JPH0289880U - - Google Patents
Info
- Publication number
- JPH0289880U JPH0289880U JP16976588U JP16976588U JPH0289880U JP H0289880 U JPH0289880 U JP H0289880U JP 16976588 U JP16976588 U JP 16976588U JP 16976588 U JP16976588 U JP 16976588U JP H0289880 U JPH0289880 U JP H0289880U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base material
- circuit pattern
- insulating layer
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案実施例の断面構造を示す図、第
２図は本考案実施例の検査方法を説明する図、第
３図と第４図は従来例の検査方法を説明する図、
第５図は印刷多層配線板の断面構造を示す図であ
る。
１，２，３……銅箔、４……絶縁層、５……銅
ペースト層、６……基材。
FIG. 1 is a diagram showing the cross-sectional structure of the embodiment of the present invention, FIG. 2 is a diagram explaining the inspection method of the embodiment of the present invention, and FIGS. 3 and 4 are diagrams explaining the inspection method of the conventional example.
FIG. 5 is a diagram showing a cross-sectional structure of a printed multilayer wiring board. 1, 2, 3...Copper foil, 4...Insulating layer, 5...Copper paste layer, 6...Base material.
Claims (1)
、電磁シールドのための銅ペースト層からなる３
層構造を有する印刷多層配線板において、上記回
路パターンとは別に銅箔、絶縁層、銅ペースト層
の３層構造からなるテストクーポンが上記基材上
に形成されてなる印刷多層配線板。 3 consisting of copper foil to form a circuit pattern on the base material, an insulating layer, and a copper paste layer for electromagnetic shielding.
A printed multilayer wiring board having a layered structure, in which a test coupon having a three-layer structure of a copper foil, an insulating layer, and a copper paste layer is formed on the base material in addition to the circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16976588U JPH0289880U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16976588U JPH0289880U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289880U true JPH0289880U (en) | 1990-07-17 |
Family
ID=31460112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16976588U Pending JPH0289880U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289880U (en) |
-
1988
- 1988-12-28 JP JP16976588U patent/JPH0289880U/ja active Pending
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