JPH0289879U - - Google Patents
Info
- Publication number
- JPH0289879U JPH0289879U JP16953988U JP16953988U JPH0289879U JP H0289879 U JPH0289879 U JP H0289879U JP 16953988 U JP16953988 U JP 16953988U JP 16953988 U JP16953988 U JP 16953988U JP H0289879 U JPH0289879 U JP H0289879U
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- wiring board
- printed wiring
- view
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000010276 construction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の第１の実施例の平面図、第２
図ａ〜ｃはそれぞれ第１の実施例のソルダーレジ
ストを形成する工程を順に示す第１図のＡ−Ａ′
線断面図、第３図ａ及びｂはそれぞれ本考案の第
２の実施例の平面図及びＢ−Ｂ′線断面図、第４
図ａ及びｂはそれぞれ従来の印刷配線板の一例の
平面図及びＣーＣ′線断面図である。
１……基材、２……パツド、３……液状ソルダ
ーレジスト、４……レジスト工事用フイルム、５
……紫外線、６……ソルダーレジスト、６ａ，６
ｂ……局部的に幅を広げたソルダーレジスト、６
ｃ……幅の狭い長方形のソルダーレジスト。
Figure 1 is a plan view of the first embodiment of the present invention;
Figures a to c sequentially show the steps of forming the solder resist of the first embodiment, A-A' in Figure 1.
A line sectional view, Figures 3a and b are a plan view and a BB' line sectional view of the second embodiment of the present invention, respectively.
Figures a and b are a plan view and a sectional view taken along the line CC' of an example of a conventional printed wiring board, respectively. 1... Base material, 2... Pad, 3... Liquid solder resist, 4... Film for resist construction, 5
...Ultraviolet light, 6...Solder resist, 6a, 6
b...Solder resist with locally widened width, 6
c...Narrow rectangular solder resist.
Claims (1)
ーレジスト逃げを設けた印刷配線板において、前
記パツド間のソルダーレジスト部分に局部的に幅
を広げた領域を有することを特徴とする印刷配線
板。 What is claimed is: 1. A printed wiring board in which a solder resist relief is provided at the periphery of a pad for a surface-mounted component, the printed wiring board having a locally widened region in the solder resist portion between the pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16953988U JPH0289879U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16953988U JPH0289879U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289879U true JPH0289879U (en) | 1990-07-17 |
Family
ID=31459694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16953988U Pending JPH0289879U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289879U (en) |
-
1988
- 1988-12-28 JP JP16953988U patent/JPH0289879U/ja active Pending