JPH0287698A - Manufacture of multilayer printed board - Google Patents

Abstract

PURPOSE:To prevent entering of foreign materials and to prevent development of copper remaining, pattern enlargement, pattern defects, etc., by forming a copper foil on a surface of an intermediate plate by plating the intermediate plate and by conducting laminating of a multilayer printed board using the copper foil on the intermediate plate. CONSTITUTION:Plating solution 20a such as copper sulfate solution is put in a plating tank 20 consisting of polyvinyl chloride, and an intermediate plate 11 made of stainless steal is immersed in the center. Electrode plates 21 made of copper are provided to the both sides of the intermediate plate 11, the intermediate plate and the electrode plate 21 are connected to a plating power source 22, and copper 11a is deposited on a surface of the intermediate plate. Then prepregs 2, 6 which are made by impregnating resin into glass fibers, intermediate layer substrates 3, 7 which are made by forming a conductive layer pattern on an insulating plate, and prepregs 4, 8 are put among a plurality of copper foils 1, 5, 9 on the intermediate plate and laminated on a formation hydraulic press 23 which can control an applied pressure through hydraulic pressure. A lamination is formed by heating and pressurizing.

Description

[Detailed Description of the Invention] [Summary] Regarding the improvement of the method of laminating multilayer printed boards using a forming press, the multilayer printed boards are laminated using a copper foil that is temporarily formed as a lamination jig, and the copper foil is stamped. Scars, scars.

The purpose is to provide a method for manufacturing multilayer printed boards that can prevent the occurrence of wrinkles, etc., and includes a process of forming copper foil on the surface of an intermediate plate used as a jig in the lamination process, and a process of forming copper foil with multiple intermediate plates. The method includes the steps of sandwiching and stacking the prepreg made of glass fibers impregnated with a resin, the intermediate layer substrate made of an insulating plate with a conductive layer pattern formed thereon, and applying pressure while heating.

[Industrial application field]

The present invention relates to a method for manufacturing a multilayer printed board, and particularly to an improvement in a method for laminating a multilayer printed board using a forming press.

In the lamination process of a multilayer printed board using a forming press, the multilayer printed board is laminated using commercially available copper foil that has been produced and surface-treated.

In this process, dents, scratches, wrinkles, etc. occur on the copper foil,
This causes a decline in the quality of multilayer printed boards.

Under the above circumstances, there is a need for a method of manufacturing a multilayer printed board that does not cause dents, scratches, wrinkles, etc. on copper foil during the lamination process of the multilayer printed board.

[Conventional technology]

The conventional method for manufacturing multilayer printed boards is shown in Figures 2(a) to 2(b).
This will be explained in detail below.

The copper foil used in the production of conventional multilayer printed boards is commercially available. A stainless steel drum immersed in a copper sulfate solution is used as an electrode, and the surface of the copper foil deposited on the surface is treated with roughness and rust prevention. It is treated and its thickness is 5.
~150 μm.

In the process of laminating copper foil in the manufacturing process of a multilayer printed board, first, as shown in FIG. A foil 11a, a prepreg 12 made of glass fiber impregnated with resin, an intermediate layer base Fi 13 made of an insulating plate with a conductive layer pattern formed thereon, a prepreg 14, and a copper foil 15a are laminated, and as shown in FIG. Laminate molding is performed by applying pressure while heating using a hydraulic press for molding that can control the pressing force.

[Problem to be solved by the invention]

In the conventional manufacturing method for multilayer printed circuit boards as described above, single intermediate plates and copper foil are used, so wrinkles and scratches may occur when handling the thin copper foil, and Foreign matter enters between the plate and the copper foil, and dents occur on the surface of the copper foil when pressurized by a forming press. When a pattern is formed on this copper foil, copper remains, the pattern becomes thicker, the pattern is chipped, etc. There was a problem in that it caused the occurrence of

In view of the above-mentioned circumstances, the present invention can laminate multilayer printed boards using copper foil formed on an intermediate plate, which is a lamination jig, and prevent the occurrence of dents, scratches, wrinkles, etc. on the copper foil. The purpose of this invention is to provide a method for manufacturing a multilayer printed board.

(Means for Solving the Problems) The method for manufacturing a multilayer printed board of the present invention includes a step of forming a copper foil on the surface of an intermediate board used as a jig in the lamination process, and a plurality of intermediate tacking copper foils. The structure includes the steps of stacking prepreg in which fibers are impregnated with resin, an intermediate layer substrate in which a four-electrode layer pattern is formed on an insulating plate, and applying pressure while sandwiching the prepreg.

