JPH0288426A - Production of superconducting thin film - Google Patents
Production of superconducting thin filmInfo
- Publication number
- JPH0288426A JPH0288426A JP63236573A JP23657388A JPH0288426A JP H0288426 A JPH0288426 A JP H0288426A JP 63236573 A JP63236573 A JP 63236573A JP 23657388 A JP23657388 A JP 23657388A JP H0288426 A JPH0288426 A JP H0288426A
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- Prior art keywords
- thin film
- substrate
- phase
- superconducting thin
- film
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- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は化学気相析出法によるB1−5r−Ca−Cu
−0からなる超電導薄膜の製造方法に関する。Detailed Description of the Invention (Industrial Field of Application) The present invention provides B1-5r-Ca-Cu by chemical vapor deposition method.
The present invention relates to a method for manufacturing a superconducting thin film consisting of -0.
(従来の技術)
超電導体の原材料として、B1−5r−Ca−Cu−0
系が、他の酸化物系超電導体よりも良好な超電導特性を
示し、高価な希土類元素を含まず、経済的にして安定性
に優れた超電導体を示すので注目されている。(Prior art) As a raw material for superconductors, B1-5r-Ca-Cu-0
The system has attracted attention because it exhibits better superconducting properties than other oxide-based superconductors, does not contain expensive rare earth elements, and is an economical and highly stable superconductor.
B1−5r−Ca−Cu−0からなる超電導体において
は、B1−01層間にCu−0層が1層存在し、臨界温
度(Tc)が7〜8kを示すBig(SrCa)zcu
Ox ; Cu−0層が2層存在し、Tcが80kを示
す旧tcsr −Ca) 3CL120X(低Tc相)
icu−0層が3層存在し、Tcが1)0kを示すBi
gSrzCazCtl:+OX (高Tc相)の3種
の超電導体が明らかにされている。また電子顕微鏡によ
る観察ではCu−0層が4層、5層のものも見い出され
ているがその超電導特性はまだ確認されていない。In the superconductor consisting of B1-5r-Ca-Cu-0, there is one Cu-0 layer between the B1-01 layers, and Big(SrCa)zcu exhibits a critical temperature (Tc) of 7 to 8 k.
Ox; Old tcsr-Ca with two Cu-0 layers and Tc of 80k) 3CL120X (low Tc phase)
Bi with three ICU-0 layers and Tc of 1)0k
Three types of superconductors have been revealed: gSrzCazCtl:+OX (high Tc phase). In addition, by observation using an electron microscope, some have been found to have four or five Cu-0 layers, but their superconducting properties have not yet been confirmed.
この超電導体を液体窒素温度で作動するセンサ、素子、
デバイス、線材苛に応用するためには、より高いTcや
臨界電流が必要であり、そのため、Big (SrCa
) zcuOxのようなTcの低い超電導体や不純初層
のない超電導体を形成しなければならない。Sensors, elements, etc. that operate this superconductor at liquid nitrogen temperature,
In order to apply it to devices and wire materials, higher Tc and critical current are required.
) It is necessary to form a superconductor with low Tc such as zcuOx or a superconductor without an impurity initial layer.
また望ましくは、高Tc相単相の超電導体を形成させる
ことが必要である。しかし、この超電導体においては高
Tc相の合成条件の範囲がせまく、また高Tc相単相を
得ることは組成制御や合成条件の制御では難しいので、
超電導体中の高Tc相の割合を多くし、さらにBit(
Sr−Ca)zcuOxや不純物のない超電導体を形成
しなければならない。It is also desirable to form a single-phase high-Tc superconductor. However, in this superconductor, the range of synthesis conditions for the high Tc phase is narrow, and it is difficult to obtain a single high Tc phase by controlling the composition and synthesis conditions.
By increasing the proportion of high Tc phase in the superconductor and further increasing Bit(
A superconductor free of Sr-Ca)zcuOx and impurities must be formed.
このような目的のため、焼結法ではpbを添加すること
によりほぼ高Tc相単相に近い超電導体を合成している
が、必ずしも、そのTcは実用におい′ζ十分とは言え
ない。また、この超電導体はセラミックスであり、複雑
形状な超電導体の形成には適さない。For this purpose, in the sintering method, a superconductor that is almost single-phase with a high Tc phase is synthesized by adding PB, but the Tc cannot necessarily be said to be sufficient for practical use. Moreover, this superconductor is made of ceramics, and is not suitable for forming a complex-shaped superconductor.
また、スパッタ法や真空蒸着法では低Tc相と高Tc相
との混合相ではあるが、Tcが100に程度の膜が形成
されている。しかし、これらの方法は蒸発源に対向した
面内での薄膜形成であり、また高真空を必要とすること
から、複雑形状の基体上への超電導体膜の形状が難しく
、装置の大型化も難しい。Further, in the sputtering method or the vacuum evaporation method, a film having a Tc of about 100 is formed, although it is a mixed phase of a low Tc phase and a high Tc phase. However, these methods involve forming a thin film in the plane facing the evaporation source and require high vacuum, making it difficult to form a superconductor film on a substrate with a complex shape, and making the equipment larger. difficult.
さらに、ハロゲン化物を原料とした化学気相析出法(C
V D)においても、Tcが100に程度の膜が形成さ
れているが、1000℃以下の低温ではハロゲン化物の
分解が不完全で、形成した膜にハロゲンが含まれること
が多く、膜の性質が低下する。また生成したハロゲンガ
スにより基体や形成した膜、CVD炉を損なう場合があ
る。さらにハロゲン化物が固体状の場合にはそれをガス
化する温度が高く、低温化が要求される半導体関係の分
野ではハロゲン化物は原料として好ましくない。Furthermore, chemical vapor deposition method (C
In VD), a film with a Tc of about 100 is also formed, but at low temperatures below 1000°C, the decomposition of halides is incomplete, and the formed film often contains halogen, which affects the properties of the film. decreases. Further, the generated halogen gas may damage the substrate, the formed film, and the CVD furnace. Further, when the halide is in a solid state, the temperature at which it is gasified is high, and therefore, the halide is not preferred as a raw material in semiconductor-related fields where low temperatures are required.
本発明は、前述の問題点を解決するためになされたもの
で、有機金属化合物を蒸発源原料とした化学気相析出法
において、より高いTcを有する相を多く含み、不純物
の少ない超電導特性の安定した超電導薄膜を、大型、大
面積、長尺複雑形状な物へより早い蒸着速度で析出でき
る超電導薄膜の製造方法を提供するものである。The present invention has been made in order to solve the above-mentioned problems, and in the chemical vapor deposition method using an organometallic compound as an evaporation source material, superconducting properties containing many phases with higher Tc and fewer impurities can be achieved. The present invention provides a method for producing a superconducting thin film that can deposit a stable superconducting thin film onto a large-sized, large-area, long, and complex-shaped object at a faster deposition rate.
(課題を解決するための手段とその作用)本発明は、前
述した課題を解決するために、ビスマス、ストロンチウ
ム、カルシウム及び銅を少くとも含む蒸発源の原料を用
いた化学気相析出法により、形成される膜の融点温度以
下の温度の基体上に高Tcを含み、不純物の少ない超電
導膜を形成する手段を採用する。(Means for Solving the Problems and Their Effects) In order to solve the above-mentioned problems, the present invention uses a chemical vapor deposition method using an evaporation source material containing at least bismuth, strontium, calcium, and copper. A method is employed to form a superconducting film containing high Tc and few impurities on a substrate at a temperature below the melting point temperature of the film to be formed.
