JPH0288748U - - Google Patents
Info
- Publication number
- JPH0288748U JPH0288748U JP17022188U JP17022188U JPH0288748U JP H0288748 U JPH0288748 U JP H0288748U JP 17022188 U JP17022188 U JP 17022188U JP 17022188 U JP17022188 U JP 17022188U JP H0288748 U JPH0288748 U JP H0288748U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation plate
- terminal portion
- insulating substrate
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は、実施例サーマルヘツドを示す斜視図
、第２図は、実施例サーマルヘツドの信号用配線
パターンを示す要部拡大説明図、第３図は、実施
例サーマルヘツドの放熱板の接続用端子部を示す
要部拡大斜視図、第４図は、フレキシブル基板を
示す平面図、第５図は、接続用端子部とコネクタ
との接続状態を示す断面図、第６図は、従来のサ
ーマルヘツドを示す側面図、第７図は、従来のサ
ーマルヘツドを示す斜視図である。
１：放熱板、２：絶縁基板、３：コネクタ、５
：信号用端子、１１：折り曲げ部、１２：接続用
端子部、２１：発熱素子列、２２：駆動ＩＣ列。
Fig. 1 is a perspective view showing the thermal head of the embodiment, Fig. 2 is an enlarged explanatory view of the main part showing the signal wiring pattern of the thermal head of the embodiment, and Fig. 3 is the connection of the heat sink of the thermal head of the embodiment. FIG. 4 is a plan view showing the flexible board, FIG. 5 is a sectional view showing the state of connection between the connecting terminal portion and the connector, and FIG. 6 is a conventional FIG. 7 is a side view showing a thermal head, and FIG. 7 is a perspective view showing a conventional thermal head. 1: Heat sink, 2: Insulating board, 3: Connector, 5
: Signal terminal, 11: Bend portion, 12: Connection terminal portion, 21: Heat generating element row, 22: Drive IC row.
Claims (1)
に接続用端子部を設けた放熱板と、この放熱板の
上面に載置され、発熱素子列及び駆動ＩＣ列を備
えた絶縁基板と、前記放熱板の接続用端子部にハ
ンダ接続されたコネクタとからなり、上記接続用
端子部を介してコネクタと絶縁基板の信号用端子
を接続して成るサーマルヘツド。 a heat dissipation plate having connection terminals provided at appropriate locations on bent portions with both sides bent inward; an insulating substrate placed on the upper surface of the heat dissipation plate and provided with a heat generating element row and a driving IC row; and the heat dissipation plate. A thermal head comprising a connector soldered to a connection terminal portion of a plate, and a signal terminal of an insulating substrate connected to the connector via the connection terminal portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17022188U JPH0288748U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17022188U JPH0288748U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288748U true JPH0288748U (en) | 1990-07-13 |
Family
ID=31460978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17022188U Pending JPH0288748U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288748U (en) |
-
1988
- 1988-12-28 JP JP17022188U patent/JPH0288748U/ja active Pending