JPH03102765U - - Google Patents
Info
- Publication number
- JPH03102765U JPH03102765U JP1154890U JP1154890U JPH03102765U JP H03102765 U JPH03102765 U JP H03102765U JP 1154890 U JP1154890 U JP 1154890U JP 1154890 U JP1154890 U JP 1154890U JP H03102765 U JPH03102765 U JP H03102765U
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- mounting
- land
- copper foil
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例のフラツトパツケー
ジを実装する部品面のパターン図、第２図は第１
図のパターンにフラツトパツケージを実装した断
面図、第３図はランドを設けなかつた時のフラツ
トパツケージを取り外そうとして銅箔がはがれた
断面図、第４図はフラツトパツケージの形状を示
す図である。
１……フラツトパツケージ用銅箔、２……ラン
ド、３……パターン、４……フラツトパツケージ
、５……キバン。
Figure 1 is a pattern diagram of a component surface for mounting a flat package according to an embodiment of the present invention.
Figure 3 is a cross-sectional view of a flat package mounted on the pattern shown in the figure, Figure 3 is a cross-sectional view of the copper foil peeled off when attempting to remove the flat package without a land, Figure 4 shows the shape of the flat package. FIG. 1...Copper foil for flat package, 2...Land, 3...Pattern, 4...Flat package, 5...Kiban.
Claims (1)
において、このキバンの銅箔にランドを設けたこ
とを特徴とする面付ＩＣ実装パターン。 A surface-mounted IC mounting pattern for mounting a surface-mounted IC flat package, characterized in that a land is provided on the copper foil of the surface-mounted IC flat package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1154890U JPH03102765U (en) | 1990-02-09 | 1990-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1154890U JPH03102765U (en) | 1990-02-09 | 1990-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102765U true JPH03102765U (en) | 1991-10-25 |
Family
ID=31515071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1154890U Pending JPH03102765U (en) | 1990-02-09 | 1990-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102765U (en) |
-
1990
- 1990-02-09 JP JP1154890U patent/JPH03102765U/ja active Pending