より具体的には、本発明の製造方法は、ビスマス、スト
ロンチウム、カルシウム及び銅の有機金属又は有機金属
錯体を原料とする。これら4成分の原料をそれらの蒸気
圧が得られる温度まで各々加熱し、アルゴンガスの如き
不活性ガスをキャリアガスとして反応容器内に導入する
。キャリアガスは窒素ヘリウム等でもよい。上記ガスと
は別の経路で酸素ガス又は酸素ガスを含むガスを反応容
器内に導入する。反応容器内に膜を析出させるための基
体を置き、さらにこの基体を加熱する。基体の加熱は反
応容器内に加熱器を置き、基体を加熱するか或いは反応
容器の外部から加熱器により加熱する。さらに高周波加
熱等の方法を用いてもよい。いずれかの方法により加熱
した基体上に酸素ガス又は酸素ガスを含むガス及び各組
成元素を含む、有機金属又は有機金属錯体の蒸気を含ん
だ不活性ガスを導入する。反応容器内の圧力は減圧であ
り、50Torr以下が好ましい。基体の加熱温度は少
なくとも基板上に形成される膜の融点温度以下であり、
Bit(Sr−Ca)zcuOxが形成されない範囲で
融点直下の温度が好ましい。膜の融点は反応容器内の圧
力、原料ガス組成により異なるが、反応容器内の圧力I
Torrで770〜780℃の範囲である。また超電
導体の組成は各原料の加熱温度、キャリアガス流量によ
る原料供給量により制御でき、ビスマス、ストロンチウ
ム、カルシウム、銅の原料供給量の比は、2:2:2:
3が好ましい。More specifically, the production method of the present invention uses organometallic or organometallic complexes of bismuth, strontium, calcium, and copper as raw materials. These four raw materials are heated to a temperature at which their vapor pressures are obtained, and an inert gas such as argon gas is introduced into the reaction vessel as a carrier gas. The carrier gas may be nitrogen helium or the like. Oxygen gas or a gas containing oxygen gas is introduced into the reaction vessel through a route different from the above gas. A substrate for depositing a film is placed in a reaction vessel, and this substrate is further heated. The substrate can be heated by placing a heater inside the reaction vessel and heating the substrate, or by heating the substrate from outside the reaction vessel. Furthermore, methods such as high frequency heating may be used. An inert gas containing oxygen gas or a gas containing oxygen gas and vapor of an organometallic or organometallic complex containing each constituent element is introduced onto the substrate heated by any of the methods. The pressure inside the reaction vessel is reduced, preferably 50 Torr or less. The heating temperature of the substrate is at least below the melting point temperature of the film formed on the substrate,
The temperature is preferably just below the melting point within a range where Bit(Sr-Ca)zcuOx is not formed. The melting point of the film varies depending on the pressure inside the reaction vessel and the raw material gas composition, but the melting point of the membrane varies depending on the pressure inside the reaction vessel I
Torr is in the range of 770 to 780°C. In addition, the composition of the superconductor can be controlled by the heating temperature of each raw material and the raw material supply amount by the carrier gas flow rate, and the ratio of the raw material supply amounts of bismuth, strontium, calcium, and copper is 2:2:2:
3 is preferred.
膜厚は析出時間及び原料供給量により任意に制御するこ
とができる。4〜8μ鵡の膜厚は1時間の処理で可能で
ある。さらに、熱処理が必要な場合は、成形膜に引き続
き反応容器内に空気あるいは酸素などのガスを導入し、
反応容器内の圧力を1気圧として熱処理を行うことがで
きる。また他の膜合成と同様に超電導膜を形成後あらた
めて熱処理を行ってもよい。熱処理条件は膜の融点以上
の温度に短時間保持し、その後融点直下の温度で3時間
から5時間保持し徐冷することが望ましい。The film thickness can be arbitrarily controlled by the deposition time and the amount of raw material supplied. A film thickness of 4 to 8 microns can be achieved by one hour of treatment. Furthermore, if heat treatment is required, a gas such as air or oxygen is introduced into the reaction vessel following the forming of the film.
