JPH029475U - - Google Patents

Info

Publication number
JPH029475U
JPH029475U JP8794988U JP8794988U JPH029475U JP H029475 U JPH029475 U JP H029475U JP 8794988 U JP8794988 U JP 8794988U JP 8794988 U JP8794988 U JP 8794988U JP H029475 U JPH029475 U JP H029475U
Authority
JP
Japan
Prior art keywords
circuit element
board
mounting structure
lead frame
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8794988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8794988U priority Critical patent/JPH029475U/ja
Publication of JPH029475U publication Critical patent/JPH029475U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案のＩＣ回路素子の実装構造を示
す斜視図、第２図は本考案の応用例を示す情報カ
ードのプリント平面図、第３図は従来のＩＣ回路
素子の実装構造を示す側面図である。 図中、１０はＩＣ回路素子、１０Ａはリードフ
レーム、２０は基板、２０Ａは凹部、３０は導電
性接着剤による配線パターンを示す。 Fig. 1 is a perspective view showing the mounting structure of the IC circuit element of the present invention, Fig. 2 is a printed plan view of an information card showing an application example of the invention, and Fig. 3 shows the mounting structure of the conventional IC circuit element. FIG. In the figure, 10 is an IC circuit element, 10A is a lead frame, 20 is a substrate, 20A is a recess, and 30 is a wiring pattern made of conductive adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラツトタイプのＩＣ回路素子を基板上に埋設
し、前記基板に配線パターンをプリントする際に
塗布される導電性接着剤によつて前記ＩＣ回路素
子のリードフレームが前記基板上に固定されてい
ることを特徴とするＩＣ回路素子の実装構造。 A flat type IC circuit element is buried on a board, and a lead frame of the IC circuit element is fixed to the board by a conductive adhesive applied when a wiring pattern is printed on the board. Characteristic IC circuit element mounting structure.
JP8794988U 1988-07-04 1988-07-04 Pending JPH029475U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8794988U JPH029475U (en) 1988-07-04 1988-07-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8794988U JPH029475U (en) 1988-07-04 1988-07-04

Publications (1)

Publication Number Publication Date
JPH029475U true JPH029475U (en) 1990-01-22

Family

ID=31312536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8794988U Pending JPH029475U (en) 1988-07-04 1988-07-04

Country Status (1)

Country Link
JP (1) JPH029475U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5957495A (en) * 1982-09-27 1984-04-03 シャープ株式会社 Printed circuit board
JPS628283A (en) * 1985-07-04 1987-01-16 Matsushita Electric Ind Co Ltd Information card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5957495A (en) * 1982-09-27 1984-04-03 シャープ株式会社 Printed circuit board
JPS628283A (en) * 1985-07-04 1987-01-16 Matsushita Electric Ind Co Ltd Information card

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