JPH0287531U - - Google Patents

Info

Publication number
JPH0287531U
JPH0287531U JP1988163793U JP16379388U JPH0287531U JP H0287531 U JPH0287531 U JP H0287531U JP 1988163793 U JP1988163793 U JP 1988163793U JP 16379388 U JP16379388 U JP 16379388U JP H0287531 U JPH0287531 U JP H0287531U
Authority
JP
Japan
Prior art keywords
lead
punch
die
forming apparatus
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988163793U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988163793U priority Critical patent/JPH0287531U/ja
Publication of JPH0287531U publication Critical patent/JPH0287531U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Bending Of Plates, Rods, And Pipes (AREA)
  • Wire Processing (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示すリード成形装
置の斜視図、第２図イ，ロ及び第３図はそれぞれ
同実施例のリード成形装置を用いたリード成形を
示す説明図であり、第２図イと第２図ロはそれぞ
れリード成形前とリード成形後の正面図、第３図
はリード成形後の要部拡大図を示し、第４図は他
の実施例にかかるリード成形装置の要部拡大図、
第５図は従来のリード成形装置の斜視図、第６図
は従来のリード成形装置の正面図である。 ２…樹脂モールドパツケージ、３…リード、４
…ダイ、９…リード押え、１０…パンチ。 FIG. 1 is a perspective view of a lead forming device showing an embodiment of the present invention, and FIGS. 2A, 2B, and 3 are explanatory diagrams showing lead forming using the lead forming device of the same embodiment, respectively. Figures 2A and 2B are front views before and after lead forming, respectively, Figure 3 is an enlarged view of the main parts after lead forming, and Figure 4 is a lead forming apparatus according to another embodiment. Enlarged view of the main parts of
FIG. 5 is a perspective view of a conventional lead forming device, and FIG. 6 is a front view of the conventional lead forming device. 2...Resin mold package, 3...Lead, 4
...Die, 9...Lead presser, 10...Punch.

Claims (1)

【実用新案登録請求の範囲】 樹脂モールドパツケージより導出したリードの
基部下面を支持するダイと、各リード基部上面を
押圧するリード押えと、該リード押えの外側に配
置され上下動自在して上記リードを押圧折曲する
パンチとを具備するリード成形装置において、 上記パンチの少なくともリード押圧部を硬質ゴ
ムにて構成したことを特徴とするリード成形装置
。[Claims for Utility Model Registration] A die that supports the lower surface of the base of the lead led out from the resin mold package, a lead holder that presses the upper surface of each lead base, and a die that is arranged outside the lead holder and is movable up and down to support the lead. A lead forming apparatus comprising: a punch for pressing and bending a lead forming apparatus, characterized in that at least a lead pressing part of the punch is made of hard rubber.
JP1988163793U 1988-12-16 1988-12-16 Pending JPH0287531U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988163793U JPH0287531U (en) 1988-12-16 1988-12-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988163793U JPH0287531U (en) 1988-12-16 1988-12-16

Publications (1)

Publication Number Publication Date
JPH0287531U true JPH0287531U (en) 1990-07-11

Family

ID=31448835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988163793U Pending JPH0287531U (en) 1988-12-16 1988-12-16

Country Status (1)

Country Link
JP (1) JPH0287531U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010120045A (en) * 2008-11-19 2010-06-03 Suncall Corp Device for manufacturing press molded article and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010120045A (en) * 2008-11-19 2010-06-03 Suncall Corp Device for manufacturing press molded article and method for manufacturing the same

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