The heat treatment can be performed with the pressure inside the reaction vessel set to 1 atm. Further, similar to other film syntheses, heat treatment may be performed again after forming the superconducting film. As for the heat treatment conditions, it is desirable to maintain the temperature at or above the melting point of the film for a short time, and then maintain it at a temperature just below the melting point for 3 to 5 hours and slowly cool it.
(実施例) 第1図〜第5図を参照して、本発明の詳細な説明する。(Example) The present invention will be described in detail with reference to FIGS. 1 to 5.
第1図は本発明における製造方法の一例である。ビスマ
ス、ストロンチウム、カルシウム、銅の有機金属又は有
機金属錯体、たとえば、Bi (OCzlls) 2又
はBi(Cbls)z、5r(Czll+、0z)z、
Ca(C++H+、Og)z 、Cu(Czll+qO
z)zを各々l、2.3.4の原料容器内に入れヒータ
ー5により加熱する。ビスマスのアルコキシドでは13
5℃、フェニルビスマスでは1)0℃、ストロンチウム
のβ−ジケトン錯体は230℃、カルシウムのβ−ジケ
トン錯体は175℃、銅のβ−ジケトン錯体は120℃
に加熱する。各原料容器l、2.3.4には不活性ガス
導入口6からキャリアガスとしてアルゴンガスが50n
1/min 4人される。又、酸素ガス導入ロアから酸
素ガスが反応容器内へ100al/a+in導入される
。各組成元素を含んだ原料の蒸気を含んだキャリアガス
及び酸素ガスは、反応容器内8で混合され、5X10m
mの基板9に導入される。FIG. 1 shows an example of the manufacturing method according to the present invention. Organometallic or organometallic complexes of bismuth, strontium, calcium, copper, such as Bi(OCzlls)2 or Bi(Cbls)z, 5r(Czll+, 0z)z,
Ca(C++H+, Og)z, Cu(Czll+qO
z) Place z into raw material containers of 1 and 2.3.4, respectively, and heat with the heater 5. 13 for bismuth alkoxide
5℃, phenyl bismuth: 1) 0℃, strontium β-diketone complex: 230℃, calcium β-diketone complex: 175℃, copper β-diketone complex: 120℃
Heat to. Each raw material container l, 2.3.4 is supplied with 50n of argon gas as a carrier gas from the inert gas inlet 6.
1/min 4 people. Further, 100 al/a+in of oxygen gas is introduced into the reaction vessel from the oxygen gas introduction lower. Carrier gas containing vapor of raw materials containing each compositional element and oxygen gas are mixed in a reaction vessel 8,
m is introduced into the substrate 9.
反応容器内は減圧であり、圧力、はI Torrである
。The inside of the reaction vessel is under reduced pressure, and the pressure is I Torr.
以上のようにして、マグネシア単結晶基板上に基板温度
750℃、770℃、780℃、800℃で1時間析出
させた。得られた膜の厚さは1〜2μ−であった。第2
図、第3図にそれぞれの温度で析出させた膜のX線回折
図形及び抵抗率温度依存性を示す。基板温度800℃、
780℃では低Tc相、高Tc相のピーク以外にBi
(SrCa) zcuoxのピークが見られる。770
℃では低Tc相と高Tc相の2相が形成されている。7
50℃では低Tc相単相に近い。さらにその抵抗変化で
は770℃及び780℃で析出した膜は液体窒素温度以
上でゼロを示し800℃で析出した膜は50に以下の低
い温度で抵抗がゼロとなっている。As described above, precipitation was performed on a magnesia single crystal substrate at substrate temperatures of 750°C, 770°C, 780°C, and 800°C for 1 hour. The thickness of the membrane obtained was 1-2 μm. Second
Figure 3 shows the X-ray diffraction patterns and temperature dependence of resistivity of the films deposited at each temperature. Substrate temperature 800℃,
At 780°C, in addition to the peaks of the low Tc phase and high Tc phase, Bi
(SrCa) A peak of zcuox is seen. 770
At ℃, two phases are formed: a low Tc phase and a high Tc phase. 7
At 50°C, it is close to a single low Tc phase. Furthermore, the resistance change of the films deposited at 770°C and 780°C becomes zero at temperatures above the liquid nitrogen temperature, and the resistance of the films deposited at 800°C becomes zero at temperatures as low as 50°C or lower.
