JPH0287640A - Structure of TAB tape - Google Patents
Structure of TAB tapeInfo
- Publication number
- JPH0287640A JPH0287640A JP24040788A JP24040788A JPH0287640A JP H0287640 A JPH0287640 A JP H0287640A JP 24040788 A JP24040788 A JP 24040788A JP 24040788 A JP24040788 A JP 24040788A JP H0287640 A JPH0287640 A JP H0287640A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- tab
- fingers
- external connection
- tab tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008602 contraction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ＴＡＢ実装方式に用いるＴＡＢテーグの構造
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a TAB tag used in a TAB mounting method.
［従来の技術］
従来のＴＡＪ３テープのフィンガー形状は、第２図（α
）（ｈ）に示すように１既略直線的に構成されていた。[Prior art] The finger shape of the conventional TAJ3 tape is shown in Figure 2 (α
) As shown in (h), it was constructed almost linearly.
［発明が解決しようとする課題］
しかし、前述の従来技術では第２図（α）、（ｂ）に示
されるように一括接続を行なうだめの突起であるバンプ
６と工０チップ１の外部接続用パッド２とを接続するボ
ンディング時において、熱を加えられるためフィンガー
４が膨張し、外部接続用バンド２表面をこすることによ
り、キズが付くという問題点があった。また、ボンディ
ング後においてフィンガー４が熱的に収縮を起こすため
に引っ張り力が生じ、ボンディング接合部の接合強度が
低下し、ひどいものでは接合部がはずれてしまうことが
あったり、あるいはフィンガー４自身が破断してしまう
といった問題点があった。[Problems to be Solved by the Invention] However, in the prior art described above, as shown in FIGS. 2(α) and (b), the external connection between the bump 6, which is a protrusion that is used for collective connection, and the chip 1 is difficult. At the time of bonding to the external connection pad 2, the finger 4 expands due to the application of heat and rubs the surface of the external connection band 2, causing scratches. Furthermore, after bonding, the fingers 4 undergo thermal contraction, which generates tensile force, which reduces the bonding strength of the bonded joint, and in severe cases, the joint may come off, or the fingers 4 themselves may become damaged. There was a problem that it would break.
そこで、本発明はこのような問題点を１１イ決するため
になされたもので、その目的とするところはボンディン
グ接合部のはずれや、フィンガー破断のおそれのないＴ
ＡＢテープの構造を提供するところにある。Therefore, the present invention has been made to solve these problems, and its purpose is to create a T
It provides the structure of AB tape.
［課題を解決するための手段］
本発明のＴＡＢテープの構造は、テープのフィンガー形
状を非直線的としたことを特徴とする。[Means for Solving the Problems] The structure of the TAB tape of the present invention is characterized in that the finger shape of the tape is non-linear.
［実施例コ
第１図は本発明の実施例における平面図であって、１は
ＩＣチップ、２はＩＣチップ１上に配置された外部接続
用パッド、４はＴＡＢテープのフィンガー ３は外部接
続用パッド２とフィンガー４を接続するための突起であ
るバンプ、５はフィンガー４を固定しておくテープ部材
である。[Embodiment] Fig. 1 is a plan view of an embodiment of the present invention, in which 1 is an IC chip, 2 is an external connection pad arranged on the IC chip 1, 4 is a finger of TAB tape, and 3 is an external connection. A bump 5, which is a protrusion for connecting the pad 2 and the finger 4, is a tape member that fixes the finger 4.
