JPH03102795U - - Google Patents
Info
- Publication number
- JPH03102795U JPH03102795U JP1161190U JP1161190U JPH03102795U JP H03102795 U JPH03102795 U JP H03102795U JP 1161190 U JP1161190 U JP 1161190U JP 1161190 U JP1161190 U JP 1161190U JP H03102795 U JPH03102795 U JP H03102795U
- Authority
- JP
- Japan
- Prior art keywords
- container
- input
- semiconductor package
- metallized
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000696 magnetic material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000035699 permeability Effects 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Waveguides (AREA)
Description
第１図は本考案パツケージを構成する各構成要
素の分解斜視図である。
１……誘電体基板、４……メタライズドパター
ン、１１……接触部位、３１，３２……リードピ
ン、２０……環状壁ブロツク、２１……メタライ
ズド層、５１，５２……磁性体層、６……上蓋。
FIG. 1 is an exploded perspective view of each component constituting the package of the present invention. DESCRIPTION OF SYMBOLS 1... Dielectric substrate, 4... Metallized pattern, 11... Contact portion, 31, 32... Lead pin, 20... Annular wall block, 21... Metallized layer, 51, 52... Magnetic layer, 6... ...Top lid.
Claims (1)
ロツクを固定して容器を構成するとともに、上記
容器内に半導体素子が封入固定され、上記容器内
から外方へ引出された信号伝送のためのメタライ
ズドパターンを入、出力導体として備えるマイク
ロ波半導体パツケージにおいて、上記入、出力導
体上にあつて上記容器壁底面との接触部位に、上
記メタライズドパターン材料に対して大きい透磁
率の磁性体よりなる薄層を介在せしめてなること
を特徴とするマイクロ波半導体パツケージ。 A container is constructed by fixing a dielectric substrate and an annular block made of dielectric to the upper surface thereof, a semiconductor element is sealed and fixed in the container, and a metallized substrate for signal transmission is drawn out from inside the container. In a microwave semiconductor package having a pattern as an input and output conductor, a thin layer made of a magnetic material having a large magnetic permeability with respect to the metallized pattern material is provided on the input and output conductors at a contact portion with the bottom surface of the container wall. A microwave semiconductor package characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1161190U JPH03102795U (en) | 1990-02-08 | 1990-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1161190U JPH03102795U (en) | 1990-02-08 | 1990-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102795U true JPH03102795U (en) | 1991-10-25 |
Family
ID=31515133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1161190U Pending JPH03102795U (en) | 1990-02-08 | 1990-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102795U (en) |
-
1990
- 1990-02-08 JP JP1161190U patent/JPH03102795U/ja active Pending
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