また膜の組織観察から、本実施例における融点は770
〜780℃である。Furthermore, from the observation of the structure of the film, the melting point in this example was 770.
~780°C.
また本実施例ではビスマスのアルコキシドを原料に用い
た結果を示したが、フェニルビスマスの場合も同様の結
果を示した。Further, in this example, results were shown using bismuth alkoxide as a raw material, but similar results were shown in the case of phenyl bismuth.
第2の実施例は第1の実施例で得られた膜を酸素中で熱
処理を行った。熱処理条件は890℃で20分間保持し
、その後870℃で5時間保持した後徐冷した。各基板
温度で析出させた膜の熱処理後のX線回折図形及び抵抗
率温度依存性を第4図、第5図に示す。基板温度800
℃で形成した膜は熱処理により、Bit(Sr−Ca)
zcuOxの割合が多くなり、その抵抗変化も半導体
的でゼロ抵抗を示さなかった。基板温度780℃、77
0℃ではX線回折図形に大きな変化は見られないが、高
Tc相のピークが熱処理により、はっきりしていること
から結晶性がよくなったことが考えられ、また、その抵
抗変化では、1)0に付近から急激に低下し、液体窒素
温度以上でゼロ抵抗を示している。In the second example, the film obtained in the first example was heat-treated in oxygen. The heat treatment conditions were held at 890°C for 20 minutes, then held at 870°C for 5 hours, and then slowly cooled. The X-ray diffraction patterns and resistivity temperature dependence of the films deposited at each substrate temperature after heat treatment are shown in FIGS. 4 and 5. Substrate temperature 800
The film formed at ℃ becomes Bit(Sr-Ca) by heat treatment.
The proportion of zcuOx increased, and the resistance change was semiconductor-like and did not show zero resistance. Substrate temperature 780℃, 77
Although there is no major change in the X-ray diffraction pattern at 0°C, the peak of the high Tc phase becomes clear due to the heat treatment, which suggests that the crystallinity has improved. ) It rapidly decreases from around 0, and shows zero resistance above the liquid nitrogen temperature.
基板温度750℃では、X線回折図形に変化は見られな
いが、その抵抗変化では、1)0に付近にわずかな抵抗
変化が見られ、高Tc相が形成されていることがわかる
。750℃においても高Tc相が形成されていることか
ら組成の制御により、この温度においてもよい高いTc
を示す超電導薄膜を形成することは可能である。At a substrate temperature of 750° C., no change is observed in the X-ray diffraction pattern, but a slight change in resistance is observed near 1) 0, indicating that a high Tc phase is formed. Since a high Tc phase is formed even at 750°C, by controlling the composition, a high Tc phase can be obtained even at this temperature.
It is possible to form superconducting thin films that exhibit .
(効果)
ビスマス、ストロンチウム、カルシウム及びS同を少く
とも含む有機金属又は有機金属錯体を蒸発源原料として
用いた化学気相析出法において、基体上に形成される超
電導体の融点以下の温度で析出させ、また、さらに熱処
理を行なう本発明の方法は、より高いTcを示す構造の
超電導体を安定に形成することができ、さらにTcが1
0に以下の相や不純物相を含まないことから超電導特性
にすぐれた薄膜を大型、大面積、複雑形状の基体上に析
出させることができる。(Effect) In a chemical vapor deposition method using an organometallic or organometallic complex containing at least bismuth, strontium, calcium, and S as an evaporation source material, precipitation occurs at a temperature below the melting point of the superconductor formed on the substrate. The method of the present invention, which further performs heat treatment, can stably form a superconductor having a structure exhibiting a higher Tc.
