JPH03102754U - - Google Patents
Info
- Publication number
- JPH03102754U JPH03102754U JP1080290U JP1080290U JPH03102754U JP H03102754 U JPH03102754 U JP H03102754U JP 1080290 U JP1080290 U JP 1080290U JP 1080290 U JP1080290 U JP 1080290U JP H03102754 U JPH03102754 U JP H03102754U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- metal foil
- laminated
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係るフレキシブル回路基板の
第１実施例を示す断面図、第２図は本考案に係る
フレキシブル回路基板の第２実施例を示す断面図
である。 １，１′……金属箔、２，５，６……絶縁層、
３，４……導体層、７……剥離剤。
第１実施例を示す断面図、第２図は本考案に係る
フレキシブル回路基板の第２実施例を示す断面図
である。 １，１′……金属箔、２，５，６……絶縁層、
３，４……導体層、７……剥離剤。
Claims (1)
- 金属箔の表面に、弾性を有する絶縁層と導体層
とを積層して印刷形成したことを特徴とするフレ
キシブル回路基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080290U JPH03102754U (ja) | 1990-02-06 | 1990-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080290U JPH03102754U (ja) | 1990-02-06 | 1990-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102754U true JPH03102754U (ja) | 1991-10-25 |
Family
ID=31514356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1080290U Pending JPH03102754U (ja) | 1990-02-06 | 1990-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102754U (ja) |
-
1990
- 1990-02-06 JP JP1080290U patent/JPH03102754U/ja active Pending