JPH0288237U - - Google Patents

Info

Publication number
JPH0288237U
JPH0288237U JP1988167192U JP16719288U JPH0288237U JP H0288237 U JPH0288237 U JP H0288237U JP 1988167192 U JP1988167192 U JP 1988167192U JP 16719288 U JP16719288 U JP 16719288U JP H0288237 U JPH0288237 U JP H0288237U
Authority
JP
Japan
Prior art keywords
capillary
semiconductor device
device manufacturing
semiconductor
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988167192U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988167192U priority Critical patent/JPH0288237U/ja
Publication of JPH0288237U publication Critical patent/JPH0288237U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Wire Bonding (AREA)
JP1988167192U 1988-12-23 1988-12-23 Pending JPH0288237U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988167192U JPH0288237U (cs) 1988-12-23 1988-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988167192U JPH0288237U (cs) 1988-12-23 1988-12-23

Publications (1)

Publication Number Publication Date
JPH0288237U true JPH0288237U (cs) 1990-07-12

Family

ID=31455264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988167192U Pending JPH0288237U (cs) 1988-12-23 1988-12-23

Country Status (1)

Country Link
JP (1) JPH0288237U (cs)

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