Since it does not contain any of the following phases or impurity phases, thin films with excellent superconducting properties can be deposited on large, large-area, and complex-shaped substrates.
さらに、本発明によれば、液体窒素温度以上でゼロ抵抗
を示す超電導薄膜が合成され、さらにより高い割合でT
cが1)0kを示す高Tc相を安定にらに熱処理条件に
よって、Tcゼロが100に以上を示す薄膜の形成も十
分可能である。Furthermore, according to the present invention, a superconducting thin film exhibiting zero resistance above liquid nitrogen temperature is synthesized, and an even higher proportion of T
It is also possible to form a thin film having a Tc of 100 or more by stably forming a high Tc phase having a c of 1)0k and changing the heat treatment conditions.
第1図は、本発明の製造方法に関する装置の一例の断面
図、第2図と第4図はマグネシア基板上の膜のX線回折
図、および第3図と第5図は実施例による膜の抵抗率温
度依存性の図である。
図中:l、2.3.4・・・原料容器、5・・・原c[
力。
熱ヒータ、6・・・不活性ガス導入口、7・・・酸素力
′ス導入口、8・・・反応容器内、9・・・基板、10
・・・基板加熱ヒータ。FIG. 1 is a cross-sectional view of an example of an apparatus related to the manufacturing method of the present invention, FIGS. 2 and 4 are X-ray diffraction diagrams of a film on a magnesia substrate, and FIGS. 3 and 5 are films according to an example. FIG. 2 is a diagram of the resistivity temperature dependence of In the figure: l, 2.3.4... Raw material container, 5... Original c [
Power. Thermal heater, 6... Inert gas inlet, 7... Oxygen gas inlet, 8... Inside reaction vessel, 9... Substrate, 10
...Substrate heater.
Claims (4)
少くとも含む蒸発源の原料を用い、原料加熱温度300
℃以下、減圧下で基体上に超電導薄膜を形成する化学気
相析出法において、その超電導体の融点以下の基体温度
で形成したことを特徴とする超電導薄膜の製造方法。(1) Using a raw material as an evaporation source containing at least bismuth, strontium, calcium, and copper, the raw material heating temperature is 300.
A method for producing a superconducting thin film, characterized in that the superconducting thin film is formed on a substrate at a temperature below the melting point of the superconductor in a chemical vapor deposition method in which the superconducting thin film is formed on a substrate at a temperature below °C and under reduced pressure.
薄膜の製造方法。(2) The method for producing a thin film according to claim (1), wherein a heat treatment is performed after forming the superconducting thin film.
続に行う請求項(1)の薄膜の製造方法。(3) The method for producing a thin film according to claim 1, wherein the heat treatment after forming the superconducting thin film is performed continuously in the same reaction chamber.
はβ−ジケトン錯体である請求項(1)の薄膜の製造方
法。(4) The method for producing a thin film according to claim (1), wherein the raw material for each compositional element constituting the thin film is an organic metal or a β-diketone complex.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63236573A JPH0288426A (en) | 1988-09-22 | 1988-09-22 | Production of superconducting thin film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63236573A JPH0288426A (en) | 1988-09-22 | 1988-09-22 | Production of superconducting thin film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288426A true JPH0288426A (en) | 1990-03-28 |
Family
ID=17002637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63236573A Pending JPH0288426A (en) | 1988-09-22 | 1988-09-22 | Production of superconducting thin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288426A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0288773A (en) * | 1988-09-27 | 1990-03-28 | Fujitsu Ltd | Formation of oxide superconducting film using chemical vapor growth |
-
1988
- 1988-09-22 JP JP63236573A patent/JPH0288426A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0288773A (en) * | 1988-09-27 | 1990-03-28 | Fujitsu Ltd | Formation of oxide superconducting film using chemical vapor growth |
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