the drying device.
JP23781388A 1988-09-21 1988-09-21 Coated film device Pending JPH0286868A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23781388A JPH0286868A (en) 1988-09-21 1988-09-21 Coated film device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23781388A JPH0286868A (en) 1988-09-21 1988-09-21 Coated film device

Publications (1)

Publication Number Publication Date
JPH0286868A true JPH0286868A (en) 1990-03-27

Family

ID=17020788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23781388A Pending JPH0286868A (en) 1988-09-21 1988-09-21 Coated film device

Country Status (1)

Country Link
JP (1) JPH0286868A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0670862U (en) * 1993-03-08 1994-10-04 三友工業株式会社 Dip device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133603A (en) * 1981-02-12 1982-08-18 Matsushita Electric Industrial Co Ltd Apparatus for producing electronic part
JPS58153555A (en) * 1982-03-08 1983-09-12 ザ・コンテイネンタル・グル−プ・インコ−ポレ−テツド Adhesive coating method and apparatus
JPS63137448A (en) * 1986-11-29 1988-06-09 Nec Corp Semiconductor wafer treatment apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133603A (en) * 1981-02-12 1982-08-18 Matsushita Electric Industrial Co Ltd Apparatus for producing electronic part
JPS58153555A (en) * 1982-03-08 1983-09-12 ザ・コンテイネンタル・グル−プ・インコ−ポレ−テツド Adhesive coating method and apparatus
JPS63137448A (en) * 1986-11-29 1988-06-09 Nec Corp Semiconductor wafer treatment apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0670862U (en) * 1993-03-08 1994-10-04 三友工業株式会社 Dip device

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