JPH028772Y2 - - Google Patents

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Publication number
JPH028772Y2
JPH028772Y2 JP1983060520U JP6052083U JPH028772Y2 JP H028772 Y2 JPH028772 Y2 JP H028772Y2 JP 1983060520 U JP1983060520 U JP 1983060520U JP 6052083 U JP6052083 U JP 6052083U JP H028772 Y2 JPH028772 Y2 JP H028772Y2
Authority
JP
Japan
Prior art keywords
selector
lead
tape carrier
common
relay conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983060520U
Other languages
Japanese (ja)
Other versions
JPS59166948U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983060520U priority Critical patent/JPS59166948U/en
Publication of JPS59166948U publication Critical patent/JPS59166948U/en
Application granted granted Critical
Publication of JPH028772Y2 publication Critical patent/JPH028772Y2/ja
Granted legal-status Critical Current

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Description

【考案の詳細な説明】 〔考案の技術分野〕 本考案は、ラストラインウイジブルタイプ・サ
ーマルヘツドの改良に関するものである。
[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an improvement of a last line widget type thermal head.

〔従来技術〕[Prior art]

近年、発熱抵抗体の発熱による感熱記録紙への
記録状況を、記録を行なつた後、直ちに目視でき
るものとするため、基板の周辺端部近傍へ発熱抵
抗体を形成しその一端および他端からのセレクタ
リードおよび共通リードを基板面に導出したラス
トラインウイジブルタイプのサーマルヘツドが用
いられる傾向にあり、「サーマルヘツド」(特開昭
58−1578)が開示されるに至つている。
In recent years, in order to make the recording status on thermal recording paper due to the heat generated by the heat-generating resistor visible immediately after recording, a heat-generating resistor is formed near the peripheral edge of the substrate, and one end and the other end of the heat-generating resistor are formed. There is a tendency for last line widget type thermal heads to be used, in which the selector leads and common leads from the
58-1578) has now been disclosed.

しかし、従来のものは、発熱抵抗体の配置状況
と、リード線の引出し状況との関係上、特開昭58
−1578のとおり、リード線の交差を絶縁して処理
するには3層構造とならざるを得ず、製造工程が
複雑化し、高価になる等の欠点を生じている。
However, due to the arrangement of the heating resistor and the way the lead wires are pulled out, the conventional type
-1578, in order to insulate and process the intersections of lead wires, a three-layer structure must be used, resulting in disadvantages such as complicating the manufacturing process and increasing costs.

〔考案の概要〕[Summary of the idea]

本考案は、従来のかかる欠点を一挙に解消する
目的を有し、複数の発熱抵抗手段を1ブロツクと
し、これを複数ブロツク備えてなるラストライン
ウイジブルタイプのサーマルヘツドにおいて、上
記ブロツクにあつてその発熱抵抗手段の一端から
の各導出セレクタリードに接続されるセレクタ中
継導体を有しこのセレクタ中継導体を他のリード
と絶縁してセレクタ端子へ導くセレクタ引出用テ
ープキヤリアと、上記ブロツクにあつてその各発
熱抵抗手段の他端からの各導出共通リードに接続
される相互中継導体を有しこの相互中継導体を他
のリードと絶縁して隣接ブロツクにおける各共通
リードへ導く共通リード用テープキヤリアとを備
え、セレクタ中継導体と各導出セレクタリードと
の接続部および相互中継導体と各導出共通リード
との接続部を挟んでセレクタ引出用テープキヤリ
アと前記共通リード用テープキヤリアとを並設配
置することにより、基板上に単層配線とテープキ
ヤリアとの使用による2層構造により目的を達す
るものとなすと共に、セレクタ中継導体と各導出
セレクタリードとの接続および相互中継導体と各
導出共通リードとの接続を一列に並べて一度に行
い得るものとした極めて効果的な、サーマルヘツ
ドを提供するものである。
The present invention aims to eliminate such drawbacks of the conventional devices at once, and provides a thermal head of the last line widget type which is equipped with a plurality of blocks including a plurality of heat generating resistor means, and which addresses the above-mentioned blocks. a selector lead-out tape carrier having a selector relay conductor connected to each lead-out selector lead from one end of the heating resistor means, and guiding the selector relay conductor to a selector terminal while insulating the selector relay conductor from other leads; A common lead tape carrier having a mutual relay conductor connected to each lead-out common lead from the other end of each heating resistor means, and insulating the mutual relay conductor from other leads and guiding it to each common lead in an adjacent block. and a selector drawer tape carrier and the common lead tape carrier are arranged side by side across the connecting portion between the selector relay conductor and each derived selector lead and the connecting portion between the mutual relay conductor and each derived common lead. By doing so, the purpose is achieved by a two-layer structure using single-layer wiring and a tape carrier on the board, and also the connection between the selector relay conductor and each output selector lead, and the connection between the mutual relay conductor and each output common lead. The present invention provides a highly effective thermal head in which connections can be made all at once in a row.

〔実施例〕〔Example〕

以下、実施例を示す図によつて本考案の詳細を
説明する。
Hereinafter, details of the present invention will be explained with reference to figures showing embodiments.

第1図は回路図であり、各々一対の発熱抵抗体
(以下、抵抗体)R1a,R1b〜R32a,R32bからな
る複数のブロツクB1,B2が形成されており、抵
抗体R1a,R1b〜R32a,R32bは図上上方側が各対
毎に共通接続されていると共に、抵抗体R1a〜
R32aの下方側は、共通リードLd1〜Ld32により各
ブロツクB1,B2の同一順位のもの相互間が接続
され、これによつて共通回路が形成されたうえ、
ドライバ端子D1〜D32へ各個に引出されている一
方、抵抗体R1b〜R32bの下方側は、回り込み阻止
用のダイオードd1〜d32を介し、各ブロツクB1
B2毎に共通接続されてから、セレクタ端子S1
S2へ引出されている。
FIG. 1 is a circuit diagram in which a plurality of blocks B 1 and B 2 each consisting of a pair of heating resistors (hereinafter referred to as resistors) R 1 a, R 1 b to R 32 a, R 32 b are formed. The upper sides of the resistors R 1 a, R 1 b to R 32 a, R 32 b are commonly connected for each pair, and the resistors R 1 a to
On the lower side of R 32 a, common leads Ld 1 to Ld 32 connect blocks B 1 and B 2 of the same order, thereby forming a common circuit.
While the resistors R 1 b to R 32 b are individually led out to the driver terminals D 1 to D 32 , the lower sides of the resistors R 1 b to R 32 b are connected to each block B 1 ,
After common connection for each B 2 , selector terminal S 1 ,
It is being pulled out to S 2 .

したがつて、セレクタ端子S1,S2に対する負電
圧の印加によりブロツクB1,B2を選択すると共
に、ドライバ端子D1〜D32に対する正電圧の印加
状況を選定すれば、抵抗体R1a,R1b〜R32a,
R32b中の通電するものが定まり、これによつて、
所望の記録を行なうことが自在となる。
Therefore, if the blocks B 1 and B 2 are selected by applying a negative voltage to the selector terminals S 1 and S 2 and the application status of positive voltage to the driver terminals D 1 to D 32 is selected, the resistor R 1 a, R 1 b〜R 32 a,
The current-carrying element in R 32 b is determined, and by this,
It becomes possible to perform desired recording.