[Effect]

That is, in the present invention, a copper foil is formed on the surface of the intermediate plate by plating the intermediate plate, and a multilayer printed board is laminated using this copper foil with the intermediate plate, so that there are no foreign substances between the copper foil and the intermediate plate. Therefore, even if a pattern is formed on this copper foil, problems such as copper residue, pattern thickening, and chipping will not occur. disappears.

〔Example〕

Hereinafter, with reference to FIG. 1, an embodiment of molding a four-layer board of the present invention in two stages will be described in order of process.

First, 2 oa of plating solution, for example, a copper sulfate solution, is poured into a plating tank 20 made of polyvinyl chloride as shown in FIG. 21, the intermediate plate and the electrode plate 21 are connected to a plating power source 22, and a voltage is applied to deposit copper on the surface of the intermediate plate.

When the thickness of the deposited copper reaches a predetermined thickness of 5 to 150 μm, the voltage of Metsuki Kagami Ti and 22 is increased (to increase the plating current value, and the surface of the copper foil formed on the intermediate plate is made uneven. Apply unevenness treatment to create unevenness.

Thereafter, the copper foil is subjected to an anti-rust treatment that forcibly forms a stable oxide film, and the production of the copper foil with the intermediate plate is completed.

In the plating process, only one electrode plate is used for the copper foil with the intermediate plate used on the top and bottom surfaces in the lamination process so that the copper foil is formed only on one side of the intermediate plate.

Next, as shown in FIG. 1 (bl), prepreg 2. intermediate layer board is placed between copper foil 1 with intermediate plate 1 and copper foil 9 with intermediate plate in a hydraulic press 23 for molding whose pressurizing force can be controlled by hydraulic pressure. 3. Prepreg 4. Copper foil with intermediate plate 5. Prepreg 6
, intermediate layer substrate 7. A laminated prepreg 8 is mounted, and laminated molding is performed by applying pressure while heating.

The heating temperature in this case varies depending on the type of prepreg.
The temperature is 0 to 260℃, and the pressure is 5 to 60℃ depending on the progress of the process.
It is controlled to change at a value between kg/cnl.

Through such heating and pressure treatment, the copper foil of the copper foil with intermediate plate is adhered to the intermediate layer board via the prepreg by the epoxy resin impregnated into the prepreg, and a multilayer printed board is manufactured.

Since the intermediate plate made of stainless steel and the copper foil originally have weak adhesion, they peel off due to the difference in thermal expansion coefficients caused by heating during the molding process, making it possible to remove the intermediate plate from the multilayer printed board.

When a multilayer printed board is manufactured using copper foil with an intermediate plate in this way, foreign matter will not enter between the intermediate plate and the copper foil, so 1. There are no dents on the surface of the copper foil when pressurized by a forming press, and when a pattern is formed on this copper foil, copper remains and the pattern becomes thicker.

It is possible to prevent occurrence of chips and the like.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, it is possible to prevent foreign matter from entering between the intermediate plate and the copper foil during the lamination process of the manufacturing process of multilayer printed boards, so that it is possible to prevent foreign substances from entering between the intermediate plate and the copper foil during pattern formation. What's left behind?

It is possible to prevent the occurrence of pattern thickening, pattern chipping, etc., and also to provide a method for manufacturing a multilayer printed board that is easy to handle because the copper foil is not a single piece but is integrated with the intermediate board. .

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an embodiment of the present invention in the order of steps, and FIG. 2 is a diagram showing the conventional method for manufacturing a multilayer printed board in the order of steps. In the figure, l is copper foil with intermediate plate, 2 is prepreg, 3 is intermediate layer board, 4 is prepreg, 5 is copper foil with intermediate plate, 6 is prepreg, 7 is intermediate layer board, 8 is prepreg, 9 is intermediate Copper foil with a plate, 20 is a plating tank, 20a is a plating liquid, 21 is an electrode plate, 22 is a power source for plating, and 23 is a hydraulic press. Review Fa+ Formation of copper foil on intermediate plate (bi Figure 1 showing an embodiment of the heating/pressure forming invention using a hydraulic press in the order of steps)

Claims (1)

[Claims] A step of forming a copper foil (11a) on the surface of an intermediate plate (11) used as a jig in the laminating process, and a step of forming a copper foil (11a) on the surface of an intermediate plate (11) using a plurality of copper foils (1, 5, 9) with glass fibers. prepregs (2, 6) impregnated with resin, intermediate layer substrates (3, 7) with conductive layer patterns formed on insulating plates, and prepregs (4, 8) sandwiched and laminated, and pressurized while heating. , A method for producing a multilayer printed board, comprising: