JPH0295276U - - Google Patents
Info
- Publication number
- JPH0295276U JPH0295276U JP408989U JP408989U JPH0295276U JP H0295276 U JPH0295276 U JP H0295276U JP 408989 U JP408989 U JP 408989U JP 408989 U JP408989 U JP 408989U JP H0295276 U JPH0295276 U JP H0295276U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- integrated circuit
- hybrid integrated
- caps
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案による混成集積回路の構造の一
実施例を実装状態で示す正面図、第２図はその側
面図、第３図は該実施例の混成集積回路およびキ
ヤツプの分解斜視図、第４図および第５図はそれ
ぞれ本考案の混成集積回路の収容具の例を示す部
分側面図および部分斜視図、第６図は該実施例の
混成集積回路の真空吸引式ホルダによる保持状態
を示す正面図である。
１：混成集積回路、２：キヤツプ、３：取付け
基板、４：混成集積回路基板、５：電子部品、６
：リード端子、６ａ：脚部、７：係止爪、８：ス
トツパ、９：導体パターン、１０：半田、１１，
１４：収容具、１３：真空吸引式ホルダ。
FIG. 1 is a front view showing an embodiment of the structure of a hybrid integrated circuit according to the present invention in a mounted state, FIG. 2 is a side view thereof, and FIG. 3 is an exploded perspective view of the hybrid integrated circuit and cap of the embodiment. 4 and 5 are a partial side view and a partial perspective view, respectively, showing an example of a housing for a hybrid integrated circuit according to the present invention, and FIG. 6 shows a state in which the hybrid integrated circuit according to the embodiment is held by a vacuum suction type holder. FIG. 1: Hybrid integrated circuit, 2: Cap, 3: Mounting board, 4: Hybrid integrated circuit board, 5: Electronic components, 6
: Lead terminal, 6a: Leg, 7: Locking claw, 8: Stopper, 9: Conductor pattern, 10: Solder, 11,
14: Container, 13: Vacuum suction type holder.
Claims (1)
成集積回路基板に設けると共に、表面を平面に形
成したキヤツプを前記基板に取付けたことを特徴
とする混成集積回路の構造。 ２ 請求項１において、前記基板が長方形をなし
、その長辺に前記リード端子を設け、一方、前記
キヤツプを前記基板とほぼ同サイズに形成し、前
記キヤツプの各長辺の両端に形成した係止爪を基
板の長辺の両端部に係止させ、キヤツプの短辺に
形成したストツパを基板の短辺部上面に当接させ
たことを特徴とする混成集積回路の構造。[Claims for Utility Model Registration] 1. A hybrid integrated circuit characterized in that a surface mount type lead terminal having horizontal legs is provided on a hybrid integrated circuit board, and a cap with a flat surface is attached to the board. structure. 2. In claim 1, the substrate is rectangular, and the lead terminals are provided on the long sides thereof, and the caps are formed to have approximately the same size as the substrate, and the caps are formed at both ends of each long side of the caps. A structure of a hybrid integrated circuit characterized in that retaining claws are engaged with both ends of the long sides of the substrate, and stoppers formed on the short sides of the cap are brought into contact with the upper surface of the short sides of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989004089U JPH079415Y2 (en) | 1989-01-18 | 1989-01-18 | Hybrid integrated circuit component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989004089U JPH079415Y2 (en) | 1989-01-18 | 1989-01-18 | Hybrid integrated circuit component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0295276U true JPH0295276U (en) | 1990-07-30 |
| JPH079415Y2 JPH079415Y2 (en) | 1995-03-06 |
Family
ID=31507853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989004089U Expired - Lifetime JPH079415Y2 (en) | 1989-01-18 | 1989-01-18 | Hybrid integrated circuit component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079415Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298271U (en) * | 1985-12-10 | 1987-06-23 | ||
| JPS62128674U (en) * | 1986-02-06 | 1987-08-14 | ||
| JPS6398191A (en) * | 1986-10-15 | 1988-04-28 | 松下電工株式会社 | Circuit sealing structure of printed board |
-
1989
- 1989-01-18 JP JP1989004089U patent/JPH079415Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298271U (en) * | 1985-12-10 | 1987-06-23 | ||
| JPS62128674U (en) * | 1986-02-06 | 1987-08-14 | ||
| JPS6398191A (en) * | 1986-10-15 | 1988-04-28 | 松下電工株式会社 | Circuit sealing structure of printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH079415Y2 (en) | 1995-03-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |