JPH0295253U - - Google Patents
Info
- Publication number
- JPH0295253U JPH0295253U JP414889U JP414889U JPH0295253U JP H0295253 U JPH0295253 U JP H0295253U JP 414889 U JP414889 U JP 414889U JP 414889 U JP414889 U JP 414889U JP H0295253 U JPH0295253 U JP H0295253U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- mold
- molybdenum
- magnesium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体装置の平面図、第２図
は従来例、第３図はプレツシヤ・クツカ試験にお
ける不良率を示したグラフ。
１，１１…ペレツト、２，１２…リード、３…
金属メツキ、４，１４…ボンデイングワンヤー、
５，１５…モールド樹脂、６，１６…リードフレ
ームのアイランド部。
FIG. 1 is a plan view of the semiconductor device of the present invention, FIG. 2 is a conventional example, and FIG. 3 is a graph showing the failure rate in the pressure-cut test. 1,11...Pellet, 2,12...Reed, 3...
Metal plating, 4, 14...bonding one layer,
5, 15... Mold resin, 6, 16... Island portion of lead frame.
Claims (1)
てモールドで樹脂封止する半導体装置において樹
脂に覆われるインナーリードの表面部分にマグネ
シウム或いはモリブデンの薄膜を有することを特
徴とする半導体装置。 1. A semiconductor device in which a semiconductor pellet is mounted on a lead frame and sealed with resin using a mold, and the semiconductor device is characterized in that a thin film of magnesium or molybdenum is provided on a surface portion of an inner lead covered with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP414889U JPH0295253U (en) | 1989-01-17 | 1989-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP414889U JPH0295253U (en) | 1989-01-17 | 1989-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0295253U true JPH0295253U (en) | 1990-07-30 |
Family
ID=31206402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP414889U Pending JPH0295253U (en) | 1989-01-17 | 1989-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0295253U (en) |
-
1989
- 1989-01-17 JP JP414889U patent/JPH0295253U/ja active Pending