JPH0288237U - - Google Patents
Info
- Publication number
- JPH0288237U JPH0288237U JP1988167192U JP16719288U JPH0288237U JP H0288237 U JPH0288237 U JP H0288237U JP 1988167192 U JP1988167192 U JP 1988167192U JP 16719288 U JP16719288 U JP 16719288U JP H0288237 U JPH0288237 U JP H0288237U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- semiconductor device
- device manufacturing
- semiconductor
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例にかかる半導体装置
の製造装置を一部破断で示す概略説明図、第２図
は従来のワイヤボンデイング装置の概略説明図で
ある。 １……半導体ペレツト、４……電極、５……リ
ード、６……金属細線、９……キヤピラリ、１３
……高周波誘導コイル。
の製造装置を一部破断で示す概略説明図、第２図
は従来のワイヤボンデイング装置の概略説明図で
ある。 １……半導体ペレツト、４……電極、５……リ
ード、６……金属細線、９……キヤピラリ、１３
……高周波誘導コイル。
Claims (1)
- 【実用新案登録請求の範囲】 半導体ペレツトの電極とその近傍に配されたリ
ードとをキヤピラリに挿通した金属細線にてワイ
ヤボンデイングする半導体装置の製造装置におい
て、 上記キヤピラリ外周部に高周波誘導コイルを取
着したことを特徴とする半導体装置の製造装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988167192U JPH0288237U (ja) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988167192U JPH0288237U (ja) | 1988-12-23 | 1988-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288237U true JPH0288237U (ja) | 1990-07-12 |
Family
ID=31455264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988167192U Pending JPH0288237U (ja) | 1988-12-23 | 1988-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288237U (ja) |
-
1988
- 1988-12-23 JP JP1988167192U patent/JPH0288237U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0428446U (ja) | ||
| JPS5863758U (ja) | 樹脂封止型半導体装置 | |
| JPH0313740U (ja) | ||
| JPS6359325U (ja) | ||
| JPS6365247U (ja) | ||
| JPS63172149U (ja) | ||
| JPS59149617U (ja) | トランス | |
| JPH0176043U (ja) | ||
| JPS61106038U (ja) | ||
| JPS60192410U (ja) | 小形変成器 | |
| JPS6278762U (ja) | ||
| JPS62103265U (ja) | ||
| JPS63201331U (ja) | ||
| JPS6068654U (ja) | 半導体装置 | |
| JPS58182424U (ja) | ワイヤボンデイング装置 | |
| JPH0463130U (ja) | ||
| JPS645427U (ja) | ||
| JPS5860950U (ja) | パツケ−ジ | |
| JPS63188944U (ja) | ||
| JPH0446543U (ja) | ||
| JPH01135736U (ja) | ||
| JPS583038U (ja) | リ−ドフレ−ム | |
| JPS58155838U (ja) | 半導体装置 | |
| JPS60172292U (ja) | 誘導加熱用コイル | |
| JPS58131611U (ja) | 高周波コイル |