JPH03102735U - - Google Patents
Info
- Publication number
- JPH03102735U JPH03102735U JP1262390U JP1262390U JPH03102735U JP H03102735 U JPH03102735 U JP H03102735U JP 1262390 U JP1262390 U JP 1262390U JP 1262390 U JP1262390 U JP 1262390U JP H03102735 U JPH03102735 U JP H03102735U
- Authority
- JP
- Japan
- Prior art keywords
- package
- terminals
- bias supply
- pedestal
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011156 evaluation Methods 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案によるＩＣパツケージの特性評
価治具の１実施例の平面図、第２図は同実施例の
側面図、第３図はＩＣパツケージの平面図、第４
図はＩＣパツケージの側面図、第５図は従来のＩ
Ｃパツケージの特性評価治具の平面図、第６図は
従来のＩＣパツケージの特性評価治具の側面図で
ある。
１……台座、２……導体板（保持部）、３……
バイアス供給用ピン、５……コネクタ、７……Ｉ
Ｃパツケージ、２５……高周波入出力端子、２６
……バイアス供給用端子。
FIG. 1 is a plan view of an embodiment of the IC package characteristic evaluation jig according to the present invention, FIG. 2 is a side view of the same embodiment, FIG. 3 is a plan view of the IC package, and FIG.
The figure is a side view of the IC package, and Figure 5 is the conventional I
FIG. 6 is a plan view of a C package characteristic evaluation jig, and FIG. 6 is a side view of a conventional IC package characteristic evaluation jig. 1...Pedestal, 2...Conductor plate (holding part), 3...
Bias supply pin, 5...connector, 7...I
C package, 25...High frequency input/output terminal, 26
...Bias supply terminal.
Claims (1)
とバイアス供給用端子とを有するＩＣパツケージ
の特性を測定するための治具であつて、 上記各端子が上方を向いた状態で上記ＩＣパツ
ケージを支持する台座と、上記各端子が位置する
縁部の両側にそれぞれ設けられた保持部と、上記
入出力端子に接触する状態に上記保持部を貫通し
て設けられたコネクタと、上記バイアス供給端子
にその上面側から接触する状態に上記保持部に設
けられたバイアス供給用ピンとを、具備するＩＣ
パツケージの特性評価治具。[Claims for Utility Model Registration] A jig for measuring the characteristics of an IC package, which has input/output signal terminals and bias supply terminals on both edges of the top surface of the package, wherein each of the above-mentioned terminals faces upwardly. a pedestal that supports the IC package in a facing state; a holder provided on both sides of the edge where each of the terminals is located; and a pedestal provided through the holder in contact with the input/output terminal. and a bias supply pin provided on the holding portion so as to be in contact with the bias supply terminal from the upper surface side.
Package characteristic evaluation jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1262390U JPH03102735U (en) | 1990-02-08 | 1990-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1262390U JPH03102735U (en) | 1990-02-08 | 1990-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102735U true JPH03102735U (en) | 1991-10-25 |
Family
ID=31516091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1262390U Pending JPH03102735U (en) | 1990-02-08 | 1990-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102735U (en) |
-
1990
- 1990-02-08 JP JP1262390U patent/JPH03102735U/ja active Pending
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