JPH0356033Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a composite electronic component in which a large number of electronic elements are arranged in parallel on a component substrate.

(Prior Art) Conventionally, a configuration of a composite electronic component in which a large number of electronic element pieces are arranged in parallel is known, for example, as described in Japanese Patent Publication No. 59-23460. This conventional composite electronic component has a component substrate 1 as shown in FIG.
A large number of electronic elements 2 such as resistive elements are arranged in parallel on the top by printing, one end of each electronic element 2 is electrically connected to a common electrode, and a lead wire 3 is led out from the other end of each electronic element 2. This is what I did.

(Problems to be Solved by the Invention) In the above-mentioned conventional composite electronic component, each electronic element 2 is arranged close to each other to increase the packaging density, and the distance between the lead wires 3 of each electronic element 2 is increased. It is preferable to make l as narrow as possible.

However, if the electronic elements 2 are arranged closer together, it becomes difficult to print the electronic elements 2, and there is a problem that the electronic elements 2 themselves or the component substrate 1 may be damaged due to the heat generated by the electronic elements 2. are doing.

The present invention was developed in view of the above-mentioned problems, and aims to increase the packaging density of electronic elements without narrowing the spacing between the electronic elements, and thereby narrow the spacing between the lead wires drawn out from the component board.

(Means for Solving the Problems) The composite electronic component of the present invention has a common electrode provided along the longitudinal direction approximately at the center of the component substrate, and one end of the common electrode provided on both sides of the common electrode. A large number of directly connected electronic elements are arranged alternately in parallel at mutually offset positions, and lead wires are led out from the other ends of these electronic elements.

(Function) In the composite electronic component of the present invention, a common electrode is provided along the longitudinal direction approximately at the center of the component substrate, and on both sides of this common electrode, a large number of electronic elements are connected at one end to the common electrode. Since they are alternately arranged in parallel at mutually offset positions, the packaging density of electronic elements is increased without narrowing the interval between the electronic elements, which in turn narrows the interval between the lead wires drawn out from the component board. In other words, even if the width of the common electrode is reduced, the electronic elements on both sides will not interfere with each other.
Electronic elements are easily connected to this common electrode, and distances between the electronic elements are also ensured in the longitudinal and width directions. Furthermore, since a common electrode is provided approximately at the center and electronic elements are directly connected to this common electrode, the number of component parts and connection parts are reduced.

(Example) The configuration of an example of the present invention will be explained with reference to FIG.

Reference numeral 1 denotes a component board having electrical insulation properties, and a common electrode 4 is printed and formed on the upper surface of the component board 1 along the longitudinal direction of the center. One end of this common electrode 4 has a bent portion formed on the side, and a common terminal 5 is connected to this tip.

On both sides of this common electrode 4, a large number of electronic elements 2a, 2b such as resistive elements, capacitive elements, inductance elements, diode elements, etc. are printed alternately and in parallel at mutually offset positions.

That is, on one side of this common electrode 4, electronic elements 2a are arranged in parallel at intervals l in the longitudinal direction of the common electrode 4.
On the other side of the common electrode 4, electronic elements 2b are arranged in parallel at intervals l in the longitudinal direction, forming a row b. Then, this electronic element 2b of row b
are arranged offset from each other in the parallel direction, that is, in the column direction, so as to be located between the electronic elements 2a of row a.

The inner ends of each of the electronic elements 2a and 2b are printed in a state where they are directly connected to the common electrode 4, and are electrically connected to the common electrode 4.

Moreover, the outer end of each electronic element 2a, 2b is
They are respectively connected to individual electrodes 6a and 6b formed on both sides of the component substrate 1 at a distance l. Lead wires 3a and 3b are led outward from the individual electrodes 6a and 6b, respectively.

Therefore, the interval between the lead wires 3a and 3b led out on the left and right sides of the component board 1 is 1/2.

According to the composite electronic component of this example,
Electronic elements 2 are arranged alternately on both sides of the central common electrode 4.
Since electronic elements 2a and 2b were formed by printing,
The mounting density of the electronic elements 2a, 2b can be increased without narrowing the interval b, and the interval between the lead wires 3a, 3b drawn out from the component board 1 can be narrowed. That is, the electronic elements 2a and 2b on both sides of the common electrode 4 can be easily printed and formed without interfering with each other. Furthermore, since the electronic elements 2a and 2b are spaced apart in the longitudinal and width directions, they are not easily affected by heat generation, and the heat generated by the electronic elements 2a and 2b causes damage to the electronic elements 2a and 2b themselves or the component board 1. It can also prevent damage.

Furthermore, since the common electrode 4 is printed in the center and the electronic elements 2a and 2b are directly connected to the common electrode 4, the number of component parts and connection parts can be reduced, and the reliability of the composite electronic component can be improved. can.

Further, by leading out the lead wires 3a, 3b from the electronic elements 2a, 2b of the respective columns in opposite directions, the lead wires 3a, 3b from the component board 1 can be
The lead-out interval can be reduced to 1/2, and when mounted on a printed circuit board, the wiring can be closely spaced and high-density wiring can be achieved.

[Effect of idea]

According to the composite electronic component of the present invention, a common electrode is provided along the longitudinal direction approximately at the center of the component substrate, and a large number of electronic elements each having one end connected to the common electrode are mounted on both sides of the common electrode. Since they are alternately arranged in parallel, it is possible to increase the mounting density of electronic elements without narrowing the interval between the electronic elements, and in turn, it is possible to narrow the interval between the lead wires drawn out from the component board. In other words, even if the width of the common electrode is reduced, electronic elements on both sides can be easily connected to this common electrode without interfering with each other, and each electronic element can be easily connected in the longitudinal and width directions. By ensuring a sufficient distance between the elements, it is possible to prevent the effects of heat generation on each other, and to prevent damage to the electronic element itself or the component substrate due to the heat generated by the electronic element. Furthermore, a common electrode is provided approximately in the center,
Since electronic elements were connected directly to this common electrode,
The number of component parts and connection parts can be reduced, and the reliability of the composite electronic component can be improved.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a composite electronic component showing an embodiment of the present invention, FIG. 2 is a vertical sectional front view taken along the line shown above, and FIG. 3 is a plan view of a conventional composite electronic component. 1...Component board, 2a, 2b...Electronic element, 3
a, 3b...Lead wire, 4...Common electrode.

Claims (1)

[Claims for Utility Model Registration] A common electrode is provided along the longitudinal direction approximately at the center of a component board, and a large number of electronic elements whose one end is directly connected to this common electrode are mounted on both sides of this common electrode. A composite electronic component characterized in that these electronic elements are arranged alternately in parallel at positions offset from each other, and lead wires are respectively led out from the other ends of these electronic elements.