第１図の実施例によれば、フィンガー４の形状が直線的
でないためにボンディング時に加わる熱によるフィンガ
ー４の膨張あるいは収縮が吸収されるので、外部接続用
パッド２とバンプ５の接合部に生ずる応力が小さくなり
接合部のはずれ、またはフィンガー４の破断を防止する
ことができるさらに同様な理由からボンディング後にお
いても、温度変化によるフィンガー４の膨張収縮がもた
らす接合部分及びフィンガー４へのダメージを少な（す
ることができる。According to the embodiment shown in FIG. 1, since the shape of the fingers 4 is not linear, expansion or contraction of the fingers 4 due to heat applied during bonding is absorbed, which occurs at the joint between the external connection pad 2 and the bump 5. The stress is reduced, which prevents the bonding portion from coming off or the fingers 4 from breaking.Furthermore, for the same reason, even after bonding, damage to the bonding portion and the fingers 4 caused by expansion and contraction of the fingers 4 due to temperature changes is reduced. (can do.
また本発明は、フィンガーと外部接続用パッドを接続す
るための突起であるバンプを〕、インカー側へ形成して
行なわれるＴＡＢ実装方式の他に、外部接続用パッド上
にバンプを形成して行なわれるＴＡＢ実装方式について
も適用でき、その効果は同様に得ることができる。In addition to the TAB mounting method in which bumps, which are protrusions for connecting fingers and external connection pads, are formed on the inker side, the present invention also provides a method in which bumps are formed on external connection pads. The present invention can also be applied to the TAB mounting method, and the same effect can be obtained.
［発明の効果］
以上述べたように本発明によれば、ＴＡＢテープのフィ
ンガー形状を非直線にしたことにより、ボンディング時
の接合部のはずれ、またはフィンガーの破断を防止でき
るという効果を有するために、半導体装置のＴＡＢ実装
における歩留シを向上することがでさた。さらに、これ
を用いた電子機器等の長期信頼性を向上することができ
た。[Effects of the Invention] As described above, according to the present invention, by making the finger shape of the TAB tape non-linear, it is possible to prevent dislocation of the joint portion or breakage of the fingers during bonding. , it was possible to improve the yield in TAB mounting of semiconductor devices. Furthermore, the long-term reliability of electronic devices using this could be improved.
第１図は本発明のＴＡＢテープの構造の一実施例を示す
平面図。
第２図（α）は従来のＴＡＢテープを示す平面図。
第２図（ｂ）は第２図（α）のＡ−Ａ’断面図１・・・
・・・・・工Ｃチップ
２・・・・・・・・外部接続用パッド
５・・・・・・・・バンプ
４・・・・・・・・・フィンカー
５・・・・・・・・・テープ部材
以上
出願人 セイコーエプソン株式会社FIG. 1 is a plan view showing an embodiment of the structure of the TAB tape of the present invention. FIG. 2(α) is a plan view showing a conventional TAB tape. Fig. 2(b) is a sectional view 1--A-A' of Fig. 2(α)...
......Engineer C chip 2...External connection pad 5...Bump 4...Finker 5... ...Applicant for tape parts and above: Seiko Epson Corporation
Claims (1)
すなわちＴＡＢテープの構造において、前記テープのフ
ィンガー形状を非直線的としたことを特徴とするＴＡＢ
テープの構造。In the structure of a circuit board of a tape carrier type so-called TAB mounting type, that is, a TAB tape, the TAB is characterized in that the finger shape of the tape is non-linear.
Structure of the tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24040788A JPH0287640A (en) | 1988-09-26 | 1988-09-26 | Structure of TAB tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24040788A JPH0287640A (en) | 1988-09-26 | 1988-09-26 | Structure of TAB tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0287640A true JPH0287640A (en) | 1990-03-28 |
Family
ID=17059005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24040788A Pending JPH0287640A (en) | 1988-09-26 | 1988-09-26 | Structure of TAB tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0287640A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6437453B1 (en) | 1999-01-22 | 2002-08-20 | Seiko Epson Corporation | Wire bonding method, semiconductor device, circuit board, electronic instrument and wire bonding device |
-
1988
- 1988-09-26 JP JP24040788A patent/JPH0287640A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6437453B1 (en) | 1999-01-22 | 2002-08-20 | Seiko Epson Corporation | Wire bonding method, semiconductor device, circuit board, electronic instrument and wire bonding device |
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