JPH029435U - - Google Patents
Info
- Publication number
- JPH029435U JPH029435U JP1988087517U JP8751788U JPH029435U JP H029435 U JPH029435 U JP H029435U JP 1988087517 U JP1988087517 U JP 1988087517U JP 8751788 U JP8751788 U JP 8751788U JP H029435 U JPH029435 U JP H029435U
- Authority
- JP
- Japan
- Prior art keywords
- bonding stage
- lead
- bonding
- tab tape
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案に係るリードボンダの一実施例
を示すボンデイングステージと研磨テーブルの斜
視図、第２図はＴＡＢテープ及び半導体ペレツト
を示す斜視図、第３図はリードボンダの従来例を
示す正面図、第４図は第３図のリードボンダのテ
ープガイドを示す平面図、第５図は第３図のリー
ドボンダに含まれる熱圧着用ヒータブロツクの斜
視図、第６図は第３図のリードボンダの要部斜視
図、第７図は第３図のリードボンダによるＴＡＢ
テープへの半導体ペレツトの接続動作を示す拡大
正面図、第８図は第５図のヒータブロツクの研磨
作業を示す正面図である。
１９……ボンデイングステージ、２０，２１，
２２……研磨テーブル、２３，２４，２５……研
磨テープ。
Fig. 1 is a perspective view of a bonding stage and polishing table showing an embodiment of the lead bonder according to the present invention, Fig. 2 is a perspective view showing a TAB tape and semiconductor pellets, and Fig. 3 is a front view showing a conventional example of the lead bonder. , Fig. 4 is a plan view showing the tape guide of the lead bonder of Fig. 3, Fig. 5 is a perspective view of a heater block for thermocompression included in the lead bonder of Fig. 3, and Fig. 6 shows the main components of the lead bonder of Fig. 3. Part perspective view, Figure 7 is TAB using the lead bonder in Figure 3.
FIG. 8 is an enlarged front view showing the operation of connecting the semiconductor pellet to the tape, and FIG. 8 is a front view showing the polishing operation of the heater block of FIG. 19...Bonding stage, 20, 21,
22... Polishing table, 23, 24, 25... Polishing tape.
Claims (1)
ペレツトマウント用ボンデイングステージと、上
記経路の上方にボンデイングステージに対向して
配され、半導体ペレツトのバンプ電極に重合した
ＴＡＢテープのリードを加圧して熱圧着するヒー
タブロツクとを具備したものにおいて、 上記ボンデイングステージ近傍に、上端面に研
磨面を有する研磨テーブルを配設したことを特徴
とするリードボンダ。[Claims for Utility Model Registration] A bonding stage for pellet mounting disposed below the path along which the TAB tape moves, and a bonding stage disposed above the said path facing the bonding stage for polymerizing the bump electrode of the semiconductor pellet. 1. A lead bonder comprising a heater block for pressurizing and thermocompression bonding a lead of a TAB tape, characterized in that a polishing table having a polishing surface on an upper end surface is disposed near the bonding stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087517U JPH029435U (en) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988087517U JPH029435U (en) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029435U true JPH029435U (en) | 1990-01-22 |
Family
ID=31312122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988087517U Pending JPH029435U (en) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029435U (en) |
-
1988
- 1988-06-30 JP JP1988087517U patent/JPH029435U/ja active Pending
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