JPH03101558U - - Google Patents

Info

Publication number
JPH03101558U
JPH03101558U JP1990009223U JP922390U JPH03101558U JP H03101558 U JPH03101558 U JP H03101558U JP 1990009223 U JP1990009223 U JP 1990009223U JP 922390 U JP922390 U JP 922390U JP H03101558 U JPH03101558 U JP H03101558U
Authority
JP
Japan
Prior art keywords
pressure
transmission hole
airtight terminal
element part
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990009223U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990009223U priority Critical patent/JPH03101558U/ja
Publication of JPH03101558U publication Critical patent/JPH03101558U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads

Landscapes

  • Pressure Sensors (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第1図乃至第6図は本考案の実施例を説明する
ためのもので、第1図は第1の実施例の気密端子
の断面図、第2図は第1図の気密端子における金
属外環の要部の拡大平面図、第3図は第1図の気
密端子における金属外環のメツキ処理後の部分拡
大断面図、第4図は第2の実施例の気密端子の断
面図、第5図は第3の実施例の気密端子の部分断
面図、第6図は第4の実施例の気密端子の部分断
面図である。第7図は従来の圧力センサ用気密端
子の断面図、第8図は第7図の気密端子の平面図
である。 20……金属外環、21……圧力伝達穴、22
……凹凸面、23,23′……圧力素子部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 内外の圧力差に感応する圧力素子部で塞がれる
    圧力伝達穴を有する金属外環の、前記圧力素子部
    が固定される圧力伝達穴の周辺部を凹凸面に形成
    したことを特徴とする圧力センサ用気密端子。
JP1990009223U 1990-01-31 1990-01-31 Pending JPH03101558U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990009223U JPH03101558U (ja) 1990-01-31 1990-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990009223U JPH03101558U (ja) 1990-01-31 1990-01-31

Publications (1)

Publication Number Publication Date
JPH03101558U true JPH03101558U (ja) 1991-10-23

Family

ID=31512827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990009223U Pending JPH03101558U (ja) 1990-01-31 1990-01-31

Country Status (1)

Country Link
JP (1) JPH03101558U (ja)

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