JPH0287697A - Method for manufacturing multilayer printed wiring board - Google Patents
Method for manufacturing multilayer printed wiring boardInfo
- Publication number
- JPH0287697A JPH0287697A JP63240117A JP24011788A JPH0287697A JP H0287697 A JPH0287697 A JP H0287697A JP 63240117 A JP63240117 A JP 63240117A JP 24011788 A JP24011788 A JP 24011788A JP H0287697 A JPH0287697 A JP H0287697A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer printed
- hole
- layer material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、民生用および産業用など、各種電子機器に広
く用いることができるインタスティシャルバイアホール
を有する高密度の多層プリント配線板の製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a high-density multilayer printed wiring board having interstitial via holes that can be widely used in various electronic devices such as consumer and industrial devices. It is something.
従来の技術
以下図面を参照しながら、従来のインタスティシャルバ
イアホールを有する多層プリント配線板の製造方法につ
いて説明する。第７図は、内導体１と両表面に外導体２
，３をもった基材４にスルーホール６の加工を行った断
面を示すものである。BACKGROUND OF THE INVENTION A conventional method for manufacturing a multilayer printed wiring board having interstitial via holes will be described with reference to the drawings. Figure 7 shows an inner conductor 1 and outer conductors 2 on both surfaces.
, 3 shows a cross section of a base material 4 having through holes 6 processed therein.
第８図は、この基材４のスルーホール６０部分にめっき
６を施した後、第一面に所定の導通パターンを形成した
基材４の断面を示すものである。第９図、第１０図は、
第８図の基材４．プリプレグ７、内層材８．外層材９を
用いて成型した多層配線板の断面を示すものである。第
１１図は、スルーホーｌＬ／１０の加工を行い、スルー
ホール１００部分にめっき１１を施した後、所定の導通
パターンを形成した多層配線板の断面を示すものである
。FIG. 8 shows a cross section of the base material 4 in which a predetermined conductive pattern is formed on the first surface after plating 6 is applied to the through-hole 60 portion of the base material 4. As shown in FIG. Figures 9 and 10 are
Base material 4 in FIG. Prepreg 7, inner layer material 8. It shows a cross section of a multilayer wiring board molded using outer layer material 9. FIG. 11 shows a cross section of a multilayer wiring board in which a predetermined conductive pattern is formed after processing a through hole 1L/10 and applying plating 11 to a portion of the through hole 100.
上記方法により、第１１図に示すようなインタヌティシ
ャルバイアホールを有する多層プリント配線板を製造す
ることができる。By the above method, a multilayer printed wiring board having internal via holes as shown in FIG. 11 can be manufactured.
発明が解決しようとする課題
このように従来の多層プリント配線板の製造方法では以
下のような問題点が生じる。第８図の基材４．グリプレ
グ７、内層材８．外層材９を用い１成型を行った場合に
は、スルーホール１０よシ樹脂かにじみ出し、所定の導
通パターンを形成する時、にじみ出した樹脂がショート
不良の原因になるという課題がある。またにじみ出した
樹脂を除去するために、研磨等の機械的方法を用いた場
合には、スルーホール１０に施しためっきのコーナ一部
分でめっきの欠けが生じるという課題がある。またエツ
チング等の化学的方法または物理的方法を用いた場合で
も、にじみ出した樹脂を完全に除去できないという課題
がある。Problems to be Solved by the Invention As described above, the following problems arise in the conventional method of manufacturing a multilayer printed wiring board. Base material 4 in FIG. Gripreg 7, inner layer material 8. When one molding is performed using the outer layer material 9, there is a problem that the resin oozes out from the through hole 10 and causes a short circuit failure when a predetermined conductive pattern is formed. Furthermore, when a mechanical method such as polishing is used to remove the oozed resin, there is a problem that the plating applied to the through hole 10 may be chipped at a portion of the corner. Furthermore, even when chemical or physical methods such as etching are used, there is a problem in that the oozed resin cannot be completely removed.
本発明は、このような従来の課題を除去するものであり
、スルーホールより樹脂かにじみ出すことなく５インタ
ステイシヤルパイアホールを有する多層プリント配線板
を歩留良く、効率良く製造する方法を提供するものであ
る。The present invention eliminates such conventional problems and provides a method for efficiently manufacturing a multilayer printed wiring board having 5 interstitial pipe holes with high yield without resin seeping out from the through holes. It is something to do.
課題を解決するための手段
上記課題を解決するために本発明の多層プリント配線板
の製造方法は、ＮＣ穴加工等によりヌルーホール加工を
行い、スルーホール部にめっきを施した基板の第一面に
所定の導通パターンを形成し、接着シートを貼り合せ、
内層材・プリプレグ・外層材等を重ね合せて成型して、
インスタテイシャルパイアホールを形成することを特徴
とするものである。Means for Solving the Problems In order to solve the above-mentioned problems, the method for manufacturing a multilayer printed wiring board of the present invention involves forming null holes by NC hole processing or the like, and then forming a hole on the first surface of the board in which the through-hole portion is plated. Form a predetermined conductive pattern, attach an adhesive sheet,
By layering and molding inner layer material, prepreg, outer layer material, etc.
It is characterized by the formation of an instastial pier hole.
作用
この方法により、ＮＣ穴加工・スルーホールめっきを施
した基材の第一面に所定の導通パターンを形成した後、
プリプレグに比べてほとんど樹脂流れのない接着シート
を貼シ合せ、内層材・プリプレグ・外層材と成型するこ
とで、スルーホールよシ樹脂かにじみ出すことなく、研
磨等の機械的方法で樹脂を除去する必要なく、インタヌ
ティシャルバイアホールを有する多層プリント配線板を
歩留良く、効率良く提供することができるものとなる。Function After forming a predetermined conductive pattern on the first surface of the base material that has been subjected to NC hole processing and through-hole plating by this method,
By laminating an adhesive sheet with almost no resin flow compared to prepreg and molding it with the inner layer material, prepreg, and outer layer material, the resin can be removed by mechanical methods such as polishing without the resin oozing into the through holes. It becomes possible to provide a multilayer printed wiring board having an internal via hole with high yield and efficiency without the need to do so.
実施例
以下本発明の多層フリント配線板の製造方法を図面を参
照しながら説明する。第１図は、内導体１２、外導体１
３．１４を有し、スルーホール１６の加工を行った基材
１６の断面を示すものである。EXAMPLES Hereinafter, a method for manufacturing a multilayer flint wiring board according to the present invention will be explained with reference to the drawings. Figure 1 shows an inner conductor 12 and an outer conductor 1.
3.14 and shows a cross section of a base material 16 in which through holes 16 have been processed.
第２図は、スルーホール１６０部分にめっき１７を施し
た後、第一面に所定の導通パターンを形成した基材１６
の断面を示すものである。第３図は、変性エポキシ樹脂
を主成分とする高分子化合物の一体化した接着シート１
８を所定の導通パターン１４上に貼シ合わせた基材１６
の断面を示すものである。第４図、第６図は、第３図に
示す接着シート１８を貼り合せた基材１６・内層材１９
・プリプレグ２ｏ・外層材２１を用いて成型した多層プ
リント配線板の断面を示すものである。第６図は、スル
ーホール２２の加工を行い、スルーホール２２の部分に
めっき２３を施した後、所定の導通パターンを形成した
多層プリント配線板の断面を示すものである。上記方法
により、第６図に示すインタスティシャルバイアホール
を有する多層プリント配線板を製造することができる。FIG. 2 shows a base material 16 on which a predetermined conductive pattern is formed on the first surface after plating 17 is applied to the through hole 160 portion.
This figure shows a cross section of . Figure 3 shows an adhesive sheet 1 that is an integrated polymer compound whose main component is a modified epoxy resin.
8 is laminated onto a predetermined conductive pattern 14.
This figure shows a cross section of . 4 and 6 show the base material 16 and inner layer material 19 to which the adhesive sheet 18 shown in FIG. 3 is attached.
- It shows a cross section of a multilayer printed wiring board molded using prepreg 2o and outer layer material 21. FIG. 6 shows a cross section of a multilayer printed wiring board in which a predetermined conductive pattern is formed after processing the through holes 22 and applying plating 23 to the through holes 22. As shown in FIG. By the above method, a multilayer printed wiring board having interstitial via holes shown in FIG. 6 can be manufactured.
なお、第１図から第６図までは、８層多層プリント配線
板の例を示したが、上記多層プリント配線板の製造方法
を一部変更することにより、３層以上の多層プリント配
線板も製造することができる。Note that although FIGS. 1 to 6 show examples of 8-layer multilayer printed wiring boards, by partially changing the manufacturing method of the multilayer printed wiring boards described above, multilayer printed wiring boards with 3 or more layers can also be produced. can be manufactured.
発明の効果
以上のように本発明は、ＮＧ穴加工・スルーホールめっ
きを施した基材の第一面に所定の導通パターンを形成し
た後、プリプレグに比べほとんど樹脂流れのない接着シ
ートを貼り合せ、内層材・プリプレグ・外層材と成型す
ることにより、スルーホールよシの樹脂のにじみ出しが
なく、にじみ出した樹脂を除去するために研磨等の機械
的方法を用いることなく、インタスティシャルバイアホ
ールを有する多層プリント配線板を製造することができ
、その実用的効果は犬なるものである。Effects of the Invention As described above, the present invention forms a predetermined conductive pattern on the first surface of a base material that has undergone NG hole processing and through-hole plating, and then laminates an adhesive sheet with almost no resin flow compared to prepreg. By molding the inner layer material, prepreg, and outer layer material, there is no resin oozing from the through hole, and there is no need to use mechanical methods such as polishing to remove the oozing resin. It is possible to produce a multilayer printed wiring board with a 100% polyurethane, and its practical effects are outstanding.
【図面の簡単な説明】
第１図から第６図までは本発明の多層プリンＩ・配線板
の製造方法を示す断面図、第７図から第１１図までは従
来の多層プリント配線板の製造方法を示す断面図である
。
１６・・・・・・スルーホール、１６・・・・・・基材
、１７・・・・・めっき、１８・・・・・・接着シート
、１９・・・・・・内層材、２０・・・・・プリプレグ
、２１・・・・・・外層材、２２・・・・・・スルーホ
ール、２３・・・・・・めっき。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名第
図
第
図
第
図
第
図
第
図
第
図
１５−一一スルー木−シ
１〆ご３°、２２〜−−ズ ノシー；ｔζ−イｂ嬉
図
第
図
１５．２ど−−−スル−舅く−λ／
？！−外Ｊ＃[Brief Description of the Drawings] Figures 1 to 6 are cross-sectional views showing the method for manufacturing a multilayer printed wiring board according to the present invention, and Figures 7 to 11 are cross-sectional views showing the method for manufacturing a multilayer printed wiring board according to the present invention. FIG. 3 is a cross-sectional view showing the method. 16... Through hole, 16... Base material, 17... Plating, 18... Adhesive sheet, 19... Inner layer material, 20... ... Prepreg, 21 ... Outer layer material, 22 ... Through hole, 23 ... Plating. Name of agent: Patent attorney Shigetaka Awano and one other person Happy diagram Figure 15.2 Do---through-舅ku-λ/? ! -Outside J#
Claims (1)
ホール部にめっきを施した基材の第一面に所定の導通パ
ターンを形成し、接着シートを貼り合せ、内層材，プリ
プレグ，外層材等を重ね合せて成型して、インタスティ
シャルバイアホールを形成することを特徴とする多層プ
リント配線板の製造方法。Through-hole processing is performed using NC hole processing, etc., a predetermined conductive pattern is formed on the first surface of the base material with plating applied to the through-hole portion, an adhesive sheet is pasted, and the inner layer material, prepreg, outer layer material, etc. are layered. A method for manufacturing a multilayer printed wiring board, which comprises molding together to form an interstitial via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63240117A JPH0287697A (en) | 1988-09-26 | 1988-09-26 | Method for manufacturing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63240117A JPH0287697A (en) | 1988-09-26 | 1988-09-26 | Method for manufacturing multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0287697A true JPH0287697A (en) | 1990-03-28 |
Family
ID=17054742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63240117A Pending JPH0287697A (en) | 1988-09-26 | 1988-09-26 | Method for manufacturing multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0287697A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0254994A (en) * | 1988-08-19 | 1990-02-23 | Fujitsu Ltd | Manufacture of multi-layer printed-circuit board with blind through hole |
-
1988
- 1988-09-26 JP JP63240117A patent/JPH0287697A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0254994A (en) * | 1988-08-19 | 1990-02-23 | Fujitsu Ltd | Manufacture of multi-layer printed-circuit board with blind through hole |
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