第2図は、第1図と対応する基板面の平面図で
あり、絶縁性と共に対熱性を有する基板1の周辺
端部2近傍に直線状として抵抗体R1a,R1b〜
R32a,R32bが形成され、これらと対応して各々
に共通導体3および導出導体4a,4bが形成さ
れており、導出導体4aからは共通リードLd1
Ld32が各個に引出され、鎖線により示す交差領域
5a,5bにおいて、周辺端部2と同一方向へ延
長されたうえ、隣接するブロツクB0の交差領域
5bとの間隙まで突出している。
FIG. 2 is a plan view of the substrate surface corresponding to FIG. 1, in which resistors R 1 a, R 1 b ~
R 32 a and R 32 b are formed, and correspondingly, a common conductor 3 and lead-out conductors 4 a, 4 b are formed respectively, and from the lead-out conductor 4 a, common leads Ld 1 to Ld 1 are formed.
The Ld 32 are individually drawn out and extend in the same direction as the peripheral end 2 at the intersection regions 5a and 5b indicated by chain lines, and also protrude to the gap between the intersection region 5b of the adjacent block B0 .

ただし、ブロツクB1の共通リードLd2および
Ld32は、更に下方へ延長され、周辺端部2と対向
する他方の周辺端部6近傍に形成されたドライバ
端子D2およびD32へ各個に引出されており、各ブ
ロツク毎に各々異なつたドライバ端子へ各個に引
出されるものとなつている。
However, common lead Ld 2 of block B 1 and
Ld 32 is further extended downward and is individually led out to driver terminals D 2 and D 32 formed near the other peripheral end 6 facing the peripheral end 2, and is connected to a different terminal for each block. The terminals are individually drawn out to the driver terminals.

また、導出導体4bからのセレクタリードLs1
〜Ls32は、共通リードLd1〜Ld32と同様かつ平行
に延長されているが、自己のブロツクB1におけ
る交差領域5aと5bとの間隙まで突出してい
る。
In addition, the selector lead Ls 1 from the lead-out conductor 4b
~ Ls32 extends parallel to and in the same manner as the common leads Ld1 ~ Ld32 , but protrudes to the gap between the crossing areas 5a and 5b in its own block B1 .

第3図は完成後の平面図、第4図A,Bは第3
図におけるA−AおよびB−B断面図であり、補
強用および絶縁用の絶縁性フイルム7a〜c間へ
導体を形成したテープキヤリア8a,8bを交差
領域5a,5bへ載置し、セレクタ引出用テープ
キヤリア8aの共通リード用テープキヤリア8b
側へ一端が突出しかつ曲折のうえ他端が下方へ突
出したセレクタ中継導体Lsd1〜Lsd32を、テープ
キヤリア8aと8bとの並設間隔部において、セ
レクタリードLs1〜Ls32と■印によつて示すボン
デイングにより各個に接続すると共に、下方側に
おいては、第1図のダイオードd1〜d32を収容し
たダイオードアレイDAの各端子と同様に接続し
たうえ、セレクタ端子S1とダイオードアレイDA
の他方の各端子との間をテープキヤリア9の共通
導体Lscを用い、ボンデイングにより接続してい
る。
Figure 3 is a plan view after completion, Figure 4 A and B are the 3rd floor plan.
These are AA and BB sectional views in the figure, in which tape carriers 8a and 8b with conductors formed between reinforcing and insulating insulating films 7a to 7c are placed on intersection areas 5a and 5b, and the selector drawer is pulled out. Tape carrier 8b for common lead of tape carrier 8a for
Selector relay conductors Lsd 1 to Lsd 32 with one end protruding toward the side and bent and the other end protruding downward are marked with selector leads Ls 1 to Ls 32 at the spacing between the tape carriers 8a and 8b. They are connected to each other by the bonding shown in FIG .
The common conductor L sc of the tape carrier 9 is used to connect the other terminals of the tape carrier 9 to the other terminals of the tape carrier 9 by bonding.

また、テープキヤリア8bの直線状かつ両側方
へ突出した相互中継導体Lc1〜Lc32を、両側方に
おいて共通リードLd1〜Ld32とボンデイングによ
り接続し、共通回路を形成している。
Furthermore, mutual relay conductors Lc 1 to Lc 32 that are linear and protrude toward both sides of the tape carrier 8b are connected to common leads Ld 1 to Ld 32 on both sides by bonding to form a common circuit.

したがつて、基板1上の印刷配線による各リー
ドLd1〜Ld32,Ls1〜Ls32およびドライバ端子D1
〜D32、セレクタ端子S1,S2等と、テープキヤリ
ア8a,8bおよび9とによる2層構造により、
所望のサーマルヘツドを得ることができるものと
なり、構成が簡略化されると共に、接続部位が直
線状となり、セレクタ中継導体Lsdとセレクタリ
ードLsとのボンデイング接続および相互中継導体
Lcと共通リードLdとのボンデイング接続を一列
に並べて一度に行えるため、容易かつ安価に製す
ることが自在となる。
Therefore, each lead Ld 1 to Ld 32 , Ls 1 to Ls 32 and the driver terminal D 1 by the printed wiring on the board 1
~D 32 , selector terminals S 1 , S 2 , etc., and tape carriers 8 a, 8 b, and 9 have a two-layer structure,
The desired thermal head can be obtained, the configuration is simplified, the connection part is straight, and the bonding connection between the selector relay conductor L sd and the selector lead L s and the mutual relay conductor are simplified.
Since the bonding connection between L c and the common lead L d can be performed in one row, it can be easily and inexpensively manufactured.

なお、第5図は、第3図および第4図による接
続状況を示す布線図であり、実線は基板1上の配
線、点線はテープキヤリア8a,8bによる接
続、■印は相互間のボンデイングを示しており、
第1図と同一の電気的接続が実現している。
In addition, FIG. 5 is a wiring diagram showing the connection situation according to FIGS. 3 and 4, where the solid line is the wiring on the board 1, the dotted line is the connection by the tape carriers 8a and 8b, and the ■ mark is the bonding between them. It shows
The same electrical connections as in FIG. 1 are realized.

なお、抵抗体R1a〜R32bの数およびブロツク
B1,B2の数は、条件に応じて定めればよく、各
部の接続をボンデイングによらず、他の手段によ
り行なうものとしても同様であり、種々の変形が
自在である。
In addition, the number of resistors R 1 a to R 32 b and the block
The numbers of B 1 and B 2 may be determined depending on the conditions, and the same applies even if the respective parts are connected not by bonding but by other means, and various modifications are possible.

〔考案の効果〕[Effect of idea]

以上の説明から明らかなとおり本考案によれ
ば、簡単な2層構造により目的が達せられると共
に、セレクタ中継導体と各導出セレクタリードと
の接続および相互中継導体と各導出共通リードと
の接続を一列に並べて一度に行い得るので、製造
工程の簡略化と共に、価格の低減が実現し、各種
用途のサーマルヘツドとして多大な効果が得られ
る。
As is clear from the above explanation, according to the present invention, the purpose can be achieved with a simple two-layer structure, and the connection between the selector relay conductor and each derived selector lead, and the connection between the mutual relay conductor and each derived common lead are arranged in a line. Since the process can be performed in parallel, the manufacturing process can be simplified and the cost can be reduced, making it possible to obtain great effects as a thermal head for various uses.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本考案の実施例を示し、第1図は回路図、
第2図は第1図と対応する基板面の平面図、第3
図は第2図の基板を用いた完成後の平面図、第4
図は第3図におけるA−AおよびB−B断面図、
第5図は第3図および第4図による接続状況の布
線図である。 R1a,R1b〜R32a,R32b……抵抗体(発熱抵抗
体)、Ld1〜Ld32……共通リード、Ls1〜Ls32……
セレクタリード、Lsd1〜Lsd32……セレクタ中継
導体、Lc1〜Lc32……相互中継導体、D1〜D32
…ドライブ端子、S1,S2……セレクタ端子、1…
…基板、5a,5b……交差領域、8a……セレ
クタ引出用テープキヤリア、8b……共通リード
用テープキヤリア。
The figure shows an embodiment of the present invention, and FIG. 1 is a circuit diagram;
Figure 2 is a plan view of the board surface corresponding to Figure 1;
The figure is a plan view after completion using the board in Figure 2, and Figure 4.
The figures are AA and BB sectional views in Figure 3,
FIG. 5 is a wiring diagram of the connection situation according to FIGS. 3 and 4. R 1 a, R 1 b to R 32 a, R 32 b...Resistor (heating resistor), Ld 1 to Ld 32 ... Common lead, Ls 1 to Ls 32 ...
Selector lead, Lsd 1 to Lsd 32 ... Selector relay conductor, Lc 1 to Lc 32 ... Mutual relay conductor, D 1 to D 32 ...
...Drive terminal, S 1 , S 2 ...Selector terminal, 1...
... Board, 5a, 5b... Intersection area, 8a... Tape carrier for selector drawer, 8b... Tape carrier for common lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の発熱抵抗手段を1ブロツクとし、これを
複数ブロツク備えてなるラストラインウイジブル
タイプのサーマルヘツドにおいて、前記ブロツク
にあつてその発熱抵抗手段の一端からの各導出セ
レクタリードに接続されるセレクタ中継導体を有
しこのセレクタ中継導体を他のリードと絶縁して
セレクタ端子へ導くセレクタ引出用テープキヤリ
アと、前記ブロツクにあつてその各発熱抵抗手段
の他端からの各導出共通リードに接続される相互
中継導体を有しこの相互中継導体を他のリードと
絶縁して隣接ブロツクにおける各共通リードへ導
く共通リード用テープキヤリアとを備え、前記セ
レクタ中継導体と各導出セレクタリードとの接続
部および前記相互中継導体と各導出共通リードと
の接続部を挟んで前記セレクタ引出用テープキヤ
リアと前記共通リード用テープキヤリアとを並設
配置してなるサーマルヘツド。
In a last line widget type thermal head comprising a plurality of heat generating resistor means as one block, a selector connected to each lead-out selector lead from one end of the heat generating resistor means in the block. A selector lead-out tape carrier having a relay conductor and leading the selector relay conductor to the selector terminal while insulating it from other leads, and connected to each lead-out common lead from the other end of each heating resistor means in the block. a common lead tape carrier which insulates the mutual relay conductor from other leads and leads it to each common lead in an adjacent block; A thermal head in which the selector drawer tape carrier and the common lead tape carrier are arranged side by side, sandwiching a connecting portion between the mutual relay conductor and each common lead.
JP1983060520U 1983-04-22 1983-04-22 thermal head Granted JPS59166948U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983060520U JPS59166948U (en) 1983-04-22 1983-04-22 thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983060520U JPS59166948U (en) 1983-04-22 1983-04-22 thermal head

Publications (2)

Publication Number Publication Date
JPS59166948U JPS59166948U (en) 1984-11-08
JPH028772Y2 true JPH028772Y2 (en) 1990-03-02

Family

ID=30190756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983060520U Granted JPS59166948U (en) 1983-04-22 1983-04-22 thermal head

Country Status (1)

Country Link
JP (1) JPS59166948U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140169940A1 (en) * 2011-08-11 2014-06-19 Kabushiki Kaisha Yokota Seisakusho Self-priming centrifugal pump

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272734U (en) * 1975-11-26 1977-05-31
JPS5613188A (en) * 1979-07-13 1981-02-09 Fujitsu Ltd Three-dimensional wiring system in scanning
JPS581578A (en) * 1981-06-29 1983-01-06 Fujitsu Ltd Thermal head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140169940A1 (en) * 2011-08-11 2014-06-19 Kabushiki Kaisha Yokota Seisakusho Self-priming centrifugal pump
US9759217B2 (en) * 2011-08-11 2017-09-12 Kabushiki Kaisha Yokota Seisakusho Self-priming centrifugal pump

Also Published As

Publication number Publication date
JPS59166948U (en) 1984-11-08

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