JPS644647U - - Google Patents
Info
- Publication number
- JPS644647U JPS644647U JP9893987U JP9893987U JPS644647U JP S644647 U JPS644647 U JP S644647U JP 9893987 U JP9893987 U JP 9893987U JP 9893987 U JP9893987 U JP 9893987U JP S644647 U JPS644647 U JP S644647U
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- wiring board
- printed wiring
- heat
- resistant substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は一実施例を示す部分断面図、第２図は
従来のサーマルヘツドを示す側面図、第３図は同
従来例を示す平面図、第４図は一実施例を示す側
面断面図であり、第１図は第４図のＡ部分の拡大
図である。第５図及び第６図は同実施例の共通電
極の形成方法を示す図であり、第５図は分割前の
セラミツク基板を示す斜視図、第６図は共通電極
を形成した状態を示す側面断面図である。第７図
は他の実施例を示す概略側面図である。
２，２ａ……セラミツク基板、６……発熱素子
、８……選択電極、１０ａ，１０ｃ……共通電極
、１０ｂ……導電ペースト、１２ａ，２０……プ
リント配線板、１４……駆動用ＩＣ、１８……支
持板、２０ａ……フレキシブルプリント配線板。
Fig. 1 is a partial sectional view showing one embodiment, Fig. 2 is a side view showing a conventional thermal head, Fig. 3 is a plan view showing the conventional example, and Fig. 4 is a side sectional view showing one embodiment. FIG. 1 is an enlarged view of part A in FIG. 4. 5 and 6 are diagrams showing the method of forming the common electrode in the same embodiment, FIG. 5 is a perspective view showing the ceramic substrate before division, and FIG. 6 is a side view showing the state in which the common electrode is formed. FIG. FIG. 7 is a schematic side view showing another embodiment. 2, 2a... Ceramic substrate, 6... Heat generating element, 8... Selection electrode, 10a, 10c... Common electrode, 10b... Conductive paste, 12a, 20... Printed wiring board, 14... Drive IC, 18... Support plate, 20a... Flexible printed wiring board.
Claims (1)
につながる共通電極を形成し、プリント配線板に
も共通電極を形成し、前記耐熱基板の裏面の共通
電極と前記プリント配線板の共通電極が接触する
ように前記プリント配線板を前記耐熱基板の裏面
に重ねたサーマルヘツド。 A common electrode connected to the heat generating element is formed on the back surface of the heat resistant substrate on which the heat generating element is formed, a common electrode is also formed on the printed wiring board, and the common electrode on the back surface of the heat resistant substrate is in contact with the common electrode of the printed wiring board. A thermal head in which the printed wiring board is stacked on the back side of the heat-resistant substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9893987U JPS644647U (en) | 1987-06-27 | 1987-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9893987U JPS644647U (en) | 1987-06-27 | 1987-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS644647U true JPS644647U (en) | 1989-01-12 |
Family
ID=31325641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9893987U Pending JPS644647U (en) | 1987-06-27 | 1987-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS644647U (en) |
-
1987
- 1987-06-27 JP JP9893987U patent/JPS644647U/ja active Pending
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